• 대한가정학회지
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• 제39권11호
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• pp.89-106
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• 2001

The purpose of this study is to critically review the related issues of marital satisfaction scale in order to develop a Korean Type Marital Satisfaction Scale. Especially definitional ambiguity, unit of analysis theory of marital satisfaction and issues about measurement and cultural implication are reviewed. Also a section deals with suggestions that could be considered to develop Korean Type Marital Satisfaction Scale.

• 대한가정학회지
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• 제29권2호
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• pp.135-154
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• 1991

The purposes of this study are: 1) To find out overall family life issues percieved by the middle-classhousewives in their forties. 2) To examine detailed aspects related to middle years crises, leisure activities, children issues, family economy issues, and housing issues. 3) To clarify solutions to, and provide basic data on family issues raised by the middle-class families. The middle-class housewives in their forties living in the Seoul area were the subject of the survey. The sample size analysed in this study was 422. Data were analysed by the frequency, mean, percentile, standard deviation, X2-test, analysis of variance, multiple classification analysis, analysis of multiple regression, and Scheffe-test as a post-hoc analysis. The conclusions are as follows: First, the middle-class housewives tend to give more importance on children issues, especially on academic achievement and career development. Second, family cohesion of middle-class families is comparatively high and intra-familial conflict is low, and middle years crisis of housewives is comparatively low, too. Third, the stability of middle-class families can be found in household economic management patterns. one fourth of the families own stocks and two fifths of the families own real estate except their own dwelling house. Be based on their property income add to their labor income, middle-class families are showed their economic stability, however, intra-class inequality is found, too. Fourth, the great part of middle-class families that possess their own house, tend to be unsatisfied with their housig scale, and a half of the families expect to enlarge their housing scale for more comfortable and convient living.

• 환경위생공학
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• 제23권4호
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• pp.1-11
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• 2008

The goal of today's environmental education is to enhance the understanding of the serious of environmental problems and the interactions among environment. With this perspectives people need to be aware that environmental education is no longer a liberal arts in university education, but play a vital role within the socio-cultural context. This study was performed to assess the changes in the university student's attitudes and consciousness in real life after the education of a point at issues of environmental problems. For this study 11 questionnaires which were composed of large scale environmental problems(water and air pollution), and small scale environmental problems(food additives, GMO, endocrine disrupter) were performed with self-administered by university students(n=781) who made a application for liberal arts related to environmental subjects. According to the analysis the most student's consciousness of a point at issue of environmental problems(water pollution, air pollution, additives, GMO, endocrine disrupter), and practical attitudes(i.e., practical attendant at congregation and internet voting) were change statistically significant(p<0.01) after the education of a point at issue of environmental problems rather than before. Specially, the score for the item of the large scale problem of environmental issues(water pollution, air pollution) were decreased significantly(p<0.01), but the score for the small scale problems, such as food additives, GMO, endocrine disrupter were increased significantly(p<0.01) after the education of a point at issue of environmental problems(p<0.01). And among the students that participated, 97.7% responded that such a point at issues of environmental problem is needed at the university. With this educational improvements supports the states that the education of a point at issue of environmental problems were more essential, practical and needed to students at university rather than that of an existing instruction. Thus, further studies are required to develop the education of environmental issues at universities like STSE programme.

• Journal of Information Technology Applications and Management
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• 제19권2호
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• pp.249-263
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• 2012

Recently the open innovation is considered as one of the important issues for the survival strategy of a company in the industry. There have been several researches and practices on this topic. However, previous researches are mainly focused on the study of successful cases and some statistical analyses on the relationship between the open innovation and its performance. There are rare researches on the hindrance factors in the practical level. This paper tries to find some hinderance factors for the open innovation in Korean large-scale companies based on the WFGM(Want-Find-Get-Manage) model proposed by Gene Slowinski(2006). Especially this research focused on each processes of open innovation by in-depth interviews for two representative large companies in Korea. From the result of this research we come to know that the critical hindrance factor in the WANT step is the uncertain definition of the necessary technologies for the company. Issues on establishing and maintaining the innovation network are in the FIND step. Technology evaluation, technology introduction channel and technology copying issues are in the GET step. Communication issues, technology feasibility and lack of competition are in the MANAGE step. This paper finds some hindrance factors in each process step of open innovation, which gives some implications for the companies that want to adopt open innovation.

• 천문학회지
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• 제34권4호
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• pp.181-190
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• 2001

The advent of robust, reliable and accurate higher order Godunov schemes for many of the systems of equations of interest in computational astrophysics has made it important to understand how to solve them in multi-scale fashion. This is so because the physics associated with astrophysical phenomena evolves in multi-scale fashion and we wish to arrive at a multi-scale simulational capability to represent the physics. Because astrophysical systems have magnetic fields, multi-scale magnetohydrodynamics (MHD) is of especial interest. In this paper we first discuss general issues in adaptive mesh refinement (AMR), We then focus on the important issues in carrying out divergence-free AMR-MHD and catalogue the progress we have made in that area. We show that AMR methods lend themselves to easy parallelization. We then discuss applications of the RIEMANN framework for AMR-MHD to problems in computational astophysics.

• 한국수학교육학회지시리즈D:수학교육연구
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• 제8권2호
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• pp.95-106
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• 2004

The purpose of this paper is to diagnose the problems of the revision process of the curriculum, and identify the issues in relation to the 7th mathematics curriculum. From the review on the curriculum revision process in Korea, three issues were identified; timing and scale of curriculum revision, research and curriculum revision, and the relationship between the revision of the overall curriculum and that of a subject curriculum. Regarding the mathematics curriculum, the three issues were raised for further discussion; lack of philosophy behind the mathematics curriculum, optimization of mathematics educational content, and differentiated curricula for students of different abilities.

• Nuclear Engineering and Technology
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• 제49권7호
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• pp.1451-1456
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• 2017

Finding technical issues associated with equipment scale-up is an important subject for the investigation of pyroprocessing. In this respect, electrolytic reduction of 1 kg $UO_2$, a unit process of pyroprocessing, was conducted using graphite as an anode material to figure out the scale-up issues of the C anode-based system at pilot scale. The graphite anode can transfer a current that is 6-7 times higher than that of a conventional Pt anode with the same reactor, showing the superiority of the graphite anode. $UO_2$ pellets were turned into metallic U during the reaction. However, several problems were discovered after the experiments, such as reaction instability by reduced effective anode area (induced by the existence of $Cl_2$ around anode and anode consumption), relatively low metal conversion rate, and corrosion of the reactor. These issues should be overcome for the scale-up of the electrolytic reducer using the C anode.

• Journal of Preventive Medicine and Public Health
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• 제40권2호
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• pp.108-113
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• 2007

When conducting large-scale cohort studies, numerous statistical issues arise from the range of study design, data collection, data analysis and interpretation. In genomic cohort studies, these statistical problems become more complicated, which need to be carefully dealt with. Rapid technical advances in genomic studies produce enormous amount of data to be analyzed and traditional statistical methods are no longer sufficient to handle these data. In this paper, we reviewed several important statistical issues that occur frequently in large-scale genomic cohort studies, including measurement error and its relevant correction methods, cost-efficient design strategy for main cohort and validation studies, inflated Type I error, gene-gene and gene-environment interaction and time-varying hazard ratios. It is very important to employ appropriate statistical methods in order to make the best use of valuable cohort data and produce valid and reliable study results.

• 마이크로전자및패키징학회지
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• 제8권2호
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• pp.37-42
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• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.27-34
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• 2001

The BGA Package has been the area array package of choice for several rears. Recently, the transition has been to finer pitch configuration called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch, requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and piece equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.