• Tribology and Lubricants
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• v.24 no.6
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• pp.332-337
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• 2008

This paper presents the surface defect analysis based on the experimental investigation of scribed glasses. The scribing process by a diamond wheel cutter is widely used as a reliable and inexpensive method for sizing of glass sheets. The wheel cutter generates a small median crack on the glass surface, which is then propagated through the glass thickness for complete separation. The surface contour patterns in which are formed during a scribing process are strongly related to wheel cutter parameters such as wheel tip surface finish, tip angle and wheel diameter, and cutting process parameters such as scribing pressure, speed and tooling technique. The scribed surface of a glass sheet provides normal Wallner lines, which represent regular median cracks and crack propagation in glass thickness, and abnormal surface roughness patterns. In this experimental study, normal and abnormal surface topographic patterns are classified based on the surface defect profiles of scribed glass sheets. A normal surface of a scribed glass sheet shows regular Wallner lines with deep median cracks. But some specimens of scribed glass sheets show that abnormal surface profiles of glass sheets in two pieces are represented by a chipping, irregular surface cracks in depth, edge cracks, and combined crack defects. These surface crack patterns are strongly related to easy breakage of the scribed glass imposed by external forces. Thus the scribed glass with abnormal crack patterns should be removed during a quality control process based on the surface defect classification method as demonstrated in this study.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.6
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• pp.1319-1324
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• 2007

Accurately controlling the shape of the read/write head structure is critical in the performance of a modem hard disk drive. The sliders investigated are composed of alumina and titanium carbide(AITiC) and act as an air bearing when passing over the disks. Controlling the curvature of the slider is of primary importance. A laser scribing system that produces curvature by inducing residual stress into the slider can be utilized. Predicting the curvature created by a pattern of scribes is of great importance to increase the control over the sliders' shape. The force system that produces stresses similar to the laser scribing is applied to the finite element analysis model. The curvatures created by the force system are calibrated to experimental measurements.

• Proceedings of the Korean Vacuum Society Conference
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• 2008.08a
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• pp.330-330
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• 2008

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1996.03a
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• pp.36-40
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• 1996

• Journal of the Korean Society of Industry Convergence
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• v.20 no.4
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• pp.307-311
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• 2017

Ultra short pulse laser processing with the PI (polyimide) substrate is conducted to increase flexibility and radius of curvatures. A femtosecond laser is used to perform micro machining by minimizing the heat effect in PI substrate. The laser processing according to the parameters, such as fabricated line width, depth, laser power, distance between lines, is carried out to understand the characteristics of fabricated lines. A bending test is carried out to evaluate bending shapes and the radius of curvature after bending and spreading it 1000 times. The results demonstrates that the radius of curvature decreases in deepen lines and increases with the augment of the number of the fabricated lines, and distance between lines.

• Journal of Institute of Control, Robotics and Systems
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• v.8 no.5
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• pp.419-424
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• 2002

After the patterning and probe process of wafer have been achieved, the dicing processing is necessary to separate chips from a wafer. The dicing process cuts a semiconductor wafer to lengthwise and crosswise directions to make many chips. The existing general dicing method is the mechanical cutting using a narrow circular rotating blade impregnated diamond particles or laser cutting. Inferior goods can be made by the mechanical or laser cutting unless several parameters such as blade, wafer, cutting water and cutting conditions are properly set. Moreover, we can not apply these general dicing method to that of GaN wafer, because the GaN wafer is harder than general semiconductor wafers such as GaAs, GaAsP, AIGaAs and so forth. In order to overcome these problems, this paper describes a new wafer dicing method using fixed diamond scriber and precision servo mechanism.

• Korean Journal of Materials Research
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• v.27 no.5
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• pp.248-254
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• 2017

In the present work, graphene powder was synthesized by laser scribing method. The resultant flexible light-scribed graphene is very appropriate for use in micro-supercapacitors. The effect of the laser scribing process in reducing graphene oxide (GO) was investigated. GO was synthesized using a chemical mixture of GO solution; then, it was coated onto a LightScribe DVD disk and laser scribed to reduce GO and create laser-scribed graphene (LSG). The CV curves of pristine rGO at various scan rates showed that the ultimate product possesses the ability to store energy at the supercapacitor level. Charge-discharge curves of pristine rGO at two different current densities indicated that the specific capacitance ($C_m$) increases due to the reduction of the discharge current density. Finally, the long-term charge-discharge stability of the LSG was plotted and indicates that the specific capacitance decreases very slightly from its primary capacitance of ${\sim}10F\;cm^{-3}$ and that the cyclic stability is favorable over 1000 cycles.

• Korean Journal of Materials Research
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• v.18 no.5
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• pp.247-252
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• 2008

A laser glass cutting system using a femto-second laser was evaluated for Flat Panel Display (FPD) glass. A theoretical analysis of the ablation threshold and depth is described using an explicit analytic form. Experiments for clean and deep grooves were performed using a 3W femto-second laser, and the relationships between the input energy and the scribing depth as well as the threshold energy are presented. Mechanical breaking after the scribing process was carried out and the results are compared with a theoretical method. It was found that a two-sided LCD panel glass can be cut clearly using the laser cutting method. The methodology was found to be very effective as a mass-production cutting system.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.303-304
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• 2008

• Proceedings of the Korean Society of Laser Processing Conference
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• 2005.06a
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• pp.15-20
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• 2005