• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.355-358
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• 2009

This paper presents the technology of selective emitter for high efficiency crystalline silicon solar cell. The effect of selective emitter is analyzed by using the simulation program for solar cell, PC1D. The selective emitter shows better spectral response in short wavelength regions compared to homogeneous emitter. Therefore, the efficiency of solar cell with selective emitter can be improved by changing the sheet resistance from 60 $\Omega/\square$ to 120 $\Omega/\square$. In addition, the power loss of solar cell can be minimized by optimizing width and gap of the finger electrodes on the selective emitter.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.234-234
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• 2010

Most high efficiency silicon solar cells use a passivated selective emitter. It have been an important research subject for crystalline silicon solar cells for decades. It is being used in production for high efficiency solar cells. Most of the selective emitter process require expensive extra masking, etching steps, and a double diffusion process making selective emitters not cost effective. In this paper, we study method for single diffusion step selective emitter process as an alternative to not cost effective double diffusion process. Cost effective selective emitter that the efficiency should be increased significantly (mare than 0.2%) and that the process should simple, robust and cheap.

• Journal of the Korean Solar Energy Society
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• v.32 no.5
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• pp.102-107
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• 2012

Halogen lamp was applied to fabricate the selective emitter crystalline silicon solar cell. In selective emitter structure, the recombination of minority carriers is reduced with heavily doped emitter under metal grid, consequently improving the conversion efficiency. Laser selective emitter process which is recently used the most generally induces the damage on the silicon surface. However the lamp has enough heat to form heavily doped emitter layer by diffusing phosphorus from PSG without surface damage. In this work, we have studied to find the design and the suitable condition for halogen lamp such as power, time, temperature and figured out the possibility to fabricate the selective emitter silicon solar cell by lamp heating. The sheet resistance with $100{\Omega}/{\Box}$ was lower to $50{\Omega}/{\Box}$ after halogen lamp treatment. Heat transfer to lightly doped emitter region was blocked by using the shadow mask.

• Korean Journal of Materials Research
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• v.31 no.12
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• pp.727-731
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• 2021

In this study, we have investigated a selective emitter using a UV laser on BBr₃ diffusion doping layer. The selective emitter has two regions of high and low doping concentration alternatively and this structure can remove the disadvantages of homogeneous emitter doping. The selective emitters were fabricated by using UV laser of 355 nm on the homogeneous emitters which were formed on n-type Si by BBr₃ diffusion in the furnace and the heavy boron doping regions were formed on the laser regions. In the optimized laser doping process, we are able to achieve a highly concentrated emitter with a surface resistance of up to 43 Ω/□ from 105 ± 6 Ω/□ borosilicate glass (BSG) layer on Si. In order to compare the characteristics and confirm the passivation effect, the annealing is performed after Al₂O₃ deposition using an ALD. After the annealing, the selective emitter shows a better effect than the high concentration doped emitter and a level equivalent to that of the low concentration doped emitter.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.454-455
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• 2009

Selective emitter structure have an important research subject for crystalline silicon solar cells because it is used in production for high efficiency solar cells. A selective emitter structure with highly doped regions underneath the metal contacts is widely known to be one of the most promising high-efficiency solution in solar cell processing. Since most of the selective emitter processes require expensive extra masking and double steps process. Formation of selective emitters is not cost effective. One method that satisfies these requirements is the method of screen-printing with a phosphorus doping paste. In this paper we researched two groups of selective emitter structure process. One was using dopant paste, and the other was using solid source, in order to compare their uniformity, sheet resistance and performance condition time.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.53.1-53.1
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• 2010

결정질 실리콘 태양전지의 효율을 향상시키기 위하여 수광면에 서로 다른 도핑농도를 가지는 고농도 도핑영역과 저농도 도핑영역으로 이루어진 emitter를 형성하는 것이 요구되며 이를 selective emitter라 칭한다. Selective emitter를 형성하면 고농도 도핑영역에서 금속전극과 저항 접촉이 잘 형성되기 때문에 직렬 저항이 최소화되고 저농도 도핑영역에서는 전하 재결합의 감소로 인하여 태양전지의 변환효율이 상승하는 이점이 있다. Selective emitter의 형성방법은 이미 다양한 방법이 제안되고 있으나, 본 연구에서는 기존에 제시된 방법과는 다르게 열산화 시 dopant redistribution에 의한 Boron depletion 현상을 이용하여 selective emitter를 형성하는 방법을 제안하였고, 이를 Simulation을 통하여 검증하였다. 초기 emitter 확산 후 junction depth는 0.478um, 면저항은 $104.2{\Omega}/sq.$ 이었으며, nitride masking layer 두께는 0.3um로 설정하였다. $1100^{\circ}C$에서 30분간 습식산화 공정을 거친 후 nitride mask가 있는 부분의 junction depth는 1.48um, 면저항은 $89.1{\Omega}/sq$의 값을 보였고, 산화막이 형성된 부분의 junction depth는 1.16um, 면저항은 $261.8{\Omega}/sq$의 값을 보였다. 위 조건의 구조를 가진 태양전지의 변환 효율은 19.28%의 값을 나타내었고 Voc, Jsc 및 fill factor는 각각 645.08mV, $36.26mA/cm^2$, 82.42%의 값을 보였다. 한편 일반적인 구조로 설정한 태양전지의 변환 효율, Voc, Isc 및 fill factor는 각각 18.73%, 644.86mV, $36.26mA/cm^2$, 80.09%의 값을 보였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.44.1-44.1
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• 2011

본 연구에서는 태양전지 설계를 위해 기존의 반도체소자 simulation에 사용되고 있는 Silvaco TCAD tool을 사용하여 p+ boron emitter의 특성분석 실험을 하였다. 변수로는 emitter의 농도와 접촉저항 이 두 가지 놓고 표면 재결합과 의 영향을 염두에 두고 실험을 하였다. 농도는 $1{\times}10^{17}\;cm^{-3}$에서 $2{\times}10^{22}\;cm^{-3}$까지 두었고, 각각의 농도에 해당되는 contact 저항을 설정하여 전기적 특성을 보았다. 실험 결과 두 가지 변수를 모두 입력하였을 때 처음에 Isc가 조금씩 올라가다가 $1{\times}10^8\;cm^{-3}$에서 가장 높았고 그 이후에는 표면 재결합이 커지면서 Isc가 계속 떨어졌다. 하지만 contact 저항으로 인해 가장 높은 효율은 $1{\times}10^9\;cm^{-3}$ 부근에서 보였다. 농도에 따라 표면 재결합과 contact 저항이 서로 반대로 변하기 때문에 emitter를 표면 재결합이 늘어남에도 불구하고 contact 저항으로 인해 비교적 고농도로 doping 해야만 했다. 하지만 우리가 준 contact 저항은 농도에 따라 생긴 저항으로 실제 전극의 contact 저항은 훨씬 더 클 것으로 예상되고 이로 인해 더 고농도의 doping이 필요하게 된다. 그렇게 된다면 표면의 재결합으로 인한 손실은 더 크게 되어 전체적으로 효율은 떨어진다. 우리는 이 손실을 보완하고 줄이기 위해 selective emitter 개념을 넣어 이에 대한 영향은 보았다. selective를 하지 않은 $1{\times}10^{19}\;cm^{-3}$의 doping 농도의 가장 높은 효율을 보인 기존의 emitter와 전극 부분을 제외한 표면은 $1{\times}10^{18}\;cm^{-3}$으로 하고 전극 부분의 emitter는 $2{\times}10^{20}\;cm^{-3}$으로 한 selective emitter를 비교해보았다. 이는 selective emitter가 기존 emitter에 비해 Isc와 Fill Factor로 인해 효율이 약 0.7% 정도 높았다.

• 한국태양에너지학회:학술대회논문집
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• 2011.11a
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• pp.56-59
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• 2011

The process conditions for high efficiency industrial crystalline Si solar cells with selective emitter were optimized. In the screen printed solar cells, the sheet resistance must be 50-60V/sq. because of metal contact resistance. But the low sheet resistance causes the increase of the recombination and blue response at the short wavelength. Therefore, the screen printed solar cells with homogeneous emitter have limitations of efficiency, and this means that the selective emitter must be used to improve cell efficiency. This work demonstrates the feasibility of a commercially available selective emitter process, based on screen printing and conventional diffusion process. Now, we improved cell efficiency from 18.29% to18.45% by transition of heavy emitter pattern and shallow emitter doping condition.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.91.2-91.2
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• 2010

The use of plated front contact for metallization of silicon solar cell may alternative technologies as a screen printed and silver paste contact. This technologies should allow the formation of contact with low contact resistivity a high line conductivity and also reduction of shading losses. The better performance of Ni/Cu contacts is attributed to the reduced series resistance due to better contact conductivity of Ni with Si and subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading combined with the lower resistance of a metal silicide contact and improved conductivity of plated deposit. This improves the FF as the series resistance is deduced. This is very much required in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing. This paper using selective emitter structure technique, fabricated Ni/Cu plating metallization cell with a cell efficiency of 17.19%.

• 한국태양에너지학회:학술대회논문집
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• 2011.11a
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• pp.40-44
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• 2011

Recent studies in crystalline silicon solar cell fabrication have been focused on high efficiency and low cost. However, the rising of the cost results in additional processes to approach high efficiency. The fabrication process also becomes complicated with additional technologies. In this paper, we studied the selective emitter formation with phosphorous paste to improve the conversion efficiency. Selective emitter formations like two-step diffusion or etch-back method require at least one more step compared in the conventional line since heavily and lightly doped area was needed to form separately.However,one-step diffusion process is the method diffusing heavily and lightly doped area at the same time only with additional screen-printing step. This study lays the foundation for the simple way to form the selective emitter.