• Asia pacific journal of information systems
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• v.20 no.3
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• pp.191-204
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• 2010

Recently, the CO2 emission and energy consumption have become critical global issues to decide the future of nations. Especially, the spread of IT products and the increased use of internet and web applications result in the energy consumption and CO2 emission of IT industry though information technologies drive global economic growth. EU, the United States, Japan and other developed countries are using IT related environmental regulations such as WEEE(Waste Electrical and Electronic Equipment), RoHS(Restriction of the use of Certain Hazardous Substance), REACH(Registration, Evaluation, Authorization and Restriction of CHemicals) and EuP(Energy using Product), and have established systematic green business/IT strategies to enhance the competitiveness of IT industry. For example, the Japan government proposed the "Green IT initiative" for being compatible with economic growth and environmental protection. Not only energy saving technologies but energy saving systems have been developed for accomplishing sustainable development. Korea's CO2 emission and energy consumption continuously have grown at comparatively high rates. They are related to its industrial structure depending on high energy-consuming industries such as iron and steel Industry, automotive industry, shipbuilding industry, semiconductor industry, and so on. In particular, export proportion of IT manufacturing is quite high in Korea. For example, the global market share of the semiconductor such as DRAM was about 80% in 2008. Accordingly, Korea needs to establish a systematic strategy to respond to the global environmental regulations and to maintain competitiveness in the IT industry. However, green competitiveness of Korea ranked 11th among 15 major countries and R&D budget for green technology is not large enough to develop energy-saving technologies for infrastructure and value chain of low-carbon society though that grows at high rates. Moreover, there are no concrete action plans in Korea. This research aims to deduce the priorities of the Korean green business/IT strategies to use multi attribute weighted average method. We selected a panel of 19 experts who work at the green business related firms such as HP, IBM, Fujitsu and so on, and selected six assessment indices such as the urgency of the technology development, the technology gap between Korea and the developed countries, the effect of import substitution, the spillover effect of technology, the market growth, and the export potential of the package or stand-alone products by existing literature review. We submitted questionnaires at approximately weekly intervals to them for priorities of the green business/IT strategies. The strategies broadly classify as follows. The first strategy which consists of the green business/IT policy and standardization, process and performance management and IT industry and legislative alignment relates to government's role in the green economy. The second strategy relates to IT to support environment sustainability such as the travel and ways of working management, printer output and recycling, intelligent building, printer rationalization and collaboration and connectivity. The last strategy relates to green IT systems, services and usage such as the data center consolidation and energy management, hardware recycle decommission, server and storage virtualization, device power management, and service supplier management. All the questionnaires were assessed via a five-point Likert scale ranging from "very little" to "very large." Our findings show that the IT to support environment sustainability is prior to the other strategies. In detail, the green business /IT policy and standardization is the most important in the government's role. The strategies of intelligent building and the travel and ways of working management are prior to the others for supporting environment sustainability. Finally, the strategies for the data center consolidation and energy management and server and storage virtualization have the huge influence for green IT systems, services and usage This research results the following implications. The amount of energy consumption and CO2 emissions of IT equipment including electrical business equipment will need to be clearly indicated in order to manage the effect of green business/IT strategy. And it is necessary to develop tools that measure the performance of green business/IT by each step. Additionally, intelligent building could grow up in energy-saving, growth of low carbon and related industries together. It is necessary to expand the affect of virtualization though adjusting and controlling the relationship between the management teams.

• Journal of the Korean Wood Science and Technology
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• v.34 no.4
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• pp.22-30
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• 2006

The volatile organic compound (VOC) Analyzer is a portable device to measure the four main aromatic hydrocarbon gases: toluene, ethylbenzene, xylene and styrene. With the VOC Analyzer, a semiconductor gas sensor eliminates the need for the carrier gas which is required for conventional gas chromatographs. In addition, since the semiconductor gas sensor is supersensitive to gas components, it is not necessary to use a conventional gas concentrator or other complicated equipment. Compared with other measurement methods, the VOC analyzer is useful for measuring toluene, ethylbenzene, xylene and styrene in wood-based panel because of its ease in obtaining field results and repeating the test. The VOC Analyzer primarily measures four VOC in the air. In this study, we designed a test method of VOC measurement for particle board. A specimen was sealed in 3L polyester bag, after 96hours we could measure maximum VOC emission level that is a stabilized VOC Value. For easy, fast and economic testing of TVOC emission from wood-based panel, we developed the test method with the VOC Analyzer. The VOC Analyzer is expected to gain widespread use in the manufacturing field where a quick and easy test for VOC emission from wood-based panel is required. Furthermore, the VOC Analyzer promises to become an easier, faster and more economic technique than the currently used standard methods.

• Journal of the Semiconductor & Display Technology
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• v.6 no.3
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• pp.19-23
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• 2007

The NiSi is very promising candidate for the metallization in 45 nm CMOS process such as FUSI(fully silicided) gate and source/drain contact because it exhibits non-size dependent resistance, low silicon consumption and mid-gap workfunction. Ni film was first deposited by using ALD (atomic layer deposition) technique with Bis-Ni precursor and $H_2$ reactant gas at $220^{\circ}C$ with deposition rate of $1.25\;{\AA}/cycle$. The as-deposited Ni film exhibited a sheet resistance of $5\;{\Omega}/{\square}$. RTP (repaid thermal process) was then performed by varying temperature from $400^{\circ}C$ to $900^{\circ}C$ in $N_2$ ambient for the formation of NiSi. The process temperature window for the formation of low-resistance NiSi was estimated from $600^{\circ}C$ to $800^{\circ}C$ and from $700^{\circ}C$ to $800^{\circ}C$ with and without Ti capping layer. The respective sheet resistance of the films was changed to $2.5\;{\Omega}/{\square}$ and $3\;{\Omega}/{\square}$ after silicidation. This is because Ti capping layer increases reaction between Ni and Si and suppresses the oxidation and impurity incorporation into Ni film during silicidation process. The NiSi films were treated by additional thermal stress in a resistively heated furnace for test of thermal stability, showing that the film heat-treated at $800^{\circ}C$ was more stable than that at $700^{\circ}C$ due to better crystallinity.

• Korean Journal of Optics and Photonics
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• v.33 no.6
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• pp.295-302
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• 2022

In this paper, a wedge prism application method was studied to design a full-high-definition (FHD)-class high-resolution flexible endoscope. In the case of the conventional flexible endoscope optical system, the F number is made large or a liquid lens is applied to obtain the same imaging performance in a wide depth of field. However, there is a problem in that the diameter of the optical system increases because an additional light guide and equipment are required. To solve this problem, two wedge prisms were applied to the flexible endoscope optical system to adjust the image distance for each object distance. First, two wedge prisms were symmetrically placed on the designed endoscopic optical system. An image distance satisfying the target imaging performance according to each objective distance was derived. Next, the wedge prism decenter value for controlling the image distance was derived. By combining these two data, a wedge prism decenter value that satisfied the target imaging performance at each object distance was applied in multi configurations. As a result of the optimal design applied with the wedge prism, a target imaging performance of more than 20% of the modulation transfer function for a resolution of 178 cycles/mm was satisfied in the entire depth of field of 100 mm-7 mm.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.31 no.6
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• pp.276-281
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• 2021

In order to manufacture a semiconductor circuit, etching, cleaning, and deposition processes are repeated. During these processes, the inside of the processing chamber is exposed to corrosive plasma. Therefore, the coating of the inner wall of the semiconductor equipment with a plasma-resistant material has been attempted to minimize the etching of the coating and particle contaminant generation. In this study, we synthesized yttrium oxyfluoride (YOF) powder by a solid-state reaction using Y₂O₃ and YF₃ as raw materials. Mixing ratio of the Y₂O₃ and YF₃ was varied from 1.0:1.0 to 1.0:1.6. Effects of the mixing ratio on crystal structure and microstructure of the synthesized YOF powder were investigated using XRD and FE-SEM. The synthesized YOF powder was successfully applied to plasma spray coating process on Al substrate.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.33 no.4
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• pp.153-157
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• 2023

In order to manufacture a semiconductor circuit, etching, cleaning, and deposition processes are repeated. During these processes, the inside of the processing chamber is exposed to corrosive plasma. Therefore, the coating of the inner wall of the semiconductor equipment with a plasma-resistant material has been attempted to minimize the etching of the coating and particle contaminant generation. In this study, we mixed AlF₃ powder with the solid-state reacted yttrium oxyfluoride (YOF) in order to increase plasma-etching resistance of the plasma spray coated YOF layer. Effects of the mixing ratio of AlF₃ with YOF powder on crystal structure, microstructure and chemical composition were investigated using XRD and FE-SEM. The plasma-etching ratios of the plasma-spray coated layers were calculated and correlation with AlF₃ mixing ratio was analyzed.

• Journal of Industrial Convergence
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• v.20 no.12
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• pp.79-85
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• 2022

Recently, a smartphone manufactured on a flexible substrate has been released as an electronic device, and research on a stretchable electronic device is in progress. In this paper, a silicon-based stretchable material is made and used as a substrate to implement and evaluate an optical sensor device using oxide semiconductor. To this end, a substrate that stretches well at room temperature was made using a silicone-based solution rubber, and the elongation of 350% of the material was confirmed, and optical properties such as reflectivity, transmittance, and absorbance were measured. Next, since the surface of these materials is hydrophobic, oxygen-based plasma surface treatment was performed to clean the surface and change the surface to hydrophilicity. After depositing an AZO-based oxide film with vacuum equipment, an Ag electrode was formed using a cotton swab or a metal mast to complete the photosensor. The optoelectronic device analyzed the change in current according to the voltage when light was irradiated and when it was not, and the photocurrent caused by light was observed. In addition, the effect of the optical sensor according to the folding was additionally tested using a bending machine. In the future, we plan to intensively study folding (bending) and stretching optical devices by forming stretchable semiconductor materials and electrodes on stretchable substrates.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.17 no.1
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• pp.31-37
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• 2024

In this study, we propose a machine vision-based pedestrian signal detection algorithm that operates efficiently even in computing resource-constrained environments. This algorithm demonstrates high efficiency within limited resources and is designed to minimize the impact of ambient lighting by sequentially applying HSV color space-based image processing, binarization, morphological operations, labeling, and other steps to address issues such as light glare. Particularly, this algorithm is structured in a relatively simple form to ensure smooth operation within embedded system environments, considering the limitations of computing resources. Consequently, it possesses a structure that operates reliably even in environments with low computing resources. Moreover, the proposed pedestrian signal system not only includes pedestrian signal detection capabilities but also incorporates IoT functionality, allowing wireless integration with a web server. This integration enables users to conveniently monitor and control the status of the signal system through the web server. Additionally, successful implementation has been achieved for effectively controlling 50W LED pedestrian signals. This proposed system aims to provide a rapid and efficient pedestrian signal detection and control system within resource-constrained environments, contemplating its potential applicability in real-world road scenarios. Anticipated contributions include fostering the establishment of safer and more intelligent traffic systems.

• Transactions on Electrical and Electronic Materials
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• v.14 no.4
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• pp.211-215
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• 2013

Partial discharge diagnosis techniques using ultra high frequencies do not affect load movement, because there is no interruption of power. Consequently, these techniques are popular among the prevention diagnosis methods. For the first time, this measurement technique has been applied to the GIS, and has been tested by applying an extra high voltage switchboard. This particular technique makes it easy to measure in the live state, and is not affected by the noise generated by analyzing the causes of faults ? thereby making risk analysis possible. It is reported that the analysis data and the evaluation of the risk level are improved, especially for poor location, and that the measurement of Ultra high frequency (UHF) partial discharge of the real live wire in industrial switchgear is spectacular. Partial discharge diagnosis techniques by using the Ultra High Frequency sensor have been recently highlighted, and it is verified by applying them to the GIS. This has become one of the new and various power equipment techniques. Diagnosis using a UHF sensor is easy to measure, and waveform analysis is already standardized, due to numerous past case experiments. This technique is currently active in research and development, and commercialization is becoming a reality. Another aspect of this technique is that it can determine the occurrences and types of partial discharge, by the application diagnosis for live wire of ultra high voltage switchgear. Measured data by using the UHF partial discharge techniques for ultra high voltage switchgear was obtained from 200 places in Gumi, Yeosu, Taiwan and China's semiconductor plants, and also the partial discharge signals at 15 other places were found. It was confirmed that the partial discharge signal was destroyed by improving the work of junction bolt tightening check, and the cable head reinforcement insulation at 8 places with a possibility for preventing the interruption of service. Also, it was confirmed that the UHF partial discharge measurement techniques are also a prevention diagnosis method in actual industrial sites. The measured field data and the usage of the research for risk assessment techniques of the live wire status of power equipment make a valuable database for future improvements.

• Journal of the Korean Society of Radiology
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• v.11 no.1
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• pp.37-42
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• 2017

We measured the absorbed dose and the area dose using an ionization chamber type of area dose product (DAP) meter and measured the calibration factor in the X-ray examination. In the indirect dose measurement method, the detector was installed in the radiation part of the X-ray equipment, and the measured value was calculated as the dose at the exposure part. The instrument used to calculate the calibration factor was an X-ray equipment (DK-550R / F, DongKang Medical Co., Ltd., Seoul, Korea). The calibration method for the calibration factor was to connect the DAP meter (PD-8100, Toreck Co. Ltd., Japan) to the calibration dosimeter tube voltage of 70 kV, tube current of 500 mA, 0.158 sec. The reference dosimeter used a semiconductor (DOSIMAX plus A, Scanditronix, $Wellh{\ddot{o}}fer$, Germany). After installing the DAP meter on the front of the multi-collimator of the ionization chamber, the calibration factor of the dosimeter was obtained using the reference dosimeter for accurate dose measurement. Experimental exposure values and values from the calibration dosimeter were calculated by multiplying each calibration factor. The calibration factor was calculated as 1.045. In order to calculate the calibration coefficient according to the tube voltage in the ionization type DAP dosimeter, the absorbed dose and the area dose were calculated and the calibration factor was calculated. The corrective area dose was calculated by calculating the calibration factor of the DAP meter.