• 제목/요약/키워드: shear-welding

검색결과 395건 처리시간 0.026초

볼트 체결형 강판-콘크리트 합성보의 형상 제안 (The suggestion of Steel Plate-Concrete Composite Beam Shape with Bolts)

  • 조태구;최병정
    • 한국산학기술학회논문지
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    • 제19권7호
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    • pp.305-314
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    • 2018
  • 강판 콘크리트 합성보는 강판, 콘크리트 및 2가지의 이질 재료를 결합시키는 전단 연결재로 구성되어 있다. 일반적으로 강판은 기존의 합성보에 용접하여 조립된다. 본 연구에서는 전단 연결재를 감소시키고, 작업성을 향상시키기 위해 SPC(Steel Plate Concrete Composite Beam) 보라 불리는 새로운 강판 콘크리트 합성보를 개발했다. SPC 보는 전단 연결재 없이 절곡된 강판과 콘크리트로 구성된다. 절곡된 강판은 용접 대신 고강도 볼트로 조립된다. 또한, 건설 현장에서 작업성을 향상시키기 위해 슬래브와 접합부에 모자 모양의 Cap이 부착된다. 변위 제어 모드에서 2점 가력 실험을 수행하였고, 시편의 휨강도를 계산하기 위해 소성 응력 분포법과 변형률 적합법을 사용하였다. 시험 결과에 따르면 새로운 SPC 보의 휨 강도는 완전 합성보 강도의 76 %의 값이 나왔다. Cap은 스터드와 부속 철물의 역할을 수행한다. 또한, Cap의 간격 제어를 통해 합성율의 증가가 가능하고, SPC 합성보의 합성율을 고려할 경우 변형률 적합법을 통해 SPC 합성보의 휨 성능 평가가 가능하다.

절곡 강판을 볼트로 체결한 강판-콘크리트 합성보의 휨강도 평가 (Flexural Strength Evaluation of Steel Plate-Concrete Composite Beam using Bolted)

  • 한명환;최병정
    • 한국산학기술학회논문지
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    • 제19권6호
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    • pp.126-136
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    • 2018
  • 강판 콘크리트 합성보는 2개의 이질 재료를 결합하기 위해 강판, 콘크리트 및 전단 연결재로 구성된다. 일반적으로 강판은 기존의 합성보에 용접하여 조립된다. 본 연구에서는 전단 강도를 줄이고 작업성을 향상시키기 위해 SPC Beam이라 불리는 새로운 강판 콘크리트 합성 보(Beam)를 개발했다. SPC 보는 전단 연결재 없이 절곡된 강판과 콘크리트로 구성된다. 절곡된 강판은 용접 대신 고강도 볼트로 조립된다. 현장 건설의 작업성을 향상시키기 위해 슬래브와 접합부에 모자 모양의 Cap이 부착되어 있다. 변위 제어 모드에서 2점 가력의 단조 하중 시험을 수행했다. 정모멘트와 부모멘트에 대한 시편의 굽힘강도는 소성 응력 분포법에 의해 계산되었다. 수행한 시험 결과에 따르면 새로운 SPC 보의 휨 강도는 완전 합성보의 강도의 80% 이다. Cap의 간격을 조절하여 합성율의 증가가 가능했다. 본 연구에서는 정 부모멘트 역에서의 대표 형상을 대상으로 하였기 때문에, 단면 형상과 Cap을 변수로 추가적인 실험과 해석을 통해 SPC Beam의 성능 검증이 수행될 것이다.

Sn-58Bi 솔더 페이스트와 ENIG 표면 처리된 기판 접합부의 계면 반응 및 접합강도 (Interfacial Reaction and Joint Strength of the Sn-58Bi Solder Paste with ENIG Surface Finished Substrate)

  • 신현필;안병욱;안지혁;이종근;김광석;김덕현;정승부
    • Journal of Welding and Joining
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    • 제30권5호
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    • pp.64-69
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    • 2012
  • Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

다구찌법을 이용한 IR 레이저 Flip-chip 접합공정 최적화 연구 (A Study on the Optimization of IR Laser Flip-chip Bonding Process Using Taguchi Methods)

  • 송춘삼;지현식;김주한;김종형;안효석
    • Journal of Welding and Joining
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    • 제26권3호
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    • pp.30-36
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    • 2008
  • A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

A2024-T6/ A6061-T6의 마찰용접 특성에 관한 연구 (A Study on the Properties in Friction Weldability of Dissimilar Aluminum Alloys A2024-T6/ A6061-T6)

  • 이세경;민택기
    • 한국공작기계학회논문집
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    • 제15권1호
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    • pp.63-69
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    • 2006
  • This study deals with the friction welding of A2024- T6 to A6061- T6; The friction time was variable conditions under the conditions of spindle revolution of 2000rpm, friction pressure of 50MPa, upset pressure of 100MPa, and upset time of 5.0seconds. Under these conditions, the microstructure of weld interface, tensile fracture surface and mechanical tests were studied, of friction weld, and so the results were as follows. 1. When the friction time was 1.5seconds under the conditions, the maximum tensile strength of the friction weld happened to be 292MPa, which is $94.2\%$ of the base material's tensile strength(310MPa). At the same condition, the maximum shear strength was 2l2MPa, which is equivalent to $103\%$ of the base material's shear strength (205MPa). 2. At the same condition, the maximum vickers hardness was Hv 146 at A2024- T6 nearby weld interface, which is higher Hv3 than condition of the friction time 0.5seconds, and the maximum vickers hardness was Hvl20 from weld interface of A6061-T6, which is higher Hv28 then base material's. 3. The results of microstructure analysis show that the structures of two base materials have fractionized and rearranged along a column due to heating and axial force during friction, which has affected in raising hardness and tensile strength.

자동차 전장용 무연솔더 및 솔더 접합부의 신뢰성 평가 (Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint)

  • 방정환;유동열;고용호;윤정원;이창우
    • Journal of Welding and Joining
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    • 제34권1호
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    • pp.26-34
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    • 2016
  • Automotive today has been transforming to an electronic product by adopting a lot of convenience and safety features, suggesting that joining materials and their mechanical reliabilities are getting more important. In this study, a Sn-Cu-Cr-Ca solder composition having a high melting temperature ($>230^{\circ}C$) was fabricated and its joint properties and reliability was investigated with an aim to evaluate the suitability as a joining material for electronics of engine room. Furthermore, mechanical properties change under complex environment were compared with several existing solder compositions. As a result of contact angle measurement, favorable spreadability of 84% was shown and the average shear strength manufactured with corresponding composition solder paste was $1.9kg/mm^2$. Also, thermo-mechanical reliability by thermal shock and vibration test was compared with that of the representative high temperature solder materials such as Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb. In order to fabricate the test module, solder balls were made in joints with ENIG-finished BGA and then the BGA chip was reflowed on the OPS-finished PCB pattern. During the environmental tests, resistance change was continuously monitored and the joint strength was examined after tests. Sn-3.5Ag alloy exhibited the biggest degradation rate in resistance and shear stress and Sn-0.7Cu resulted in a relatively stable reliability against thermo-mechanical stress coming from thermal shock and vibration.

Cu-Si 삽입금속을 이용한 DP강의 MIG 아크 브레이징 접합부의 미세조직과 기계적 성질 (Microstructure and Mechanical Properties of Gas Metal Arc Brazed Joint of DP Steel with Cu-Si Filler Metal)

  • 조욱제;윤태진;곽승윤;이재형;강정윤
    • Journal of Welding and Joining
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    • 제34권5호
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    • pp.70-76
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    • 2016
  • In this study, Microstructure and tensile properties in arc brazed joints of 1000MPa grade DP steel using Cu-Si insert metal were investigated. The fusion zone was composed of Cu phase which solidified a little Fe and Si. The former phase formed due to dilute the edge of base material by arc, although Fe was not solid solution in Cu at the room temperature. Cu3Si particles formed by crystallization at $1100^{\circ}C$ during faster cooling. After the tensile shear test, there are no differences between the brazed joint efficiencies. The maximum joint efficient was about 37% compared to strength of base metal. It is better than that of arc brazed joint of DP steel using Cu-Sn filler metal. Fracture position of all brazing conditions was in the fusion zone. Crack initiation occurred at three junction point which was a stress singularity point of upper sheet, lower sheet and the fusion zone. And then crack propagated across the fusion zone. The reason why the fracture occurred at fusion zone was that the hardness of fusion zone was lower than that of base material and heat affected zone. The correlation among maximum load and hardness of fusion zone and EST at fractured position was $R^2=0.9338$. Therefore, this means that hardness and EST can have great impact on maximum load.

자동차 전장모듈용 Sn-Cu-Cr(Ca) 중온 솔더의 접합특성 연구 (Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module)

  • 방정환;유동열;고용호;김정한;이창우
    • Journal of Welding and Joining
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    • 제31권5호
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    • pp.54-58
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    • 2013
  • Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

단부 철근콘크리트-중앙부 철골로 구성된 복합(複合)보의 거동(擧動)에 관한 실험적 연구 (An Experimental Study on the Behavior of Hybrid Beam Composed of End Reinforced Concrete-Center Steel)

  • 강병수;김성은;최현식
    • 한국강구조학회 논문집
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    • 제14권3호
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    • pp.413-421
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    • 2002
  • 본 연구에서는 반복 재하실험에 의해서 단부 철근콘크리트 중앙부 철골로 이루어진 복합보의 접합부 형상에 따른 역학적 거동을 파악하고자 한다. 실험결과와 종국내력식을 비교 검증하고 합성효과, 내진성능 및 응력전달의 유효성을 검토한다. 각 실험체의 유형은 주근용접형, 정착판 보강형, 시어코넥터 보강형, 시어코넥터형으로 한다. 그 결과 정착판 보강형과 시어코넥터 보강형은 내력 및 내진성능이 우수한 것으로 평가되었으며, 철근콘크리트와 철골 접합부분이 일체성을 확보하여 응력전달에 유리한 것으로 나타났다. 그러나 기존의 종국내력식은 실험결과와 다소 차이가 있는 것으로 나타나 보다 명확한 종국내력식이 요구되고 있다.

SPR 접합법을 이용한 Al-5052 인장-전단 시험편의 피로강도 (Fatigue Strength of Al-5052 Tensile-Shear Specimens using a SPR Joining Method)

  • 이만석;김택영;강세형;김호경
    • 한국안전학회지
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    • 제29권4호
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    • pp.9-14
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    • 2014
  • Self-piercing riveting(SPR) is a mechanical fastening technique which is put pressure on the rivet for joining the sheets. Unlike a spot welding, SPR joining does not make the harmful gas and $CO_2$ and needs less energy consumption. In this study, static and fatigue tests were conducted using tensile-shear specimens with Al-5052 plates for evaluation of fatigue strength of the SPR joints. During SPR joining process for the specimen, using the current sheet thickness and a rivet, the optimal applied punching force was found to be 21 kN. And, the maximum static strength of the specimen produced at the optimal punching force was 3430 N. During the fatigue tests for the specimens, interface failure mode occurred on the top substrate close to the rivet head in the most high-loading range region, but on the bottom substrate close to the rivet tail in the low -loading range region. There was a relationship between applied load amplitude $P_{amp}$ and lifetime of cycle N for the tensile-shear, $P_{amp}=3395.5{\times}N^{-0.078}$. Using the stress-strain curve of the Al-5052 from tensile test, the simulations for fatigue specimens have been carried out using the implicit finite element code ABAQUS. The relation between von-Mises equivalent stress amplitude and number of cycles was found to be ${\sigma}_{eq}=514.7{\times}N^{-0.033}$.