• 제목/요약/키워드: shoes heel and toe

검색결과 22건 처리시간 0.017초

눈금 블록과 분할정복 기법을 이용한 신발 밑창 자동 검사 시스템 (An Automated Outsole Inspection System Using Scale Block and Divide-and-Conquer Technique)

  • 김도현;강동구;차의영
    • 제어로봇시스템학회논문지
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    • 제8권8호
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    • pp.625-632
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    • 2002
  • We propose an outsole measurement/inspection system to improve the quality of the shoe product. It uses the Divide-and-Conquer technique to measure the length of shoes'outsole. First, it detects edge positions of outsole's toe and heel from each image frame using an unique scale block we defined and calculates the outsole's length as the distance of two edge positions. Then it compensates the total length of outsole using the side image of outsole. Next, it classifies the outsole as inferior goods if the measurement error is bigger than 5.8mm. As a result of testing with the various kinds of outsoles, it was shown that the 95% accuracy was acquired within 1mm allowable error range. In conclusion, the proposed inspection system is effective and useful in the measurement/inspection process of shoe product and any material object as well.

키높이 인솔두께에 따른 족부의 생체역학적 특성변화에 대한 연구 (A Study on Changes in Biomechanical Characteristics of the Foot with Respect to Wedge-type Insole Thickness)

  • 박태현;정태곤;한동욱;이성재
    • 대한의용생체공학회:의공학회지
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    • 제34권2호
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    • pp.80-90
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    • 2013
  • Recently, functional insoles of wedge-type it is for the young to raise their height inserted between insole and heel cause foot pain and disease. Additionally, these have a problem with stability and excessively load-bearing during gait like high-heel shoes. In this study, we compared the changes in biomechanical characteristics of foot with different insole thickness then we will utilize for the development of the insole with the purpose of relieving the pain and disease. Subjects(male, n = 6) measured COP(center of pressure) and PCP(peak contact pressure) on the treadmill(140cm/s) using F-scan system and different insole thickness(0~50 mm) between sole and plantar surface during gait. Also, we computed changes of stresses at the foot using finite element model with various insole thickness during toe-off phase. COP moved anterior and medial direction and, PCP was increased at medial forefoot surface, $1^{st}$ and $2^{nd}$ metatarsophalangeal, ($9%{\uparrow}$) with thicker insoles and it was show sensitive increment as the insole thickness was increased from 40 mm to 50 mm. Change of the stress at the soft-tissue of plantar surface, $1^{st}$ metatarsal head represents rapid growth($36%{\uparrow}$). Also, lateral moments were increased over the 100% near the $1^{st}$ metatarsal as the insole thickness was increased from 0 mm to 30 mm. And it is show sensitive increment as the insole thickness changed 10 mm to 20 mm. As a result, it was expected that use of excessively thick insoles might cause unwanted foot pain at the forefoot region. Therefore, insole thickness under 30 mm was selected.