• ETRI Journal
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• v.35 no.4
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• pp.617-624
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• 2013

Low power consuming and highly responsive semiconductor-type microelectromechanical systems (MEMS) gas sensors are fabricated for real-time environmental monitoring applications. This subsystem is developed using a gas sensor module, a Bluetooth module, and a personal digital assistant (PDA) phone. The gas sensor module consists of a $NO_2$ or CO gas sensor and signal processing chips. The MEMS gas sensor is composed of a microheater, a sensing electrode, and sensing material. Metal oxide nanopowder is drop-coated onto a substrate using a microheater and integrated into the gas sensor module. The change in resistance of the metal oxide nanopowder from exposure to oxidizing or deoxidizing gases is utilized as the principle mechanism of this gas sensor operation. The variation detected in the gas sensor module is transferred to the PDA phone by way of the Bluetooth module.

• Journal of information and communication convergence engineering
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• v.2 no.1
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• pp.22-25
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• 2004

A highly sensitive ammonia gas sensor using thick-film technology has been fabricated and examined. The sensing material of the gas sensor is FeOx-$WO_{3}-SnO_{2}$ oxide semiconductor. The sensor exhibits resistance increase upon exposure to low concentration of ammonia gas. The resistance of the sensor is decreased, on the other hand, for exposure to reducing gases such as ethyl alcohol, methane, propane and carbon monoxide. A novel method for detecting ammonia gas quite selectively utilizing a sensor array consisting of an ammonia gas sensor and a compensation element has been proposed and developed. The compensation element is a Pt-doped $WO_{3}-SnO_{2}$gas sensor which shows opposite direction of resistance change in comparison with the ammonia gas sensor upon exposure to ammonia gas. Excellent selectivity has been achieved using the sensor array having two sensing elements.

• Journal of Sensor Science and Technology
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• v.27 no.4
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• pp.221-226
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• 2018

Misfueling accidents significantly damage the engines of both gasoline and diesel vehicles, and should be avoided by rapid and accurate fuel discrimination. Gasoline fuel contains bioethanol. Thus, the detection of ethanol vapor produced by gasoline can be used to distinguish between gasoline and diesel. In the present study, Pt-doped $SnO_2$ hollow nanospheres, Mg-doped $In_2O_3$ hollow microspheres, and Pt-doped ZnO nanostructures have been used as gas sensors to discriminate between gasoline and diesel fuels. All three sensors are able to detect and discriminate between gases evaporating from gasoline and diesel. Among the sensors, the Mg-doped $In_2O_3$ hollow microspheres show a significant gas response (resistance ratio = 4.97) quickly (~3 s) after exposure to gasoline-evaporated gas at $225^{\circ}C$, but did not show any substantial response to diesel-evaporated gas. This demonstrates that gasoline and diesel fuels can be discriminated using small and cost-effective oxide semiconductor gas sensors.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.601-604
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• 1998

NOX detecting gas sensors using TiO2 doped tungsten oxide semiconductor were prepared and their electrical and sensing characteristics have been investigated. In normal air condition, the sensors of WO3, TiO2 doped WO3 show grain boundary heights of 0.34 eV, 0.25 eV, respectively. The grain boundary barrier energy variation was increased by doping TiO2 into large variation of resistance to NOX gases. And doping the TiO2 4 wt.%, the particle size of WO3 polycrystal films showed higher sensitivity and better sorption characteristics to NOX gas than the pure WO3 films material in air at operating temperature of $350^{\circ}C.$ The TiO2 doped WO3 semiconductor gas sensor shows nano-sized particle size and good sensitivity to sub-ppm concentration of NOX.

• Particle and aerosol research
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• v.14 no.2
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• pp.41-47
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• 2018

Numerical analysis was conducted to characterize particle deposition onto a heated horizontal semiconductor wafer in vacuum environment. In order to calculate the properties of gas surrounding the wafer, the gas was assumed to obey the ideal gas law. Particle transport mechanisms considered in the present study were convection, Brownian diffusion, gravitational settling and thermophoresis. Averaged particle deposition velocities on the upper surface of the wafer were calculated with respect to particle size, based on the numerical results from the particle concentration equation in the Eulerian frame of reference. The deposition velocities were obtained for system pressures of 1000 Pa~1 atm, wafer heating of 0~5 K and particle sizes of $2{\sim}10^4nm$. The present numerical results showed good agreement with the available experimental ones.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.45-50
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• 2022

The etching with high selectivity of silicon dioxide over silicon nitride is essential in semiconductor fabrication, and gas phase etch (GPE) can increase the competitiveness of the selective dielectric etch. In this work, GPE of plasma enhanced chemical vapor deposited SiO₂ was performed, and the effects of process parameters, such as temperature, partial pressure ratio, and gas supply cycle, are investigated in terms of etch rate and within wafer uniformity. Employing multiple regression analysis, the importance of each parameter elements is analyzed.

• Journal of the Korean Institute of Gas
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• v.27 no.1
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• pp.63-69
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• 2023

Although Korea is the world's No. 1 semiconductor producing country, most studies are conducted with risk assessment for simple material risks due to the closedness of the site for industrial protection. In terms of industrial safety, a monitoring system such as a gas detector to determine the leakage of hazardous substances has been established, but research on effectively discharging harmful gastritis substances in case of leakage has only recently begun. Semiconductor manufacturing facilities (gas boxes) where a large amount of flammable materials are handled are currently being safety managed by using a gas detector and blocking the air inlet. It is difficult to dilute in a short time in case of leakage of flammable substances. Therefore, in this study, based on various criteria, the size of the duct according to the size of the gas box is determined and the appropriate size of the air inlet is studied to minimize the exhaust performance requirement without exposing hazardous chemicals to the outside in the event of a flammable leak. We want to do an optimal exhaust design.

• Electrical & Electronic Materials
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• v.15 no.9
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• pp.10-14
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• 2002

Plasma processing plays a significant role in semiconductor devices technology. Development of new plasma systems, such as high-density plasma reactors, required development of plasma theory to understand a whole process mechanism and to be able to explain and to predict processing results. A most important task in this way is to establish interconnections between input process parameters (working gas, pressure flow rate input power density) and a various plasma subsystems (electron gas, volume and heterogeneous gas chemistry, transport), which are closely connected one with other. It will allow select optimal ways for processes optimizations.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.11
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• pp.1350-1357
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• 1988

The dual dielectric films have been grown on single-crystalline silicon substrates with the thickness ranging from 125A to 180A at various gas and temperature conditions by using rapid thermal process that included independent nitridation step. The film characteristics and their dependence on the contents of the hydrochloric gas and the processing time have been studied. By the addition of the hydrochloric gas, the initial oxide thickness was significantly changed, but after sequential nitridation processes the thickness of the films was nevertheless a little bit varied within 10A. All the samples of the dual dielectric films show the increased breakdown voltages in proportion to the additive contents of the hydrochloric gas and also show the higher breakdown strengths than the thermal oxide and nitrided oxide films grown by the conventional furnance process or the rapid thermal nitridation process that was composed of the dependent nitridation cycles.

• Proceedings of the KIEE Conference
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• 1991.07a
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• pp.209-212
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• 1991

Recently, oxide semiconductor gas sensors consisted of n-type semiconductor materials such as $SnO_2$, ZnO and $Fe_2O_3$ have been widely used to detect reducing gases. The advantage of thick-film technology include the possibility of mass-production and automation, that of integrating the sensing element in a hybrid circuit and that of fuctional trimming of the sensor and/or the circuit. which would enable really interchangeable transducers to be prepared. In this paper, we made ZnO and $SnO_2$ gas sensors and investigated the sensitivity to CO gas. Therefore, we compared a ZnO gas sensor with a $SnO_2$ gas sensor.