• Title/Summary/Keyword: semiconductor gas

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Enhancement of HF Gas Removal Efficiency of a Scrubber in Semiconductor Manufacturing Process by using ANCOVA Technique (ANCOVA를 이용한 반도체공정 스크러버 HF 가스 제거 개선)

  • Kim, S.J.;Lee, M.;Xu, J.;Lim, S.;Lee, H.;Koo, J.
    • Journal of ILASS-Korea
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    • v.18 no.2
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    • pp.81-86
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    • 2013
  • To comply with the regulation of the reinforcing Clean Air Conservation Act, it is necessary for the semiconductor manufacturers to develop effective low-concentration acid gas abatement system to treat the flue gas. The low-concentration acid gas was found to be harder to deal with than the high-concentration one. In this study, the effect of various potential treatments such as air-assist nozzle spraying, magnetizing the scrubbing water, and adding surfactants to spraying and scrubbing water were investigate through the application of the statistical ANCOVA method, which was proved to be very useful tool when the inlet concentration of acid gas could not be controlled precisely and it affected the removal efficiency of the abatement system.

A Study on Properties of RF-sputtered Al-doped ZnO Thin Films Prepared with Different Ar Gas Flow Rates

  • Han, Seung Ik;Kim, Hong Bae
    • Applied Science and Convergence Technology
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    • v.25 no.6
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    • pp.145-148
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    • 2016
  • This paper, Al-doped ZnO(AZO) thin films for application as transparent conducting oxide films were deposited on the Corning glass substrate by using RF magnetron sputtering system. The effects of various Argon gas flow rates on optical and electrical characteristics of AZO films were investigate sputtering method. The Carrier Concentration is enhanced as Ar gas rate increases, and also the oxygen vacancy concentration. The figure of merit obtained in this study means that AZO films which deposited Ar gas rate of 75 sccm have the highest Carrier concentration and Hall mobility, which have the highest photoelectrical performance that it could be used as transparent electrodes.

Simple Bluetooth Wireless Multi-gas Measurement System (간단한 블루투스 무선다중가스센서 계측시스템)

  • Kim, Chul min;Kim, Doyoon;Kim, Yeonsu;Kim, Gyu-tae
    • Journal of the Semiconductor & Display Technology
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    • v.19 no.2
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    • pp.51-54
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    • 2020
  • To develop gas-distinguishing sensor system, it is highly required to integrate multiple sensors for effective detection of a single targeted gas or mixture of gases. In addition, it is important to collect the reliable data from individual sensors into one integrated measuring device. Collecting the data of toxic gases on the spot should be done without inhalation. We suggest simple wirelessly running system for data collection that guarantees both reliability of data sources and safety. Here, we made a multi-gas measuring instrument(device) combined with Bluetooth module which provides a safe and precise big data accumulation system.

Fabrication and characterization of a small-sized gas identification instrument for detecting LPG/LNG and CO gases

  • Lee Kyu-Chung;Hur Chang-Wu
    • Journal of information and communication convergence engineering
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    • v.4 no.1
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    • pp.18-22
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    • 2006
  • A small-sized gas identification system has been fabricated and characterized using an integrated gas sensor array and artificial neural-network. The sensor array consists of four thick-film oxide semiconductor gas sensors whose sensing layers are $In_{2}O_{3}-Sb_{2}O_{5}-Pd-doped\;SnO_2$ + Pd-coated layer, $La_{2}O_{5}-PdCl_{2}-doped\;SnO_2,\;WO_{3}-doped\;SnO_{2}$ + Pt-coated layer and $ThO_{2}-V_{2}O_{5}-PdCl_{2}\;doped\;SnO_{2}$. The small-sized gas identification instrument is composed of a GMS 81504 containing an internal ROM (4k bytes), a RAM (128 bytes) and four-channel AD converter as MPU, LEDs for displaying alarm conditions for three gases (liquefied petroleum gas: LPG, liquefied natural gas: LNG and carbon monoxide: CO) and interface circuits for them. The instrument has been used to identify alarm conditions for three gases among the real circumstances and the identification has been successfully demonstrated.

A Study on the Characteristics of Electro Polishing and Utility Materials for Transit High Purity Gas (청정도 가스 이송용 재료의 특성과 전해연마에 관한 연구)

  • Lee, Jong-Hyung;Park, Shin-Kyu;Yang, Seong-Hyeon
    • Journal of the Korean Society of Industry Convergence
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    • v.7 no.3
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    • pp.259-263
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    • 2004
  • In the manufacture progress of LCD or semiconductor, there are used many kinds of gas like erosion gas, dilution gas, toxic gas as a progress which used these gas there are required high puritize to increase accumulation rate of semiconductor or LCD materials work progress of semiconductor or LCD it demand many things like the material which could minimize metallic dust that could be occured by reaction between gas and transfer pipe laying material, illumination of the surface, emition of the gas, metal liquation, welding etc also demand quality geting stricted. Material-Low-sulfur-contend (0.007-0010), vacuum-arc-remelt(VAR), seamless, high-purity tubing material is recommend for enhance welding lower surface defect density All wetted stainless steel surface must be 316LSS elecrto polishinged with ${\leq}0.254{\mu}m$($10.0{\mu}in$) Ra average surface finish, $Cr/Fe{\geq}1.1$ and $Cr_2O_3$ thickness ${\geq}25{\AA}$ From the AES analytical the oxide layer thickness (23.5~36 angstroms silicon dioxide equivalent) and chromum to iron ratios is similar to those generally found on electropolished stainless steel., molybdenum and silicon contaminants ; elements characteristic of stainless steel (iron, nickel and chromium); and oxygen were found on the surface Phosphorus and nitrogen are common contaminants from the electropolish and passivation steps.

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A Study on the Machining Characteristics of CVD-SiC (CVD-SiC 소재의 가공 특성에 관한 연구)

  • Park, Hwi-Keun;Lee, Won-Seok;Kang, Dong-Won;Park, In-Seung;Lee, Jong-Chan
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.16 no.5
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    • pp.40-46
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    • 2017
  • A plasma gas control apparatus for semiconductor plasma etching processes securely holds a cathode for forming a plasma, confines the plasma during the plasma etching process, and discharges gas after etching. It is a key part of the etching process. With the advancement of semiconductor technology, there is increasing interest in parts for semiconductor manufacturing that directly affect wafers. Accordingly, in order to replace the plasma gas control device with a CVD-SiC material superior in mechanical properties to existing SiCs (Sintered-SiC, RB-SiC), a study on the grinding characteristics of CVD-SiC was carried out. It is confirmed that the optimal grinding condition was obtained when the result table feed rate was 2 m/min and the infeed depth was $5{\mu}m$.

Analysis Method of Volatile Sulfur Compounds Utilizing Separation Column and Metal Oxide Semiconductor Gas Sensor

  • Han-Soo Kim;Inho Kim;Eun Duck Park;Sang-Do Han
    • Journal of Sensor Science and Technology
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    • v.33 no.3
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    • pp.125-133
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    • 2024
  • Gas chromatography (GC) separation technology and metal oxide semiconductor (MOS) gas sensors have been integrated for the effective analysis of volatile sulfur compounds (VSCs) such as H2S, CH3SH, (CH3)2S, and (CH3)2S2. The separation and detection characteristics of the GC/MOS system using diluted standard gases were investigated for the qualitative and quantitative analysis of VSCs. The typical concentrations of the standard gases were 0.1, 0.5, 1.0, 5.0, and 10.0 ppm. The GC/MOS system successfully separated H2S, CH3SH, (CH3)2S, and (CH3)2S2 using a celite-filled column. The reproducibility of the retention time measurements was at a 3% relative standard deviation level, and the correlation coefficient (R2) for the VSC concentration was greater than 0.99. In addition, the chromatograms of single and mixed gases were almost identical.

NOx Gas Detecting Properties of the Nitrocellulose/MWCNT Thin Film Coated on the Glass Substrate (유리 기판 위에 제작된 Nitrocellulose/MWCNT 박막의 질소가스 검출특성)

  • Lee, Won Jae;Choi, Myung Kyu;Jang, Kyung Uk
    • Journal of the Semiconductor & Display Technology
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    • v.11 no.1
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    • pp.55-59
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    • 2012
  • NOx is one of the toxin gases, which is mainly causing the optic-chemical smog phenomena, and decreasing in the function of nose and taste. Especially, NO is easily reacting with $O_3$, and then becoming the $NO_2$. $NO_2$ is mainly causing the acidulation rain. So, we should develop the NOx gas sensing system to detect NOx gas. In this paper, we present the microstructure and the NOx gas detecting properties of the nitrocellulose/MWCNT thin film coated by the air-spray on the glass substrate. The nitrocellulose/MWCNT-based gas sensors have been studied detecting NOx molecules of a ppm-level at the temperature range of $30{\sim}120^{\circ}C$. The resistance of the sensors decreases when the sensors are exposed to NOx gas. As a results, we obtained the nitrocellulose/MWCNT sensors with the sensitivity of 0.6%/sec under the 0.8 ppm of NOx gas concetration. Also, we get the activation energy of 0.202eV from the sensor for the 0.3 ppm of NOx gas concentration.

A Study on Measures to Prevent Leakage of Process Fluid from the VCR Fitting used in the Semiconductor Manufacturing Process (반도체 제조 공정에서 사용되는 이송배관 연결부위(VCR Fitting)로부터 공정유체 누출사고 예방 대책에 관한 연구)

  • Dae Joon Lee;Sang Ryung Kim;Sang Gil Kim;Chung Sang Kang;Joon Won Lee
    • Journal of the Korean Institute of Gas
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    • v.27 no.2
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    • pp.79-85
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    • 2023
  • Recently, in the semiconductor process, large companies are seeking process changes from memory semiconductors to the foundry due to the increase in demand due to the 4th industry. industry is expanding. The characteristics of special gases and precursors, which are raw materials used to produce these semiconductor chips, are toxic, pyrophoric, inflammable, and corrosive. These semiconductor raw materials are operated in a closed system and do not leak to the outside during normal times, but when leaked, they spread to the inside of the gas box, and when proper ventilation is not provided inside the gas box, they spread to the outside, causing fires, explosions, or toxic substances. It can lead to major accidents such as leakage. Recently, there have been cases of accidents in which hazardous materials leaked from the closed system of the semi conductor process and spread to the inside and outside of the gas box. . In this study, we propose preventive measures based on the case of an accident in which raw material leaked from the VCR fitting, which is the connection part of the semiconductor raw material transfer pipe, and spread to the outside of the gas box.

Evaluation of Metal Oxide Semiconductor and Electrochemical Gas Sensor Array Characterization for Measuring Wastewater Odor (폐수의 악취측정을 위한 금속산화물 반도체 및 전기화학식 가스센서 어레이 특성 평가)

  • Yim, Bongbeen;Lee, Seok-Jun;Kim, Sun-Tae
    • Journal of Sensor Science and Technology
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    • v.24 no.1
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    • pp.29-34
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    • 2015
  • This study aimed to evaluate the characterization of a metal oxide semiconductor and electrochemical gas sensor array for measuring wastewater odor. The sensitivity of all gas sensors observed in sampling method by stripping was 6.7 to 20.6 times higher than that by no stripping, except sensor D (electrochemical gas sensor). The average reduction ratio of sensor signal as a function of initial dilution rate of wastewater was in the order of food plant > food waste reutilization facility > plating plant. The sensitivity of gas sensors was dependent on both the type of wastewater and the dilution rate. The sensor signals observed by the gas sensor array were correlated with the dilution factor (OU) calculated by the air dilution sensory test with several wastewater ($r^2=0.920{\sim}0.997$), except the sensor signals of sensor D measured in the plating plant wastewater. It seems likely that the gas sensor array plays a role in the evaluation of odor in wastewater and is useful tool for on-site odor monitoring in the wastewater facilities.