• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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• pp.123.1-123.1
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• 2011

기존의 p-type 태양전지 공정과 유사한 공정으로 제작되는 n-type $ALU^+$태양전지는 후면에 Al을 screen printing하여 emitter층을 형성한 구조이다. screen printing은 공정의 단순화와 제조 단가의 저비용으로 인해, metalization 공정에서 많이 쓰이고 있다. 본 연구에서는 양산 가능한 n-type $ALU^+$태양전지 제작을 위해, 후면 Al emitter 층을 single, dobule, triple로 변경하며 Al의 양을 가변하였고, 그에 따른 특성의 변화를 연구하였다. screen printing 횟수가 변경된 후면 Al emitter 층의 특성은 DIV와 LIV 측정을 통해 분석하였다. 실험 결과 Al을 single printing 하였을 때보다, double, triple printing을 통하여 Al의 양을 증가하였을 때, DIV 데이터에서 직렬저항(Rs)가 $24.44{\Omega}/cm^2$에서 $0.31{\Omega}/cm^2$으로 감소하였고, 단락전류(Jsc)는 1.26mA/$cm^2$에서 37.7mA/$cm^2$으로 약 300% 증가한 것을 확인할 수 있었다. 프린팅 횟수에 따른 LIV 데이터의 Fill Factor를 분석하게 되면, double printing이 64.35%로 54.75%의 triple printing보다 약 1.17배 더 향상된 것으로 확인하였다. 이러한 결과를 바탕으로 후면 Al emitter 형성시에 Al의 양이 적절하지 못한 이유로, Al emitter가 제대로 형성되지 못하거나 과하게 형성되면, 태양전지 내부에 누설 저항의 변화와 누설 전류의 증가로 인해, 단락전류(Jsc)와 Fill Factor 감소의 주요 원인이 된다는 것을 확인할 수 있었다.

• 전기화학회지
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• 제3권4호
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• pp.235-240
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• 2000

고출력 전기화학 캐패시터를 위한 전극제조공정으로 screen printing과 doctor blade법이 연구되었다. Screen printing에 의해서 제작된 비정질 $MnO_2$전극으로 측정된 CV (cyclic voltammogram)는 이상적인 캐패시터에 가까운 특성을 보여주었다. 50mV/s의 scan rate에서의 CV로부터 계산된 비용량은 $140{\mu}m,\;24{\mu}m,\; 3{\mu}m$의 전극두께에 대해서 각각 5.8F/g과, 81.8F/g, 172.0F/g의 값을 나타내었다. Screen printing전극에서의 $MnO_2$활물질의 이용율을 $100\%$로 하였을 때, paste와 doctor blade법의 이용율은 각각 $3.4\%$와 $47.6\%$이었다. Screen printing은 고출력 응용을 위한 얇은 전극의 코팅 방법으로 우수한 특성을 보였다.

• Current Photovoltaic Research
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• 제5권1호
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• pp.9-14
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• 2017

The screen printing technique is one of process to form electrode for crystalline silicon solar cell and has been studied a lot, because it has many advantages such as low price, high efficiency and mass production due to simple and fast process. The reason why electrode formation is important is for influence of series resistance and amount of incident light in crystalline silicon solar cell. In this study, electrode was formed by screen printing method with various conditions like squeegee angle, printing speed, snap off, printing pressure. After optimizing various conditions, double printing method was applied to obtain low series resistance and high aspect ratio. As a result, we obtained electrode resistance 45.31 ohm, aspect ratio 4.38, shading loss 7.549% mono-crystalline silicon solar cell with optimal double screen printing condition.

• 한국생산제조학회지
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• 제21권3호
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• pp.408-414
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• 2012

Screen printing is a printing method that uses a woven mesh to support an ink-blocking stencil by transferring ink or other printable materials in order to form an image onto a substrate. Recently, the screen printing method has applied to micro-electronic packaging by using solder paste as a printable material. For the screen printing of solder paste, metal masks containing a number of micro-holes are used as a stencil material. The metal mask undergoes deformation when it is installed in the screen printing machine, which results in the deformation of micro-holes. In the present study, finite element (FE) analysis was performed to predict the amount of deformation of a metal mask. For an efficient calculation of the micro-holes of the metal mask, the sub-domain analysis method was applied to perform FE analyses connecting the global domain (the metal mask) and the local domain (micro-holes). The FE analyses were then performed to evaluate the effects of slot designs on the deformation characteristics, from which more uniform and adjustable deformation of the metal mask can be obtained.

• 한국전기전자재료학회논문지
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• 제13권11호
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• pp.921-925
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• 2000

Characteristics of Pb(Mg, Nb)O$_3$-Pb(Zr, Ti)O$_3$system thick films fabricated by a screen printing method were investigated. The buffer layer were coated with various thickness of Ag-Pd by screen printing to investigate the effect as a diffusion barrier and deposited Pt as a electrode by sputtering on Ag-Pb layer. The printed thick films were burned out at 650$\^{C}$ and sintered at 950$\^{C}$ in O$_2$condition for each 20, 60min after printing with 350mesh screen. The thickness of piezoelectric thick film was 15∼20㎛ and Ag-Pb layer acted as a diffusion barrier above 3㎛ thickness. The PMN-PZT thick films were screen printed on Pt/Ag-Pb(6m) and sintered by 2nd step (650$\^{C}$/20min and 950$\^{C}$/1h) using paste mixed PMN-PZT and binder in the ratio of 70:30, and the remnant polarization of thick film was 9.1$\mu$C/㎠ in this conditions.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.545-548
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• 2002

$(Ba_{0.6-x}Sr_{0.4}Ca_x)TiO_3$(BSCT) (x=0.10, 0.15, 0.20) powders were prepared by the sol-gel method and BSCT thick films were fabricated by the screen-printing method. The structural properties as a faction of the composition ratio were studied. As a result of the differential thermal analysis (DTA), exothermic perk was observed at around $860^{\circ}C$ dne to the formation of the polycrystalline perovskite phase. The BSCT thick films sintered at $1350^{\circ}C$ for 2h showed the average grain size of $2{\sim}7{\mu}m$. The average thickness of BSCT thick films, obtained by 3 times of screen-printing, was approximately $85{\mu}m$.

• 한국응용과학기술학회지
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• 제14권2호
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• pp.115-122
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• 1997

The field of printing use to pressurization ink using screen gassamer that is called screen printing. Existing cleaning solvent using screen printing are the organic solvents including aromatic compounds carried with poisonous and stench. Besides, cleaning method of current screen printing are for the most part mixed cleaning method of dipping and polish. Using 1,1,1-TCE, CFC-113 alternative system cleaning solvent be substituted for existing cleaning solvent against screen printing ink measured the cleaning efficiency according to gravimetric analysis method and property change of gassamer according to Image Analyzer. Also, Cleaning process system carry with excellent cleaning efficiency studied which was proposed new cleaning process including ultrasonic and vibration cleaning process be substituted for existing mixed cleaning method of dipping and polish.

• 반도체디스플레이기술학회지
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• 제11권1호
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• pp.73-78
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• 2012

In this study, the optimal process condition was induced about the pillar arrangement process of applying the screen printing method in the manufacture process of vacuum glazing panel. The high precision screen printing is technology which pushes out the paste and spreads it by using the squeegee on the stainless steel plate in which the pattern is formed. The screen printing method is much used in the flat panel display field including the LCD, PDP, FED, organic EL, and etc for forming the high precision micro-pattern. Also a number of studies of screen printing method have been conducted as the method for the cost down through the improvement of productivity. The screen printing method has many parameters. So we used Taguchi method in order to decrease test frequencies and optimize this parameters efficiently. In this study, experiments of pillar arrangement were performed by using Taguchi experimental design. We analyzed experimental results and obtained optimal conditions which are 4 m/s of squeegee speed, $40^{\circ}$ of squeegee angle and distance between metal mask and glass.

• 한국인쇄학회지
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• 제29권2호
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• pp.83-92
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• 2011

A inorganic powder EL lamp was made by screen printing technique with phosphor ink and dielectric ink. The thickness change of a phosphor ink layer and a dielectric ink layer were not influenced on dielectric content, but rely on phosphor size and vehicle. Once finishing screen printing technique with phosphor ink and dielectric ink, and its surface has been printed again before not drying of phosphor ink and dielectric ink. Then phosphor ink and dielectric ink were not transferred. The electric capacity of inorganic powder EL lamp was more influenced on dielectric content than the thickness of dielectric ink layer, and it was more dependent on the thickness of phosphor ink layer than the thickness of dielectric ink layer.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.589-590
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• 2006

Recently, research for the micro printing technology has begun to get into the spotlight. It is due to the superior price competitiveness to existent semi-conductor process for manufacturing some parts of display unit, electronic paper, RF-ID information device, and so on. This paper present screen printing process not for paper publication but for parts of electronics such as PDP wall, LCD CF, and so on. There are two major issues. The first one is how to get a fine and even line pattern. The other one is how to get the same patterns in large area. In this research, we present the design, equipment, and process control of screen printing in order to overcome these issues.