• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.81-85
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• 2022

Mist-CVD is known to have advantages of low cost and high productivity method since the precursor solution is misting with an ultrasonic generator and reacted on the substrate under vacuum-free conditions of atmospheric pressure. However, since the deposition distribution is not uniform, various efforts have been made to derive optimal conditions by changing the angle of the substrate and the position of the outlet to improve the result of the preceding study. Therefore, in this study, a deposition distribution uniformity model was derived through the shape and position of the substrate support and the conditions of inlet flow rate using the particle tracking method of computational fluid dynamics (CFD). The results of analysis were compared with the previous studies through experiment. It was confirmed that the rate of deposition area was improved from 38.7% to 100%, and the rate of deposition uniformity was 79.07% which was higher than the predicted result of simulation. Particle tracking method can reduce trial and error in experiments and can be considered as a reliable prediction method.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.26 no.2
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• pp.188-197
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• 2016

Objectives: The purpose of this study was to evaluate the ozone exposure levels and the variations in ozone concentration in a semiconductor fabrication facility and office in relation to the ozone concentration in the outdoor air. Methods: This study was performed in an office, semiconductor fabrication facility(such as etching, diffusion, diffusion plenum), and outdoors from June to August, 2015. Measurements were taken six times at the same places using an active sampler(pumped) and real-time equipment. Ozone monitoring by the active sampler method and analysis were carried out by OSHA Method ID-214. Real-time measurement was carried out by ozone measuring equipment using a non-dispersive ultraviolet absorption method. Results: Ozone concentrations in the semiconductor fabrication facility and office were 0.7~7.1 ppb in area samples and 0.72~4.07 ppb in real-time measurement, which were 0.88~8.88% of the occupational exposure limit. The concentration of ozone generated by a laser printer in the office was less than 2 ppb. There was not a significant difference between ozone concentrations before and after using the laser printer. The indoor/outdoor concentration ratio(I/O ratio) in the semiconductor fabrication facility and office was 0.05 and 0.06, respectively. Conclusions: All the samples contained ozone levels lower than the occupational exposure limit and it was confirmed that the concentration of outdoor ozone had no significant effect on indoor ozone concentration.

• Journal of the Korean Society of Industry Convergence
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• v.15 no.1
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• pp.37-42
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• 2012

Trends in semiconductor equipment industry are to reduce the cost of producing semiconductor, semiconductor process development, facility development, and the minimum investment in terms of cost and quality. Semiconductor equipments are being considered to review and development is proceeding at the same time. In the first part of the semiconductor assembly process, in which the importance of die bonding process is emerging, a wide leadframe type die bonding machine is demanded for productivity. Die bonding machine was designed through experiments and by trial and error. It costs a lot of time and financial burden. The purpose of this study is to solve these problems by using the CAE tool 3G. By using finite element method, thermal analysis of die bonding machine to the various widths leadframe die bonder machine rail is performed for design.

• Journal of Information Processing Systems
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• v.10 no.3
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• pp.429-442
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• 2014

In this paper, we investigated the use of seasonal autoregressive integrated moving average (SARIMA) time series models for fault detection in semiconductor etch equipment data. The derivative dynamic time warping algorithm was employed for the synchronization of data. The models were generated using a set of data from healthy runs, and the established models were compared with the experimental runs to find the faulty runs. It has been shown that the SARIMA modeling for this data can detect faults in the etch tool data from the semiconductor industry with an accuracy of 80% and 90% using the parameter-wise error computation and the step-wise error computation, respectively. We found that SARIMA is useful to detect incipient faults in semiconductor fabrication.

• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.113-118
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• 2011

According to the high accuracy of semiconductor equipments, PCB substrate with much thin thickness is required. However, it is very difficult to sustain the PCB substrate without deformation in case of horizontal installation, due to low bending stiffness. In this research, new PCB process equipment with vertical installation has been developed in order to solve the problem of PCB substrate damage during etching process. As the main parts of etching system on PCB substrate, PCB substrate and JIG are analyzed through finite element method and experimental test. Through the analysis results of stress state, we could find the optimal JIG design to make the damage as low as possible.

• Journal of the Semiconductor & Display Technology
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• v.19 no.3
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• pp.55-60
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• 2020

The hard mask photo-resist strip inspection system for the semiconductor wafer manufacturing process inspects the position of the circuit pattern formed on the wafer by measuring the distance from the edge of the wafer to the strip processing area. After that, it is an inspection system that enables you to check the process status in real time. Process defects can be significantly reduced by applying a tester that has not been applied to the existing wafer strip process, edge etching process, and wafer ashing process. In addition, it is a technology for localizing semiconductor process inspection equipment that can analyze the outer diameter of the wafer and the state of pattern formation, which can secure process stability and improve wafer edge yield.

• Journal of the Korea Safety Management & Science
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• v.7 no.5
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• pp.255-273
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• 2005

Overlay parameter control of the semiconductor photolithography process is researched in this paper. Overlay parameters denote the error in superposing the current pattern to the pattern previously created. The reduction of the overlay deviation is one of the key factors in improving the quality of the semiconductor products. The semiconductor process is affected by numerous environment and equipment factors. Through process condition prediction and control, the overlay inaccuracy can be reduced. Generally, three types of process condition change exist; uncontrollable white noise, slowly changing drift, and abrupt condition shift. To effectively control the aforementioned process changes, control scheme using adaptive deadband is proposed. The suggested approach and existing control method are cross evaluated through simulation.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.72-74
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• 2002

A submicron contact scheme using $WN_x$ diffusion barrier has been suggested for multilevel interconnect structure. The contact resistance of $0.4\times0.48\mu\textrm{m}^2$ size Al/WN/Ti/$n^+$-Si is 120-140 $\Omega$ and the leakage current density is below than $10^{-16}$$-10^{-15}A/\mu\textrm{m}^2$. The effect of F atoms on the submicron contact has been investigated with the nuclear resonance analysis method.

• Journal of the Semiconductor & Display Technology
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• v.9 no.4
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• pp.71-76
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• 2010

According to recent changes in industry for semiconductor devices, a low-temperature treatment has become a necessity. These changes relate to size refinement and the development of new materials. While variation in cooling efficiency does not affect the yield when using a high-temperature treatment, uniform cooling efficiency is necessary avoid "inconsistencies/bends" in low temperature treatments. However it is difficult to increase temperature stabilization in low temperature treatments. In this paper, using CFD (Computer Fluid Dynamics), we analyze and manipulate the design and input of the low-temperature system to attempt to control for temperature variations within the quartz tube, of which airflow appears to be a predominant factor. This simulation includes variable inputs such as airflow rate, head pressure, and design manipulations in the S.C.U. (Super Cooling Unit).

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.123-128
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• 2004

Semiconductor Wet Station has a very important place in semiconductor process. It is important that to discharge chemical with fit concentration and temperature using chemical supply system for clean process. The chemical supply system which is used currently is not only difficult to make a fit mixing rate of chemical which is need in clean process, but also difficult to make fit concentration and temperature. Moreover, it has high stability but it is inefficient spatially because its volume is great. We propose In-line System to improve system with implement analysis of fluid and thermal transfer on chemical supply system and understand problem of system.