• 대한전자공학회논문지SD
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• 제46권10호
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• pp.79-85
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• 2009

본 논문은 $0.18{\mu}m$ CMOS 공정을 이용하여 3.2 Gb/s serial link receiver를 설계하였다. High-speed links의 performance를 제한하는 가장 큰 요소는 transmission channel bandwidth, timing uncertainty가 있다. 이러한 문제점을 해결하기 위한 방법으로 multi-level signaling(4-PAM)을 이용하였다. 추가적으로 전송속도를 높이고 BER를 낮추기 위한 방법으로 current-mode amplifier, CML sampling latch를 사용하였다. 4-PAM receiver의 최대 데이터 전송속도는 3.2 Gb/s이다. BER은 $1.0{\times}10^{-12}$ 이하이며 chip size는 $0.5\;{\times}\;0.6\;mm^2$이고 1.8 V supply voltage에서 49mA current를 소모한다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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• pp.1185-1188
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• 2003

This paper describes a design for a 2.5Gb/s serial data link CMOS transceiver based on the InfiniBand$^{TM}$ specification. The transceiver chip integrates data serializer, line driver, Tx PLL, deserializer, clock recovery, and lock detector. The designed transceiver is fabricated in a 0.25 ${\mu}{\textrm}{m}$ CMOS mixed-signal, 1-poly, 5-metal process. The first version chip occupies a 3.0mm x 3.3mm area and consumes 450mW with 2.5V supply. In 2.5 Gbps, the output jitter of transmitter measured at the point over a 1.2m, 50Ω coaxial cable is 8.811ps(rms), 68ps(p-p). In the receiver, VCO jitter is 18.5ps(rms), 130ps(p-p), the recovered data are found equivalent to the transmitted data as expected. In the design for second version chip, the proposed clock and data recovery circuit using linear phase detector can reduce jitter in the VCO of PLL.L.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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• pp.791-794
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• 2003

The increasing computational capability of processors is driving the need for high bandwidth links to communicate and store the information that is processed. Such links are often an important part of multi processor interconnection, processor-to-memory interfaces and Serial-network interfaces. This paper describes a 0.11-${\mu}{\textrm}{m}$ CMOS 4 Gbp s/pin 3-Level transceiver using RSL/(Rambus Signaling Logic) for high bandwidth. This system which uses a high-gain windowed integrating receiver with wide common-mode range which was designed in order to improve SNR when operating with the smaller input overdrive of 3-Level. For multi-gigabit/second application, the data rate is limited by Inter-Symbol Interference (ISI) caused by low pass effects of channel, process-limited on-chip clock frequency, and serial link distance. In order to detect the transmited 4Gbps/pin with 3-Level data sucessfully ,the receiver is designed using 3-stage sense amplifier. The proposed transceiver employes multi-level signaling (3-Level Pulse Amplitude Modulation) using clock multi phase, double data rate and Prbs patten generator. The transceiver shows data rate of 3.2 ~ 4.0 Gbps/pin with a 1GHz internal clock.

• JSTS:Journal of Semiconductor Technology and Science
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• 제12권4호
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• pp.433-448
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• 2012

A source-synchronous receiver based on a delay-locked loop is presented. It employs a shared global calibration control between channels, yet achieves channel expandability for high aggregate I/O bandwidth. The global calibration control accomplishes skew calibration, equalizer adaptation, and phase lock of all the channels in a calibration period, resulting in the reduced hardware overhead and area of each data lane. In addition, the weight-adjusted dual-interpolating delay cell, which is used in the multiphase DLL, guarantees sufficient phase linearity without using dummy delay cells, while offering a high-frequency operation. The proposed receiver is designed in the 90-nm CMOS technology, and achieves error-free eye openings of more than 0.5 UI across 9-28 inch Nelco4000-6 microstrips at 4-7 Gb/s and more than 0.42 UI at data rates of up to 9 Gb/s. The data lane occupies only $0.152mm^2$ and consumes 69.8 mW, while the rest of the receiver occupies $0.297mm^2$ and consumes 56.0 mW at the 7- Gb/s data-rate and supply voltage of 1.35 V.

• ETRI Journal
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• 제33권6호
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• pp.965-968
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• 2011

A 1.485-Gbit/s video signal transmission system at carrier frequencies of 240 GHz and 300 GHz was implemented and demonstrated. The radio frequency front-ends are composed of Schottky barrier diode subharmonic mixers (SHMs), frequency triplers, and diagonal horn antennas for the transmitter and receiver. Amplitude shift keying with an intermediate frequency of 5.94 GHz was utilized as the modulation scheme. A 1.485-Gbit/s video signal with a high-definition serial digital interface format was successfully transmitted over a wireless link distance of 4.2 m and displayed on an HDTV with a transmitted average output power of 20 ${\mu}W$ at a 300-GHz system.

• 전자공학회논문지
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• 제49권12호
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• pp.184-193
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• 2012

본 논문에서는 고속 직렬 링크에 사용할 수 있는 5비트 2.0GS/s 2-way time interleaved 파이프라인 ADC 기반의 수신기를 소개한다. 샘플링 주파수를 높이기 위해, ADC 각 단은 트랙킹과 증폭이 동시에 수행되는 전류 모드 구조를 사용하였다. 또한 ADC 각단에 1-tap FIR 등화기를 탑재하여 별도의 디지털 후처리 없이 채널의 ISI를 감소시켰다. 제안한 수신기는 110nm 공정을 사용하여 설계하였다. 메모리를 제외한 수신기는 $0.58{\times}0.42mm^2$의 크기를 갖고, 동작전압 1.2V에서 91mW의 전력을 소모한다. 시뮬레이션 결과 2.0GS/s 샘플링 주파수에서 20MHz의 입력 주파수와 Nyquist 주파수인 1.0GHz 입력신호에 대하여 동일하게 26.0dB의 SNDR과 4.0비트의 ENOB특성을 확보하였다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 하계종합학술대회 논문집(2)
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• pp.165-168
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• 2002

As the demand for higher data-rate chip-to-chip communication such as memory-to-controller, processor-to-processor increases, low cost high-speed serial links\ulcorner become more attractive. This paper describes a 0.25-fm CMOS 1.6Gbps/pin 4-level transceiver using Stub Series Terminated Logic for high Bandwidth. For multi-gigabit/second application, the data rate is limited by Inter-Symbol Interference (ISI) caused by channel low pass effects, process-limited on-chip clock frequency, and serial link distance. The proposed transceiver uses multi-level signaling (4-level Pulse Amplitude Modulation) using push-pull type, double data rate and flash sampling. To reduce Process-Voltage-Temperature Variation and ISI including data dependency skew, the proposed high-speed calibration circuits with voltage swing controller, data linearity controller and slew rate controller maintains desirable output waveform and makes less sensitive output. In order to detect successfully the transmitted 1.6Gbps/pin 4-level data, the receiver is designed as simultaneous type with a kick - back noise-isolated reference voltage line structure and a 3-stage Gate-Isolated sense amplifier. The transceiver, which was fabricated using a 0.25 fm CMOS process, performs data rate of 1.6 ~ 2.0 Gbps/pin with a 400MHB internal clock, Stub Series Terminated Logic ever in 2.25 ~ 2.75V supply voltage. and occupied 500 * 6001m of area.

• 한국산학기술학회논문지
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• 제6권2호
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• pp.178-182
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• 2005

본 논문에서는 오브컴 위성 통신 및 X.400 통신 프로토콜을 이용하여 글로벌 위치 확인 시스템을 구현하는 논문으로 본 시스템은 인터넷을 통해서 전 세계 어디에서나 이동 및 고정 물체의 위치를 확인할 수 있는 양방향 데이터 통신을 제공한다. 본 연구에서는 데이터 통신 링크를 구축하기 위해서 X.400 프로토콜, 그리고 SIP(Serial Interface Protocol) 및 자체 정의한 제어 프로토콜을 사용하였다. GPS수신기와의 인터페이스를 위하여 사용자 단말기와 연결된 데이터 프로세서도 설계 및 제작하였다. 실시간 실험을 통해서 본 연구에서 제안한 글로벌 위치확인 시스템이 정해진 프로토콜에 따라서 잘 동작하는 것을 확인하였다.

• ETRI Journal
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• 제25권5호
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• pp.328-336
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• 2003

Bluetooth is a specification for short-range wireless communication using the 2.4 GHz ISM band. It emphasizes low complexity, low power, and low cost. This paper describes an area-efficient digital baseband module for wireless technology. For area-efficiency, we carefully consider hardware and software partitioning. We implement complex control tasks of the Bluetooth baseband layer protocols in software running on an embedded microcontroller. Hardware-efficient functions, such as low-level bitstream link control; host controller interfaces (HCIs), such as universal asynchronous receiver transmitter (UART) and universal serial bus (USB)interfaces; and audio Codec are performed by dedicated hardware blocks. Furthermore, we eliminate FIFOs for data buffering between hardware functional units. The design is done using fully synthesizable Verilog HDL to enhance the portability between process technologies so that our module can be easily integrated as an intellectual property core no system-on-a-chip (SoC) ASICs. A field programmable gate array (FPGA) prototype of this module was tested for functional verification and realtime operation of file and bitstream transfers between PCs. The module was fabricated in a $0.25-{\mu}m$ CMOS technology, the core size of which was only 2.79 $mm{\times}2.80mm$.

• 대한전자공학회논문지TC
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• 제43권1호
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• pp.121-126
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• 2006

본 논문은 9.6kbps 무선 통신용 DSSS CDU방식의 모뎀을 설계 및 제작하였다 개발된 모뎀은 마이크로프로세서에서 신호를 주고받을 수 있도록 범용 인터페이스를 제공한다. 인터페이스는 8비트 데이터버스와 칩 Enable, R/W, 및 인터럽트 핀으로 구성하였다. 송신은 먼저 외부로 8비트 병렬 데이터를 받아 시리얼 데이터로 변환하고 모뎀 내부에서 8 비트 PN-code를 생성하여 Direct Sequence 방식으로 데이터를 76.Bkcps로 확산하여 전송한다 그리고 송수신기의 동기를 위해 8비트 훈련시퀀스를 데이터 프레임 헤드에 첨부하였다. 수신기의 경우 수신된 76.8kcps의 확산된 데이터에서 먼저 PN코드 동기를 찾아낸 후 훈련시퀀스를 이용하여 데이터 동기를 얻어낸다. 이를 위해 Early and Late방식을 이용하였다. 본 논문의 모뎀은 Xilinx FPGA 보드로 구현 및 검증된 후 Hynix $0.25{\mu}m$ CMOS 공정을 이용하여 ASIC 칩으로 제작되었으며, DSSS를 이용한 다중사용자 방식을 사용하였다.