Fabrication Method of High-density and High-uniformity Solder Bump without Copper Cross-contamination in Si-LSI Laboratory (실리콘 실험실에 구리 오염을 방지 할 수 있는 고밀도/고균일의 Solder Bump 형성방법)
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- Journal of the Microelectronics and Packaging Society
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- v.7 no.4
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- pp.23-29
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- 2000