• 제목/요약/키워드: shear-welding

검색결과 395건 처리시간 0.022초

Sn-Ag-X계 무연솔더 접합부의 미세조직 및 전단강도에 관한 연구 (A Study on the Characteristics of Sn-Ag-X Solder Joint)

  • 김문일;문준권;정재필
    • Journal of Welding and Joining
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    • 제20권2호
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    • pp.77-81
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    • 2002
  • Many kinds of Pb-free solder have been investigated because of the environmental concerns. Sn-Ag-Cu system is well blown as most competitive Pb-free solder. However, since Sn-Ag-Cu system has relatively high melting point compared to Sn-Pb eutectic, it may a limitation, the some application. In this study, Bi and In contained solder of $Sn_3Ag_8Bi_5In$ which has relatively lower melting point, $188~204^{\circ}C$, was investigated. $Sn_3Ag_8Bi_5In$ solder ball of $500\mu\textrm{m}$ diameter was set on the Ni/Cu/Cr-UBM and reflow soldered in the range of $220~240^{\circ}C$ for 5~15s. The maximum shear strength of the solder ball was around 170mN by reflowing at $240^{\circ}C$ for 10s. Intermetallic compound formed on the UBM of Si-wafer was analysed by SEM(scanning electron microscope) and XRD(X-ray diffractometer).

솔더 포일을 이용한 무플럭스 솔더링에 관한 연구 (A Study on Fluxless Soldering using Solder Foil)

  • 신영의;김경섭
    • Journal of Welding and Joining
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    • 제16권5호
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    • pp.100-107
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    • 1998
  • This paper describes fluxless soldering of reflow soldering process using solder foil instead of solder pastes. There is an increasing demand for the reliable solder connection in the recent high density microelectronic components technologies. And also, it is problem fracture of an Ozone layer due to freon as which is used to removal of remained flux on the substrate. This paper discussed joining phenomena, boudability and joining processes of microelectronics devices, such as between outer lead of VLSI package and copper pad on a substrate without flux. The shear strength of joints is 8 to 13 N using Sn/Pb (63/37 wt.%) solder foil with optimum joining conditions, meanwhile, in case of using Sn/In (52/48 wt.%) solder foil, it is possible to bond with low heating temperature of 550 K, and accomplish to high bonding strength of 25N in condition heating temperature of 650K. Finally, this paper experimentally shows fluxless soldering using solder foil, and accomplishes key technology of microsoldering processes.

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2tmm AL-합금재의 겹침이음을 위한 교반용접의 실험적 연구 (An experiment of optimizing tools for Lap joint with 2tmm Aluminum alloy plate using FSW)

  • 장석기;이돈출;김상진;전정일
    • 한국마린엔지니어링학회:학술대회논문집
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    • 한국마린엔지니어링학회 2002년도 춘계학술대회논문집
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    • pp.153-160
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    • 2002
  • This paper shows the possibility of performing Lap joint using the friction stir welding and the determination of tool's dimensions for FSW in Milling machine. This research also is reported on obtaining the tensile-shear strength, 9.319 ( kgf/mm$^{2}$) and the energy absorption, 2,682 (kgf-mm) under this experiment. The optimal tool's dimensions and method for Lap joint in 2tmm aluminum alloy plate using FSW is as follows; The diameter of shoulder and pin are 9 $\phi$mm and 3$\phi$mm, the length of pin is 3.6mm. The conditions of shoulder of tool is not pressed into original base metal.

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전력반도체 패키징을 위한 Transient liquid phase 접합 기술 (Trasient Liquid Phase bonding for Power Semiconductor)

  • 노명훈;;정재필;김원중
    • 마이크로전자및패키징학회지
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    • 제24권1호
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    • pp.27-34
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    • 2017
  • Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

접합판재의 전단 변형거동에 관한 연구 (A Study on the Shear Deformation Behavior of Inner Structure-Bonded Sheet Metal)

  • 김지용;정완진;양동열;김종호
    • 소성∙가공
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    • 제14권3호
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    • pp.257-262
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    • 2005
  • In order to improve the quality of the sheared surface in cutting of inner structure bonded sheet metal the cut-off operation is mainly investigated, which is the typical shearing process in sheet metal forming technology. The sandwich sheet metals considered have inner structure which is constructed in the form of crimped expanded metal and woven metal. The inner structure is bonded between solid sheet by resistance welding or adhesive bonding. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface is measured and quantitatively compared with the help of the optical microscope after cut-off operation. From test results we found that the influence of sheared position can be observed and explained clearly and this result can be utilized to get the better sheared surface.

차체구조물에서 면내 굽힘모우멘트 및 과하중이 피로특성과 균열전파 거동에 미치는 영향에 관한 연구 (A Study on the Fatigue Characteristics and the Behavior of Crack Propagation by Overload and Bending Moment in Car Body Structure)

  • 성기찬;장경복;정진우;강성수
    • Journal of Welding and Joining
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    • 제19권6호
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    • pp.652-657
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    • 2001
  • To analyze and predict crack initiation position and propagation directions on the spot welded area are very important for strength design of the automobile body structure. It is necessary to test by method considering random loads with variable amplitude for strength design of vehicle body structure, because driving cars are actually subjected to random loads with variable amplitude in the road. Although this condition, nearly all tests haute been performed under constant load conditions in the laboratory because it is impossible to replay like an actual conditions. In this study, using in-plane bending type specimens, the overload factor affecting on the fatigue strength, crack initiation and propagation directions of spot-welded specimens have been studied.

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패키지 유형에 따른 솔더접합부의 열피로에 관한 연구 (A Study on the Thermal Fatigue of Solder Joint by Package Types)

  • 김경섭;신영의
    • Journal of Welding and Joining
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    • 제17권6호
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    • pp.78-83
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    • 1999
  • Solder joint is the weakest part which connects in mechanically and electronically between package body and PCB(Printed Circuit Board). Recently, the reliability of solder joint become the most critical issue in surface mounted technology. The solder joint interconnection between plastic package and PCB is susceptible to shear stress during thermal storage due to the mismatch in coefficient of thermal expansion between plastic package and PCB. A general computational approach to determine the effect of solder joint shape on the fatigue life presented. The thermal fatigue life was estimated from the engelmaier equation which was obtained from the temperature cycling loading($-65^{\circ}C$ to $150^{\circ}C$). As result of the simulation, TSOP structure has the shortest thermal fatigue life and the same structure Copper lead has 2.5 times as much fatigue life as Alloy 42 lead. In BGA structure, fatigue life time extended 80 times when underfill material exists.

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접합판재의 전단 변형거동에 관한 연구 (A Study on the Shear Deformation Behavior of Inner Structure-Bonded sheet metal)

  • 김지용;김종호;정완진;양동열
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2004년도 제3회 금형가공 심포지엄
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    • pp.33-38
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    • 2004
  • In order to improve the quality of the sheared surface in cutting of inner structure bonded sheet metal the cut-off operation is mainly investigated, which is the typical shearing process in sheet metal forming technology. The sandwich sheet metals considered have inner structure which is constructed in the form of crimped expanded metal and woven metal. The inner structure is bonded between solid sheet by resistance welding or adhesive bonding. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface is measured and quantitatively compared with the help of the optical microscope after cut-off operation. From test results we found that the influence of sheared position can be observed and explained clearly and this result can be utilized to get the better sheared surface.

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분리형 섕크를 갖는 SPR의 형상 설계를 위한 유한요소해석 (Finite Element Analysis for Design of Divided Shank of Self-Piercing Rivet)

  • 김관우;김동범;조해용
    • Journal of Welding and Joining
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    • 제34권2호
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    • pp.54-58
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    • 2016
  • SPR(Self-Piercing rivet) is mechanical element of joining sheet metal components without the need for pre-punched or pre-drilled holes. Newly designed SPR is developed for high joining strength and shearing strength than semi-tubular rivet. In this study, divided shank of self-piercing rivet were designed for joining DP440 and SILAFONT. Newly designed SPR was simulated by using FEM code DEFORM-3D. In simulations of SPR process, various shape of self-piercing rivet were considered for semi-tubular and newly designed SPR. In other to examine the joinability, joining load and lap-shear load of newly designed SPR were compared with semi-tubular by simulated results and experimental ones.

강합성 콘크리트 복공판의 내력시험에 관한 연구 (A Study on the Bearing Capacity of Steel Composite Concrete Lining Board)

  • 백신원;김용곤
    • 한국안전학회지
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    • 제27권6호
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    • pp.122-126
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    • 2012
  • Steel lining board usually is used as a floor on the temporary steel bridges. It also is installed in the subway construction site. However, in particular in subway construction, renovations and site of old bridges, these steel lining board structures have a problem such as noise, accidents and slip hazards. So steel composite lining board is being developed to solve this problem. Steel composite lining board consists of compressive concrete showing excellent performance in slip, durability, resistance and noise, lower tensile and shear steel showing high safety, effective and superior workability in many respects. Steel composite lining board structure gradually is used in many construction sites, because it has a high quality such as durability, little noise and slip. In this study, flexural tests of steel composite lining board in accordance with welding patterns were conducted to compare the performance of the structure.