• 한국안전학회지
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• 제15권4호
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• pp.62-68
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• 2000

Static electricity in electronics manufacturing plants causes the economic loss, yet it is one of the least understood and least recognized effects haunting the industry today. Today's challenge in semiconductor devices is to achieve greater functional density pattern and to miniaturize electronic systems of being more fragile by electrostatic discharges(ESD) phenomena. As the use of automatic handling equipment for static-sensitive semiconductor components is rapidly increased, most manufacturers need to be more alert to the problem of ESD. One of the most common causes of electrostatic damage is the direct transfer of electrostatic charge from the human body or a charged material to the static-sensitive devices. To evaluate the ESD hazards by charged human body and devices, in this paper, characteristics of electrostatic attenuation in domestic semiconductor devices is investigated and the voltage to cause electronic component failures is investigated by field-induced charged device model(FCDM) tester. The FCDM simulator provides a fast and inexpensive test that faithfully represents ESD hazards in plants. Also the results obtained in this paper can be used for the prevention of semiconductor failure from ESD hazards.

• 방사선산업학회지
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• 제18권1호
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• pp.79-87
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• 2024

In a previous study, the suitability for use of inspection equipment was evaluated at temperatures outside the quality assurance range. The quality assurance operating temperature of the safeguards equipment is 0~+40℃, and previous studies have confirmed the performance of the safeguards equipment for temperatures ranging from -40~+70℃. The scintillator-based verification equipment showed a shift in the centroid channel and a change in the count rate in all temperature ranges, and the semiconductor-based safeguards equipment generated Leakage Current and equipment failure. In this study, a retrofit was performed applying a vacuum housing to the safeguards equipment (Inspector-2000-based inspection equipment), and performance evaluation was performed at a low temperature and snowy site, and it was confirmed that the same performance was observed as the measurement results at room temperature.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.647-650
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• 2006

Low temperature polycrystalline silicon (LTPS) technology using a high power laser have been widely applied to thin film transistors (TFTs) for liquid crystal, organic light emitting diode (OLED) display, driver circuit for system on glass (SOG) and static random access memory (SRAM). Recently, the semiconductor industry is continuing its quest to create even more powerful CPU and memory chips. This requires increasing of individual device speed through the continual reduction of the minimum size of device features and increasing of device density on the chip. Moreover, the flat panel display industry also need to be brighter, with richer more vivid color, wider viewing angle, have faster video capability and be more durable at lower cost. Kornic Systems Co., Ltd. developed the $KORONA^{TM}$ LTP/GLTP series - an innovative production tool for fabricating flat panel displays and semiconductor devices - to meet these growing market demands and advance the volume production capabilities of flat panel displays and semiconductor industry. The $KORONA^{TM}\;LTP/GLTP$ series using DPSS laser and XeCl excimer laser is designed for the new generation of the wafer & FPD glass annealing processing equipment combining advanced low temperature poly-silicon (LTPS) crystallization technology and object-oriented software architecture with a semistandard graphical user interface (GUI). These leading edge systems show the superior annealing ability to the conventional other method. The $KORONA^{TM}\;LTP/GLTP$ series provides technical and economical benefits of advanced annealing solution to semiconductor and FPD production performance with an exceptional level of productivity. High throughput, low cost of ownership and optimized system efficiency brings the highest yield and lowest cost per wafer/glass on the annealing market.

• 반도체디스플레이기술학회지
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• 제12권3호
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• pp.19-22
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• 2013

The purpose of this study is to develop a system that can monitor the amounts of energy consumption during CVD and etching process for semiconductor manufacturing. Specifically, this system is designed to measure the $CO_2$ emission amounts quantitatively by measuring the flow rate of gas used and amount of power consumed during the processes. The processes of CVD equipment can be classified generally into processing step and cleaning step and all the two steps were monitored. In CVD and etcher equipments, various gases including Ar and $O_2$ are used, but Ar, $O_2$ and He were monitored with the use of the LCI data of Korea Environmental Industry & Technology Institute and carbon emission coefficients of EcoInvent. As a result, it was found that the carbon emission amounts of CVD equipment for Ar, $O_2$ and He were $0.030kgCO_2/min$, $4.580{\times}10^{-3}kgCO_2/min$ and $6.817{\times}10^{-4}kgCO_2/min$, respectively and those of etcher equipment for Ar and $O_2$ are $5.111{\times}10^{-3}kgCO_2/min$ and $7.172kgCO_2/min$, respectively.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2001년도 춘계학술대회논문집
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• pp.869-874
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• 2001

In order that precision equipment using high precision industrial operate normally. vibration criteria of expected area that equipment be set up is micrometer level. that method is a trust design for apply to in field, when there attend to quantifiable method. Hence, semi -empirical method that using on the basis of experimental data about undefined information (properities of vibration source, dynamic properities of structure, etc.,) for prediction of vibration response make the use of dynamic structure design of semiconductor ＆ TFT-LCD in the inside and outside country. Like this, for doing an optimal design of dynamic about structure, it is best important to get trust data that apply to semi-empirical method that is method of prediction vibration level. In this paper, on the basis of experimental data which was offered by a manufacturing company Of precisin equipment that plan to set up in semiconductor factory, we predicted vibration response on expected area that equipment be set up.

• 반도체디스플레이기술학회지
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• 제8권4호
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• pp.53-58
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• 2009

A SMT mounter is a kind of equipment that mounts SMD parts quickly on the printed circuit board. By using linear motors, it is controlled with high speed and precision, which is similar to semi-conductor and display process equipment. It is necessarily used in an assembly process of an electronic device. Mobile devices such as a mobile phone and PDA are required to reduce mount areas due to the demands for high performance and small size. Hence, super small sized and complex mobile devices have been developed. To improve the productivity of the corresponding equipment, designs with large sized, high speed, and multidisciplinary functions have been consistently performed. Meanwhile, a design trend of large size and light-weight on SMT mounter causes a low natural frequency of systems and vibration problems at the high speed operation. In this paper, the dynamic characteristics of the SMD mounter system were investigated through a modal test and transmissibility test, and verified by finite element method. Also, various design improvement was performed to avoid the resonance phenomena.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2006년도 제30회 학술논문발표회 초록집
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• pp.101-101
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• 2006

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2011년도 춘계학술대회
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• pp.136-139
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• 2011

현재의 반도체 검사장비는 테스트 패턴 프로그램을 위한 메모리로 시스템 설계가 간단하고 리프레시가 필요 없는 SRAM(static random access memory) 모듈을 채용하고 있다. 그러나 SRAM 모듈을 이용한 시스템 구성은 용량이 커질수록 장비의 부피가 증가하기 때문에 메모리 대용량화 및 장비의 소형화에 걸림돌이 되고 있다. DRAM(dynamic random access memory)을 이용하여 반도체 검사 장비를 제작할 경우 SRAM 보다 비용과 장비의 면적이 줄어드는 장점이 있지만 DRAM의 특성 상메모리 셀 리프레시가 필요하여 정시성을 보장해야 하는 문제가 있다. 따라서 본 논문에서는 이러한 문제를 해결하기 위해 DDR2 SDRAM(double data rate synchronous dynamic random access memory)을 이용한 비메모리 검사장비에서 정시성을 보장해 주는 알고리즘을 제안하고 알고리즘을 이용한 메모리 컨트롤러를 제작하였다.

• 디지털융복합연구
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• 제17권7호
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• pp.125-130
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• 2019

민감도 해석은 어떤 설계 변수의 변화가 전체 시스템에 미치는 영향을 확인하기 위한 방법으로, 계산된 민감도는 구조개선 시 중요한 지표가 된다. 본 연구에서는 유한요소해석을 이용하여 설계 변수에 대한 민감도 도출 및 분석 방법과, 민감도 결과를 활용한 구조개선 방법을 제안하였다. 구조 개선이 필요한 실제 반도체 검사 장비를 이용하여 경량화를 위한 설계 변수를 선정하고 설계 변수에 대한 민감도를 유한요소법과 유한차분법을 활용하여 계산하였으며, 장비가 요구하는 과도응답(Transient Response)은 유지하면서도 무게 감소가 가능한 개선 방안을 제시하였다. 유한요소해석과 유한차분법을 이용한 민감도 분석 결과를 이용한다면 구조물의 설계 개선 시 원하는 응력 또는 변위는 만족하면서도 구조적으로 향상된 설계를 할 수 있고, 이는 반도체 검사 장비뿐만 아니라 다양한 분야에서 활용이 가능하다.

• 응용통계연구
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• 제34권1호
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• pp.99-114
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• 2021

반도체 제조 산업에서는 Big Data에 기초한 Smart Factory 도입과 적용이 가시화되면서 생산 공정의 각 단계에서 수집 가능한 다양한 센서(sensor) 데이터를 활용하여 공정 이상 탐지 및 최종 수율 예측 등에 다양한 분석 방법을 시도하고 있다. 현재 반도체 공정은 원료인 잉곳(ingot)에서 패키징(packaging) 작업 이전의 웨이퍼(wafer) 생산까지 500 600개 이상의 세부 공정과 이와 연계된 수천 개의 계측 공정으로 구성된다. 개별 계측 공정 내의 실제 계측 비율은 대상 제품 대비 0.1%에서 최대 5%를 넘지 못하고 계측 시점별로 일정하게 유지할 수 없다. 이러한 이유로 공정 각 단계의 정상 상태를 간접적으로 판단할 수 있는 장비 센서(sensor) 데이터를 활용하여 관리 여부를 판단하고자 하는 노력이 계속되고 있다. 본 연구에서는 장비 센서 데이터 기반의 공정 이상 탐지 프로세스를 정의하고 현재 적용 되고 있는 기술 통계량 기반 진단 방법의 단점을 보완하기 위해 FDA(Functional Data Analysis)방법을 활용하였다. 실제 현장 사례 데이터에 머신러닝을 이용하여 이상 탐지 정확도 비교를 통해 효과성을 검증하였다.