• 제목/요약/키워드: semiconductor chiller equipment

검색결과 2건 처리시간 0.014초

반도체 공정 칠러 장비의 히터 접속부 전기배선에 대한 열적 특성 분석 (Analysis of Thermal Characteristic for Wiring at Heater Connector of Semiconductor Chiller Equipment)

  • 김규빈;김두현;김성철
    • 한국안전학회지
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    • 제38권3호
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    • pp.27-34
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    • 2023
  • With the technological development of the semiconductor industry, the roles of electrical and thermal energy supply and control of semiconductor equipment in ultrafine processes have become very important. However, instances of electrical fires in the chiller heater, which is used for cooling in the semiconductor manufacturing process, are increasing. A fire occurs in combustibles due to high heat at the connection part of the chiller heater, that is, when the number of electrical wires in the connection part is reduced or when the wires are completely disconnected. In this study, the temperature characteristics were compared and analyzed through experiments and 3D simulations. The number of electrical wires, which is the connection part of the chiller heater, was reduced by 90%, 50%, 30%, 10%, and 5%, and the wires were completely disconnected. When the number of electrical wires was reduced by 5%, heat of up to 80℃ was generated, which is a relatively high temperature but insufficient to cause a fire in combustibles. Complete disconnection occurred due to the vibration of the motor and other components, and sparks and arcs were generated, resulting in a rapid increase in temperature to up to 680℃. When completely disconnected, the temperature increase was sufficient to cause a fire in the combustibles covering the terminal block. Therefore, in this study, the causes of electrical fires in chiller heaters were investigated and preventive measures were proposed by analyzing abnormal signals and thermal characteristics caused by the electrical wiring being reduced and completely disconnected.

알루미나 나노 다공성 박막공정용 전기화학 양극산화 장치의 제작

  • 최재호;백하봉;김근주
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2007년도 춘계학술대회
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    • pp.230-233
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    • 2007
  • A system of anodic process of aluminum thin film has implemented for nanofabrication. The manufactured equipment consists of three main parts: chiller, reaction bath and power supply. The chiller module consists of refrigeration compressor, copper tube and coolant with a thermostat. The reaction bath has kept in same temperature as a thermodynamic canonical ensemble system during the anodic reaction process. The magnetic bar has stirred oxalic acid in bath for uniform reaction. The DC power supply has applied into two electrodes, aluminum for anode and platinum for cathode in the oxalic acid. The anodization process results in the formation of nanoporous thin films.

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