• Proceedings of the Korea Crystallographic Association Conference
• /
• 2005.11a
• /
• pp.21-21
• /
• 2005

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2006.09b
• /
• pp.1091-1092
• /
• 2006

Silicon nitride - silicon carbide composite was developed by using an abrasive SiC powders as a raw material. The composites were prepared by mixing abrasive SiC powder with silicon, pressing and sintering at $1400^{\circ}C$ under nitrogen atmosphere in atmosphere controlled vacuum furnace. The proportion of silicon in the initial mixtures varied from 20 to 50 wt%. After sintering, crystalline phases and microstructure were characterized. All composites consisted of ${\alpha}-Si_3N_4$ and ${\beta}-Si_3N_4$ as the bonding phases in SiC matrix. Their physical and mechanical properties were also determined. It was found that the density of the obtained composites increased with an increase in the $Si_3N_4$ content formed in the reaction.

• Journal of Industrial Technology
• /
• v.6
• /
• pp.13-17
• /
• 1986

The effect of supersaturation on morphology of silicon carbide by chemical vapor deposition using $CH_3SiCl_3-H_2$ gas mixture system was investigated. The experimental results show that the final structure of silicon carbide deposits is coarser as total pressure increases or ${\alpha}$-ratio decreases. It is believed because supersataration of Si-source decreases as total pressure increases or ${\alpha}$-ratio decreases.

• Journal of the Korean Ceramic Society
• /
• v.28 no.6
• /
• pp.429-436
• /
• 1991

Silicon carbide has been grown by a chemical vapor deposition (CVD) technique using CH3SiCl3 and H2 gaseous mixture onto a graphite substrate. Based on the thermodynamic equilibrium studies and the suggestion that the deposition rate of SiC is controlled by surface reaction theoretical kinetic equation for CVD of silicon carbide has been proposed. The proposed theoretical kinetic equation for CVD of silicon carbide agreed well with the experimental results for the variation of the deposition rate as a function of the partial pressure of reactant gases. The Vikers microhardness of the SiC layer was about 3000∼3400 kg/$\textrm{mm}^2$ at room temperature.

• Journal of Photoscience
• /
• v.12 no.3
• /
• pp.171-174
• /
• 2005

The relationship between porous surfaces and photoluminescence (PL) behavior of porous silicon carbide (PSC) in various solvents has been studied. The porous surfaces of p-type silicon carbide can be fabricated by electrochemical anodization from the 6H, 15R, 4H-${\alpha}$-SiC substrates in dark-current mode (DCM) condition. We have been investigated the dependence of the PL spectra of PSC under the medium having the different dielectric constants. It has been found that PL depends sensitively on the environment surrounding the surface. The extent of chemically stability on the surface of PSC due to the various solvents was confirmed by reflectance Fourier transform infrared (FTIR) spectroscopy. Detailed IR experiments on the PSC samples were carried out before and after various solvents immersion. These results will be offered important information on the origin of PL in porous structure.

• Proceedings of the Korean Ceranic Society Conference
• /
• 2002.10a
• /
• pp.131.1-131
• /
• 2002

• Journal of the Semiconductor & Display Technology
• /
• v.19 no.4
• /
• pp.28-33
• /
• 2020

Plasma etching process employs high density plasma to create surface chemistry and physical reactions, by which to remove material. Plasma chamber includes silicon-based materials such as a focus ring and gas distribution plate. Focus ring needs to be replaced after a short period. For this reason, there is a need to find materials resistant to erosion by plasma. The developed chemical vapor deposition processing to produce silicon carbide parts with high purity has also supported its widespread use in the plasma etch process. Silicon carbide maintains mechanical strength at high temperature, it have been use to chamber parts for plasma. Recently, besides the structural aspects of silicon carbide, its electrical conductivity and possibly its enhanced life time under high density plasma with less generation of contamination particles are drawing attention for use in applications such as upper electrode or focus rings, which have been made of silicon for a long time. However, especially for high purity silicon carbide focus ring, which has usually been made by the chemical vapor deposition method, there has been no study about quality improvement. The goal of this study is to reduce surface roughness and depth of damage by diamond tool grit size and tool dressing of diamond tools for precise dimensional assurance of focus rings.

• Journal of the Korean Ceramic Society
• /
• v.49 no.6
• /
• pp.561-565
• /
• 2012

Due to their unique combination of properties, Si-based ceramics, such as silicon carbide (SiC), silicon nitride ($Si_3N_4$) and silicon oxide ($SiO_2$ as fused silica), have a range of industrial applications in fields such as the chemical industry, aluminum manufacturing, oil and gas production and solar cell production. For each materials group, examples of typical applications from various industry sectors are presented while taking into account the property fingerprint.

• Journal of the Korean Ceramic Society
• /
• v.35 no.5
• /
• pp.486-492
• /
• 1998

Silicon carbide (SiC) thin films were deposited on the porous silicon substrates by chemical vapour de-position(CVD) using MTS as a source material. The deposited films were ${\beta}$-SiC with poor crystallity con-firmed by XRD measurement. It was considered that the films showed the mixed characteistics of cry-stalline and amorphous SiC where amorphous SiC where amorphous SiC played a role of buffer layer in interface between as-dep films and Si substrate. The buffer layer reduced lattice mismatch to some extent the generally occurs when SiC films are deposited on Si. The low temperature (10K) PL (phtoluminescence) studies showed two broad bands with peaks at 600 and 720 for the films deposited at 1100$^{\circ}C$ The maximum PL peak of the crystalline SiC was observed at 600 nm and the amrophous SiC of 720 nm was also confirmed. PL peak due the amorphous SiC was smaller than that of the crystalline SiC, PL of porous Si might be disapperared due to densification during heat treatment.

• Textile Coloration and Finishing
• /
• v.33 no.4
• /
• pp.309-316
• /
• 2021

Due to the rigid nature of the silicon carbide fiber(SiC), fiber damage occurs from the friction during the carding process. This damage not only lowers the spun yarn yield, but also lowers the heat resistance of the spun yarn, so that ultra-high heat resistant yarn cannot be manufactured. Therefore, in the carding process where the most friction between fiber and machine(wire, etc.) occurs, some factors were modified and tested, and as a result of measuring the change in physical properties, fiber damage decreased due to the wire angle or wire density, resulting in improved yield. The test method used to measure the yield of SiC fiber was the carbonization method, and the content of SiC fibers was calculated using the remaining amount after carbonization. Carbonization test was performed at air condition, 700℃, and for 2 hours. Analysis by SEM-EDX showed that the carbide was consistent with the composition of the SiC fiber.