• Journal of IKEEE
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• v.22 no.2
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• pp.302-308
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• 2018

Multi-Layer Sputtering is aim to develop desired thickness thin film multi-layer with different materials. The multi-layer thin film deposition process occupies a relatively large portion in the process time, because the main reason is that it takes much time to move the substrate to be deposited and to make the chamber into a high vacuum state compared to the process time. Most of semiconductor and display industries sputter a single substance in one chamber and move boards through multi-continuous robots to another chamber to sputter other materials. This will inevitably require multiple chambers, vacuum pumps, and multi-contamination robots within the process facility. To solve these problems, this paper proposes a control system for multi-layer thin film sputtering devices that deposit different materials within a single vacuum chamber and is applied in TFT process. The manufacture and experiment of the control system proved its validity.

• Korean Journal of Optics and Photonics
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• v.28 no.6
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• pp.339-345
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• 2017

The flatness of a reference flat plays an important role, from the calibration of an interferometer to the reference for a semiconductor or flat-panel display, etc. Especially if we order the flatness measurement outside Korea, we may spend more time and money. In this paper, we measured the flatness of a reference flat using a three-flat test, which is one of the absolute measurement methods, and calculated its measurement uncertainty. In the three-flat test we adopted, each flat is tested against another flat, with three unknown flats, using an interferometer. Among several three-flat tests, we adopted Griesmann's method which has a low measurement uncertainty and is less dependent on the experimental equipment. As a result, the measurement uncertainty was found to be less than 0.5 nm rms, which is very accurate for high-tech industrial applications.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.2
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• pp.184-193
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• 2015

This paper proposes a cost-efficient and automatic method for large data acquisition from a test chip without expensive equipment to characterize random process variation in an integrated circuit. Our method requires only a test chip, a personal computer, a cheap digital-to-analog converter, a controller and multimeters, and thus large volume measurement can be performed on an office desk at low cost. To demonstrate the proposed method, we designed a test chip with a current model logic driver and an array of 128 current mirrors that mimic the random process variation of the driver's tail current mirror. Using our method, we characterized the random process variation of the driver's voltage due to the random process variation on the driver's tail current mirror from large volume measurement data. The statistical characteristics of the driver's output voltage calculated from the measured data are compared with Monte Carlo simulation. The difference between the measured and the simulated averages and standard deviations are less than 20% showing that we can easily characterize the random process variation at low cost by using our cost-efficient automatic large data acquisition method.

• Journal of Advanced Marine Engineering and Technology
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• v.35 no.2
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• pp.232-237
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• 2011

Recently, continuous research on cryogenic valves is being carried out with the rapid development of the cryogenic valve-related industry, and especially, high performance of cryogenic valves is being promoted due to the breakthrough development and demand of users, etc., of the mechanical, shipbuilding, semiconductor and display industry and the aerospace industry field, but it is the reality that technical development and research on cryogenic application equipment on vacuum insulation are insufficient. The present research focused on interception of heat exchange with the outside by keeping low pressure after installing a jacket pipe outside a stem and also considered heat transfer properties on changes in pressure of a vacuum part and radius of a jacket which can reduce heat exchange for effective heat transmission control by studying it in a three-dimensional numerical analysis method.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.17-17
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• 2010

This paper address technical issues in calibrating discharge coefficients of sonic nozzles used to measure the volume flow rate of low vacuum dry pumps. The first challenging issue comes from the technical limit that their calibration results available from the flow measurement standard laboratories do not fully cover the low vacuum measurement range although the use of sonic nozzles for precision measurement of gas flow has been well established in NMIs. The second is to make an ultra low flow sonic nozzlesufficient to measure the throughput range of 0.01 mbar-l/s. Those small-sized sonic nozzles do not only achieve the noble stability and repeatability of gas flow but also minimize effects of the fluctuation of down stream pressures for the measurement of the volume flow rate of vacuum pumps. These distinctive properties of sonic nozzles are exploited to measure the pumping speed of low vacuum dry pumps widely used in the vacuum-related academic and industrial sectors. Sonic nozzles have been standard devices for measurement of steady state gas flow, as recommended in ISO 9300. This paper introduces two small-sized sonic nozzles of diameter 0.03 mm and 0.2 mm precisely machined according to ISO 9300. The constant volume flow meter (CVFM) readily set up in the Vacuum center of KRISS was used to calibrate the discharge coefficients of the machined nozzles. The calibration results were shown to determine them within the 3% measurement uncertainty. Calibrated sonic nozzles were found to be applicable for precision measurement of steady state gas flow in the vacuum process. Both calibrated sonic nozzles are demonstrated to provide the precision measurement of the volume flow rate of the dry vacuum pump within one percent difference in reference to CVFM. Calibrated sonic nozzles are applied to a new 'in-situ and in-field' equipment designed to measure the volume flow rate of low vacuum dry pumps in the semiconductor and flat display processes.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.95-95
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• 2014

An OLED(Organic Light-Emitting Diode) device based on the emissive electroluminescent layer a film of organic materials. OLED is used for many electronic devices such as TV, mobile phones, handheld games consoles. ULVAC's mass production systems are indispensable to the manufacturing of OLED device. ULVAC is a manufacturer and worldwide supplier of equipment and vacuum systems for the OLED, LCD, Semiconductor, Electronics, Optical device and related high technology industries. The SMD Series are single-substrate sputtering systems for deposition of films such as metal films and TCO (Transparent Conductive Oxide) films. ULVAC has delivered a large number of these systems not only Organic Evaporating systems but also LTPS CVD systems. The most important technology of thin-film encapsulation (TFE) is preventing moisture($H_2O$) and oxygen permeation into flexible OLED devices. As a polymer substrate does not offer the same barrier performance as glass substrate, the TFE should be developed on both the bottom and top side of the device layers for sufficient lifetimes. This report provides a review of promising thin-film barrier technologies as well as the WVTR(Water Vapor Transmission Rate) properties. Multilayer thin-film deposition technology of organic and inorganic layer is very effective method for increasing barrier performance of OLED device. Gases and water in the organic evaporating system is having a strong influence as impurities to OLED device. CRYO pump is one of the very useful vacuum components to reduce above impurities. There for CRYO pump is faster than conventional TMP exhaust velocity of gases and water. So, we suggest new method to make a good vacuum condition which is CRYO Trap addition on OLED evaporator. Alignment accuracy is one of the key technologies to perform high resolution OLED device. In order to reduce vibration characteristic of CRYO pump, ULVAC has developed low vibration CRYO pumps to achieve high resolution alignment performance between Metal mask and substrate. This report also includes ULVAC's approach for these issues.

• Korean Journal of Materials Research
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• v.11 no.4
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• pp.251-257
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• 2001

A present semiconductor cleaning technology is based upon RCA cleaning, high temperature process which consumes vast chemicals and ultra Pure water(UPW). This technology gives rise to the many environmental issues, therefore some alternatives have been studied. In this study, intentionally contaminated Si wafers were cleaned using the electrolyzed water(EW). The EW was generated by an electrolysis equipment which was composed of anode. cathode, and toddle chambers. Oxidative water and reductive water were obtained in anode and cathode chambers, respectively. In case $NH_4$Cl electrolyte, the oxidation-reduction potential(ORP) and pH for anode water(AW) and cathode water(CW) were measured to be +1050mV and 4.7, and -750mV and 9.8, respectively. For cleaning metallic impurities, AW was confirmed to be more effective than that of CW, and the particle distribution after various particle removal processes was shown to be same distribution.

• The Journal of Korean Institute for Practical Engineering Education
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• v.4 no.2
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• pp.91-97
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• 2012

The automated visual inspection system (machine vision system) for quality assurance is an important factory automation equipment in the manufacturing industries, such as display, semiconductor, etc. The world market of the machine vision components is expected 18 billon dollars in 2015. Therefore, there is a lot of demand for the machine vision engineers. However, there are no technical training courses for machine vision technologies in vocational schools, colleges and universities. In this paper, we propose a technical training program for the machine vision technology. The total time of training is 30 to 60 hours and the training program can operate flexibly by student's major, a priori knowledge and education level.

• Journal of IKEEE
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• v.24 no.3
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• pp.735-742
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• 2020

The pick & place module is used as a core module in the process equipment for producing and inspecting semiconductor components. The conventional pick & place module has the disadvantage that the precision and durability of the system are reduced and the size and weight of the module are increased by using a conversion device that converts rotary motion into linear motion. In this study, we proposed a pick & place module that implements up-and-down linear motion without a conversion device by improving such disadvantage and employs a linear motor with no limit on average thrust and travel distance. Design parameter values, that can reduce cogging force while maintaining average thrust by selecting parameters for designing a core type linear motor with a large thrust to volume ratio and analyzing the effect of cogging force according to design parameter changes through magnetic analysis, was selected. Average thrust and cogging force were measured for the pick & place module composed of the manufactured linear motor and compared with the design values.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.17 no.10
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• pp.967-975
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• 2007

A rotordynamic analysis was performed with a dry vacuum pump, which is a major equipment in modern semiconductor and LCD manufacturing processes. The system is composed of screw rotors, lobes picking air, helical gears, driving motor, and support rolling element bearings of rotors and motor. The driving motor-screw rotor system has a rated speed of 6,300 rpm, and was modeled utilizing a rotordynamic FE method for analysis, which was verified through 3-D FE analysis and experimental modal analysis. As loadings on the bearings due to the gear action were significant in the system considered, each resultant bearing load was calculated by considering the generalized forces of the gear action as well as the rotor itself. Each resultant bearing loading was used in calculating each stiffness of rolling element bearings. Design goals are to achieve wide separation margins of lateral and torsional critical speeds, and favorable unbalance responses of the rotor in the operating range. Then, a complex rotordynamic analysis of the system was carried out to evaluate its forward synchronous critical speeds, whirl natural frequencies and mode shapes, unbalance responses under various unbalance locations, and torsional interference diagram. Results show that the entire system is well designed in the operating range. In addition, the procedure of rotordynamic analysis for dry vacuum pump rotor-bearing system was proposed and established.