• 제목/요약/키워드: scrap a PCB

검색결과 8건 처리시간 0.026초

산화처리된 PCB 스크랩을 첨가한 Al2O3-SiO2-CaO 3성분계 슬래그의 점도 (Viscosity Change of Al2O3-SiO2-CaO Slag System with Used Electronic Scrap)

  • 권의혁;한신석;지재홍;한정환;유병돈;김병수;이재천
    • 한국재료학회지
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    • 제13권4호
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    • pp.239-245
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    • 2003
  • In order to explore the possibility to extract precious metals from PCB(Printed Circuit Board) scrap by gravity separation, a high temperature melting process was adopted, from the recycling view point, to investigate the influence of viscosity on A1$_2$$O_3$-CaO$-SiO_2$ slag system composed of PCB scrap. For optimizing the pre-treatment process of PCB scrap, an experimental condition for the complete calcination and oxidation of organic materials in PCB scrap was established and a quantitative analysis of oxidized PCB scrap was also carrie out. It was found that 6 hours were enough for the complete oxidation of PCB scrap at 1273 K in an atmosphere condition. A slag, l5wt%$A1_2$$O_3$-45wt%CaO-40wt%SiO$_2$, was chosen as a basic slag composition which is determined based on the quantitative analysis of PCB scrap. Viscosities were measured in slag systems both made from pure fluxes and from PCB scrap with additional fluxes. Slag viscosities composed of pure fluxes were measured to be 5.29 poise and 30.52 poise at temperatures of 1773 and 1573 K, whereas that of PCB scrap with additional fluxes were 3.37 poise and 69.89 poise, respectively.

PCB스크랩으로부터 유가금속성분 회수를 위한 용융처리 (Melting of PCB scrap for the Extraction of Metallic Components)

  • 권의혁;장성환;한정환;김병수;정진기;이재천
    • 한국재료학회지
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    • 제15권1호
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    • pp.31-36
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    • 2005
  • It is well known that PCB (Printed Circuit Board) is a complex mixture of various metals mixed with various types of plastics and ceramics. In this study, high temperature pyre-metallurgical process was investigated to extract valuable metallic components from the PCB scrap. For this purpose, PCB scrap was shredded and oxidized to remove plastic materials, and then, quantitative analyses were made. After the oxidation of the PCB scrap, $30.6wt\%SiO_2,\;19.3wt\%Al_2O_3\;and\;14wt{\%}CaO$ were analyzed as major oxides, and thereafter, a typical composition of $32wt\%SiO_2-20wt\%Al_2O_3-38wt{\%}CaO-10wt\%MgO$ was chosen as a basic slag system for the separation of metallic components. Moreover a size effect of crushed PCB scrap was also investigated. During experiments a high frequency induction furnace was used to melt and separate metallic components. As a result, it was found that the size of oxidized PCB scrap was needed to be less 0.9 m to make a homogeneous liquid slag and to recycle metallic components over $95\%$.

유가금속(有價金屬) 회수(回收)를 위한 PCB 스크랩의 건식처리기술(乾式處理技術) (Pyro-metallurgical Treatment of used OA Parts for the Recovery of Valuable Metals)

  • 신동엽;이상동;정현부;유병돈;한정환;정진기
    • 자원리싸이클링
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    • 제17권2호
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    • pp.46-54
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    • 2008
  • 폐 컴퓨터나 OA기기 중 PCB (Printed Circuit Board)에는 귀금속을 포함한 많은 양의 금속성분이 함유되어 있으며, 본 연구에서는 이들을 분리회수하기 위한 건식처리 기술을 검토하였다. 폐 컴퓨터로부터 얻은 PCB 스크랩을 산화처리한 시료에 대해 정량분석을 실시하고, 함유된 산화물 종류에 대하여 적합한 슬래그계를 선정하여 유가금속을 분리회수하기 위한 산화물 성분의 슬래그화를 시도하였다. 용융작업을 위해 슈퍼칸탈 회전로를 사용하였으며, 이때 도가니 회전이 금속의 회수율에 미치는 영향을 조사하였다.

에너지절약형 동(Cu)전해채취 및 전류밀도의 영향 (The effects of current density and nickel content on copper electrowinning by energy saving system)

  • 이후인;이재천;박진태;김민석;손정수
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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    • pp.386-387
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    • 2006
  • This study is about the recycling technology of scrap a PCB(printed circuit board) produced in home appliances or automobile industry. And we develop the recycling technology of cooper (Cu)which is contained to leaching solution. In stead of electrolytic collecting in existing sulphuric atmosphere, we apply process using the ammonia solution which is used in economizing energy. So m the process of electrolyzing scrap a PCB through the leaching and separation, we examine the effect of the nickel contained to the solution and the cooper degree of purity which is changed according to current density.

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PCBs의 스크랩으로부터 Au 용출과 회수 (The Leaching and Recovery of Au from Scrap of PCBs)

  • 유돈상;박천영
    • 한국지구과학회지
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    • 제35권4호
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    • pp.259-266
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    • 2014
  • 폐 PCBs의 스크랩으로부터 염소-차아염소산염 용액을 이용하여 Au와 Ag를 친환경적이고 효과적으로 용출시키고자 하였다. PCBs에 Cu, Sn, Sb, Al, Ni, Pb, Au 등과 같은 유용금속이 함유되어 있는 것을 EDS 분석으로 확인하였다. 최대 Au 용출율은 1%의 광액농도, 2:1의 염산:차아염소산나트륨 그리고 2 M의 NaCl 농도조건이다. Au 회수율이 가장 높은 메타중아황산나트륨 농도는 3 M에서였다. 염소-차아염소산염이 폐 컴퓨터에 함유되어 있는 Au와 Ag를 효과적으로 용출시킬 수 있는 용매제 임을 그리고 메타중아황산나트륨이 Au를 간단하게 침전시킬 수 있는 첨가제임을 확인하였다.

화학 및 열적 처리를 이용한 폴리염화바이페닐(PCB)의 제거 (Disposal of Polychlorinated Biphenyls(PCBs) by a Combined Chemical with Thermal Treatment)

  • 유건상
    • 대한화학회지
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    • 제43권3호
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    • pp.286-293
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    • 1999
  • 변압기 오일에 함유되어 있는 폴리염화바이페닐(PCB)의 제거를 위해서 화학적 처리와 제어된 산화반응에 의한 열적처리를 상호 결합시킨 한 포괄적인 공정이 이루어 졌다. 화학시약을 이용한 화학처리에서 완전히 처분할 수 없었던 폴리염화바이페닐은 오일의 순환중 에 적절한 흡착제로 걸러진 후 열처리되었다. 열처리에 의해서 폴리염화바이페닐은 99.99% 이상 파괴 되었으며 독성 부산물인 PCDDs나 PCDFs는 처리과정 중에 형성되지 않았다. 변압기에 있는 오일이나 무기지지체는 공정 후에 재회복 되었다. 화학 및 열적처리를 결합시킨 이 공정은 환경적으로 유익하며, 다른 유용한 기술보다도 사용하기 쉽고 효과적이며 경제적 이었다.

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폐기물 매립지 침출수에 의한 중금속 용출에 관한 연구 (A Study on the Leaching of Heavy Metals by Municipal Solid Waste Landfill Leachate)

  • 정종관;장원;박영숙
    • 환경영향평가
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    • 제6권1호
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    • pp.105-110
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    • 1997
  • Sanitary landfill is a general method as a final disposal of municipal solid waste(MSW), therefore leachate characteristics are very various as lime goes by because of highly concentrated organic acids are contained non biodegradable COD. So it is hard to abide by the mandatory standards of discharge eventhough applying the physicochemical and biological processes to treat the leachate. The process of treating leachate are determined by the degree of removal and components, but they are highly contained organic materials. It is a removal method to use jointly with the physicochemical process if the hard and fast rule is needed. The critical components of material are COD, ammonia, salts and heavy metals in the case of treating biologically. Biological process is to use metabolism of microorganism, therefore it is a desirable condition which heavy metals are not contained, because they acting as an inhibitor of enzyme. Of these are contained, organic decomposition and synthetic function of microorganisms decrease significantly. Consequently, this research paper lays emphasis on the concentration of heavy metals in leachate and for the purpose of forecasting the factors which are affecting the leaching of metalic waste in some degree, experimented the various reacting conditions. 1. When the concentration of heavy metals in leachate is in comparison with the level eluted after reaction, at pH 7.9 the result of reaction for PCB to CCL scrap showed that Zn, Mn, Cu was more eluted 11.6 times, 340.3 times, and 2,705.5 times respectively than the leachate undiluted solution. 2. At the condition of strong acid pH 4.7, the concentration of heavy metals in EM undiluted solution showed that Zn, Mn, Cu was more eluted 26.5 times, 147.3 times, and 3,656.3 times respectively than leachate undiluted solution. 3. When the ratio leachate to EM was 50 vs 50(V/V%), Mn was more eluted 198.7 times than leachate undiluted solution, but Zn and Cu do not show the meaningful results. 4. The color of landfill leachate was black-brown. And fulvic acid that is main ingredient of NBD COD contained, oxygen of 44~50%. For that reason, I estimated that the level of Zn, Mn, Cu was higher than the case of leachate. 5. COD of leachate from general landfill is difficult to remove. Because the solution of heavy metals is improved by the character of leachate(pH & ingredient of oxygen etc.) hence the Mn, Cu, Zn act as disturbing factor, the biochemical treatment is hard. Therefore the type of PCB & CCL scrap, iron, aluminum contained metals need to previously separate from general wastes as much as possible.

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충격형 분쇄기 에 의한 폐프린트배선기판(PCBs) 중 금속성분의 분쇄 특성 (The Grinding Characteristics of the Metal Components in Printed Circuit Boards(PCBs) Scrap by the Swing-Hammer Type Impact Mill)

  • 이재천;길대섭;남철우;최철준
    • 자원리싸이클링
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    • 제11권2호
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    • pp.28-35
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    • 2002
  • 충격형 분채기에 의한 폐프린트배선기판(PCBs)의 분쇄과정에서 일어나는 금속성분의 분쇄특성에 대한 연구가 수행되었다. PCBs로부터 금속성분들을 단체분리하기 위하여 -3 mm로 파쇄한 다음 충격형 분쇄기를 사용하여 분쇄하였으며 햄머의 회전속도가 금속성분의 분쇄에 미치는 영향을 관찰하였다. 동과 땜납 등과 같은 금속성분들의 입도분포 및 단체분리도를 조사하였다. 경사진동판을 사용하는 PCBs 분쇄물로부터 금속입자들의 형상분리에서 햄머의 회전속도와 입자크기가 미치는 영향을 검토하였다 61.3 m/s 햄머속도에서 동 성분은 +297$\mu$m 입자가 80% 이었지만 땜납성분은 -297$\mu$m 입자가 90%에 달했다. 형상분리법에 의한 금속입자의분리 시 햄머의 회전속도가 클수록 회수위치가 짧았으며 +297 $\mu$m 입자의 회수위치가 -297~+149$\mu$m 입자보다 짧았다. 회수위치가 짧을수록 금속입자의 구형도가 좋았으며 KI 값은 KI=1 로 증가하고, $\phi_{c}$ 값은 $\phi_{c}$ =1로 감소하였다.