• Title/Summary/Keyword: screen thickness

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Development of a Handheld Sheet Resistance Meter with the Dual-configuration Four-point Probe Method

  • Kang, Jeon-Hong;Lee, Sang-Hwa;Yu, Kwang-Min
    • Journal of Electrical Engineering and Technology
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    • v.12 no.3
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    • pp.1314-1319
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    • 2017
  • A handheld sheet resistance meter that can easily and quickly measure the sheet resistance of indium tin oxide films was developed. The dual-configuration four-point probe method was adopted for this instrument, which measured sheet resistance in the range from $0.26{\Omega}/sq$. to $2.6k{\Omega}/sq$. with 0.3 % ~ 0.5 % uncertainty. The screen of the instrument displayed the sheet resistance when the probe was in contact with the sample surface and the value continued to be displayed during the probe contact. Even after separating the probe from the surface, the value was still displayed on the screen and could be read easily. A feature of the instrument was the use of the dual-configuration technique to reduce edge effects markedly compared with the single-configuration technique and its ease of operation without applying correction factors for sample size and thickness.

Fabrication of Thick Film Capacitors with Printing Technology (인쇄기법을 이용한 후막 캐패시터 제작)

  • Lee, Hye-Mi;Shin, Kwon-Yong;Kang, Hyung-Tae;Kang, Heui-Seok;Hwang, Jun-Young;Park, Moon-Soo;Lee, Sang-Ho
    • Proceedings of the KIEE Conference
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    • 2007.11a
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    • pp.100-101
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    • 2007
  • Polymer thick film capacitors were successfully fabricated by using ink-jet printing and screen printing technology. First, a bottom electrode was patterned by ink-jet printing of a nano-sized silver ink. Next, a dielectric layer was formed by the screen printing, then a top electrode was pattern by ink-jet printing of a nano-sized silver ink. The printed area of the dielectric layers were changed into $2{\times}2m^2$and $4{\times}2m^2$, and also the area of the electrodes were patterned with $1{\times}1mm^2$ and $1{\times}3mm^2$. The thickness of the printed dielectric layer was ranged from 1.1 to $1.4{\mu}m$. The analysis of capacitances verified that the capacitances was proportional to the area of the printed electrode. The capacitances of the fabricated capacitors resulted in one third of the calculated capacitances.

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Study on the dark current reduction of $HgI_2$ radiation detector ($HgI_2$ 방사선 검출기의 누설전류 저감에 관한 연구)

  • Shin, Jung-Wook;Kang, Sang-Sik;Kim, Jin-Young;Kim, Kyung-Jin;Park, Sung-Kwang;Jo, Heung-Lae;Lee, Hyung-Won;Nan, Sang-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.11a
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    • pp.456-459
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    • 2004
  • Analog film/screen systems have been being changed to a digital x-ray imaging device using direct conversion materials. Photocoductors for a direct detection flat-panel imager require high x-ray absorption, ionization and charge collection, low leakage current and large area deposition. In this work, $HgI_2$ films with excellent properties for x-ray detector were deposited by screen printing method. The thickness of $HgI_2$ film was about $150\;{\mu}m$. The passivation layer is fabricated using a-Se and parlyene, the both fabrication $HgI_2$ film were compared for analyzing the leakage current reduction. We measured electrical properties-leakage current, photosensitivity, SNR though I-V measurement, As the result, $HgI_2$ film using a-Se passivation layer had the greater

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Characterization of PMW-PZT Thick Films Prepared by Screen Printing Method (스크린 인쇄법에 의해 제조한 PMW-PZT 후막의 특성)

  • Son, Jin-Ho;Kim, Yong-Bum;Cheon, Chae-Il;Yoo, Kwang-Soo;Kim, Tae-Song
    • Journal of the Korean Ceramic Society
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    • v.41 no.1
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    • pp.30-35
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    • 2004
  • PMW-PZT thick films of about $30{\mu}m$ thickness were fabricated on Pt/$TiO_2$/$SiN_x$Si substrate by the hybrid method of screen printing and PZT sol application. With the increase of the number of the sol application times, the sintered density and electrical properties of PMW-PZT thick films were evidently increased. For the PMW-PZT thick film with PZT sol application of 10-times, the dielectric constant ($\varepsilon_r$) was 745 at the frequency of 100 KHz and thepiezoelectric coefficient ($d_33$) was 155 pC/N at the applied pressure of 1 atm.

Characteristics of Mono Crystalline Silicon Solar Cell for Rear Electrode with Aluminum and Aluminum-Boron (Aluminum 및 Aluminum-Boron후면 전극에 따른 단결정 실리콘 태양전지 특성)

  • Hong, Ji-Hwa;Baek, Tae-Hyeon;Kim, Jin-Kuk;Choi, Sung-Jin;Kim, Nam-Soo;Kang, Gi-Hwan;Yu, Gwon-Jong;Song, Hee-Eun
    • 한국태양에너지학회:학술대회논문집
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    • 2011.11a
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    • pp.34-39
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    • 2011
  • Screen printing method is a common way to fabricate the crystalline silicon solar cell with low-cost and high-efficiency. The screen printing metallization use silver paste and aluminum paste for front and rear contact, respectively. Especially the rear contact between aluminum and silicon is important to form the back surface filed (Al-BSF) after firing process. BSF plays an important role to reduces the surface recombination due to $p^+$ doping of back surface. However, Al electrode on back surface leads to bow occurring by differences in coefficient of thermal expansion of the aluminum and silicon. In this paper, we studied the properties of mono crystalline silicon solar cell for rear electrode with aluminum and aluminum-boron in order to characterize bow and BSF of each paste. The 156*156 $m^2$ p-type silicon wafers with $200{\mu}m$ thickness and 0.5-3 ${\Omega}\;cm$ resistivity were used after texturing, diffusion, and antireflection coating. The characteristics of solar cells was obtained by measuring vernier callipers, scanning electron microscope and light current-voltage. Solar cells with aluminum paste on the back surface were achieved with $V_{OC}$ = 0.618V, JSC = 35.49$mA/cm^2$, FF(Fill factor) = 78%, Efficiency = 17.13%.

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Feasibility of Single-Shot Dual-Energy X-ray Imaging Technique for Printed-Circuit Board Inspection (인쇄회로기판 검사를 위한 단일조사 이중에너지 엑스선 영상기법의 유용성에 관한 연구)

  • Kim, Seung Ho;Kim, Dong Woon;Kim, Daecheon;Kim, Junwoo;Park, Ji Woong;Park, Eunpyeong;Kim, Jinwoo;Kim, Ho Kyung
    • Journal of Radiation Industry
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    • v.9 no.3
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    • pp.137-141
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    • 2015
  • A single-shot dual-energy x-ray imaging technique has been developed using a sandwich detector by stacking two detectors, in which the front and rear detectors respectively produce relatively lower and higher x-ray energy images. Each detector layer is composed of a phosphor screen coupled with a photodiode array. The front detector layer employs a thinner phosphor screen, whereas the rear detector layer employs a thicker phosphor screen considering the quantum efficiency for x-ray photons with higher energies. We have applied the proposed method into the inspection of printed circuit boards, and obtained dual-energy images with background clutter suppressed. In addition, the single-shot dual-energy method provides sharper-edge images than the conventional radiography because of the unsharp masking effect resulting from the use of different thickness phosphors between the two detector layers. It is promising to use the single-shot dual-energy x-ray imaging for high-resolution nondestructive testing. For the reliable use of the developed method, however, more quantitative analysis is further required in comparisons with the conventional method for various types of printed circuit boards.

Epoxy/BaTiO3 (SrTiO3) composite films and pastes for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates

  • Paik Kyung-Wook;Hyun Jin-Gul;Lee Sangyong;Jang Kyung-Woon
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2005.09a
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    • pp.201-212
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    • 2005
  • [ $Epoxy/BaTiO_3$ ] composite embedded capacitor films (ECFs) were newly designed fur high dielectric constant and low tolerance (less than ${\pm}15\%$) embedded capacitor fabrication for organic substrates. In terms of material formulation, ECFs are composed of specially formulated epoxy resin and latent curing agent, and in terms of coating process, a comma roll coating method is used for uniform film thickness in large area. Dielectric constant of $BaTiO_3\;&\;SrTiO_3$ composite ECF is measured with MIM capacitor at 100 kHz using LCR meter. Dielectric constant of $BaTiO_3$ ECF is bigger than that of $SrTiO_3$ ECF, and it is due to difference of permittivity of $BaTiO_3\;and\;SrTiO_3$ particles. Dielectric constant of $BaTiO_3\;&\;SrTiO_3$ ECF in high frequency range $(0.5\~10GHz)$ is measured using cavity resonance method. In order to estimate dielectric constant, the reflection coefficient is measured with a network analyzer. Dielectric constant is calculated by observing the frequencies of the resonant cavity modes. About both powders, calculated dielectric constants in this frequency range are about 3/4 of the dielectric constants at 1 MHz. This difference is due to the decrease of the dielectric constant of epoxy matrix. For $BaTiO_3$ ECF, there is the dielectric relaxation at $5\~9GHz$. It is due to changing of polarization mode of $BaTiO_3$ powder. In the case of $SrTiO_3$ ECF, there is no relaxation up to 10GHz. Alternative material for embedded capacitor fabrication is $epoxy/BaTiO_3$ composite embedded capacitor paste (ECP). It uses similar materials formulation like ECF and a screen printing method for film coating. The screen printing method has the advantage of forming capacitor partially in desired part. But the screen printing makes surface irregularity during mask peel-off, Surface flatness is significantly improved by adding some additives and by applying pressure during curing. As a result, dielectric layer with improved thickness uniformity is successfully demonstrated. Using $epoxy/BaTiO_3$ composite ECP, dielectric constant of 63 and specific capacitance of 5.1nF/cm2 were achieved.

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The Korea Academia-Industrial cooperation Society (유리섬유 복합재료를 이용한 화재 비상통로용 스크린 소재 성능에 관한 연구)

  • Lee, Jung-Yub
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.2
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    • pp.653-659
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    • 2018
  • High-rise buildings and complex facilities are a representative urban system for the masses, and it requires an increasing role of commodity and safety. Smoke and toxic gasses can cause accidents due to fire in these systems. The purpose of this study is to develop a fiber screen material for emergency evacuation passages that can be avoided quickly and safely in cases of disasters. The fiber screen material is applicable to folding devices for emergency evacuation passages. The material is different from general steel material in that it is lightweight with less burden during storage for a long time in a roll form in a folding device. It also has an excellent secondary function in that it is less affected by radiant heat. Three kinds of fiber screen materials were selected that have good flame retardancy and post-processing characteristics. A performance evaluation was performed by a heat shrinkage test, contact heat test, combustibility test, flame retardancy test, tensile strength test, and tear strength test. As a result, the lightweight fabric shows excellent performance through post-processing, and silicone resin coating can secure safety of the pizza by the fiber screen material performance and radiant heat. The optimum post-treatment conditions were evaluated by performing a burning test after coating two kinds of glass fibers and four types of flame-retardant silicone resins with different weight and thickness.

Improvement of the Throwing Power (TP) and Thickness Uniformity in the Electroless Copper Plating (무전해 동도금 Throwing Power (TP) 및 두께 편차 개선)

  • Seo, Jung-Wook;Lee, Jin-Uk;Won, Yong-Sun
    • Clean Technology
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    • v.17 no.2
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    • pp.103-109
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    • 2011
  • The process optimization was carried out to improve the throwing power (TP) and the thickness uniformity of the electroless copper (Cu) plating, which plays a seed layer for the subsequent electroplating. The DOE (design of experiment) was employed to screen key factors out of all available operation parameters to influence the TP and thickness uniformity the most. It turned out that higher Cu ion concentration and lower plating temperature are advantageous to accomplish uniform via filling and they are accounted for based on the surface reactivity. To visualize what occurred experimentally and evaluate the phenomena qualitatively, the kinetic Monte Carlo (MC) simulation was introduced. The combination of neatly designed experiments by DOE and supporting theoretical simulation is believed to be inspiring in solving similar kinds of problems in the relevant field.

Effect of Heat Treatment Temperature and Coating Thickness on Conversion Lens for White LED (백색 LED용 색변환 렌즈의 열처리 온도 및 코팅 두께에 따른 영향)

  • Lee, Hyo-Sung;Hwang, Jong Hee;Lim, Tae-Young;Kim, Jin-Ho;Jung, Hyun-Suk;Lee, Mi Jai
    • Journal of the Korean Ceramic Society
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    • v.51 no.6
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    • pp.533-538
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    • 2014
  • Today, silicon and epoxy resin are used as materials of conversion lenses for white LEDs on the basis of their good bonding and transparency in LED packages. But these materials give rise to long-term performance problems such as reaction with water, yellowing transition, and shrinkage by heat. These problems are major factors underlying performance deterioration of LEDs. In this study, in order to address these problems, we fabricated a conversion lenses using glass, which has good chemical durability and is stable to heat. The fabricated conversion lenses were applied to a remote phosphor type. In this experiment, the conversion lens for white LED was coated on a glass substrate by a screen printing method using paste. The thickness of the coated conversion lens was controlled during 2 or 3 iterations of coating. The conversion lens fabricated under high heat treatment temperature and with a thin coating showed higher luminance efficiency and CCT closer to white light than fabricated lenses under low heat treatment temperature or a thick coating. The conversion lens with $32{\mu}m$ coating thickness showed the best optical properties: the measured values of the CCT, CRI, and luminance efficiency were 4468 K, 68, and 142.22 lm/w in 20 wt% glass frit, 80 wt% phosphor with sintering at $800^{\circ}C$.