• Title/Summary/Keyword: saw cutting method

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The fabrication and characterization of hard rock cutting diamond saw (석재가공용 다이아몬드 톱의 제조 및 특성)

  • Lee Hyun-Woo;Jeon Woo-yong;Lee Oh-yeon;Seol Kyeong-won
    • Journal of Powder Materials
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    • v.11 no.5
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    • pp.412-420
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    • 2004
  • The purpose of the present study is to determine an optimum composition using cheaper powders keeping with high performance of hard rock cutting diamond saw blade. With 50Fe-20(Cu . Sn)-30Co specimen, a part of Co was replaced by Ni(5%, 10%, and 15%, respectively). These specimens were hot pressed and sintered for predetermined time at various temperature. Sintering is performed by two different methods of temperature controlled method and specimen dimension controlled method. In order to determine the property of the sintered diamond saw blade, 3 point bending tester, X-ray diffractometer, and SEM were used. As the Co in the bond alloy was replaced by Ni, the hardness of the specimen increased. Thus the 50Fe-20(CuㆍSn)-15Co-15Ni specimen showed the maximum hardness of 104(HRB). The results of 3 point bending test showed that flexure strength decreased along with increase in Ni content. This is attributed to the formation of intermetallic compound(Ni$_{x}$Sn) determined by X-ray diffraction. The fracture surface after 3 point bending test showed that diamond was fractured in the specimen containing 0%, 5%, and 10%Ni, and the fracture occurred at the interface between diamond and matrix in the specimen containing 15%Ni. The cutting ability test showed that the abrasive property was not changed in the specimen containing 0%, 5%, and 10%Ni. The optimum composition determined in this study is 50Fe-20(CuㆍSn)-20Co-10Ni.

Development of a Channel Cutting Die Set (형재 절단금형 개발에 관한 연구)

  • Park, Kuwi-Sun;Lee, Choon-Man
    • Journal of the Korean Society for Precision Engineering
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    • v.18 no.1
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    • pp.117-122
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    • 2001
  • Many kinds of channels are used in industrial equipment and production machinery. Although mechanical saw has been used to cut many sorts of channels, there is cost rise problem because of low productivity. Shearing of channel has a special place because it helps to cut expected shape and size easily. A channel cutting die set which can be mounted and used on a hydraulic press is developed to improve the productivity of channel cutting process. Mode for the channel cutting is divided into single cut and double cut method. This study use double cut method, and the developed channel cutting die set is composed of upper and lower die set. Shearing time can be reduced from 40 minutes to 20 seconds using the developed channel cutting die set. The productivity of channel cutting process can be increased with shearing time reduction as well as cost reduction.

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Evaluation of Residual Stress on Welded Joint in API X65 Pipe Line through Nondestructive Instrumented Indentation Technique (비파괴 계장화 압입시험기법을 통한 API X65 배관 용접부 잔류응력 평가)

  • 지원재;이윤희;김우식;김철만;권동일
    • Journal of Welding and Joining
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    • v.21 no.5
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    • pp.547-554
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    • 2003
  • Apparent mechanical properties in structural components can be different from the initially designed values due to the formation of the residual stress in metal forming and welding. Therefore, the evaluation of residual stress has great importance in the reliability diagnosis of structural components. A nondestructive instrumented indentation technique has been proposed to evaluate various strength concerning mechanical properties from the analysis of load-depth curve. In this study, quantitative residual stress estimation on API X65 welded joints for natural gas pipeline was performed by analyzing the variation of indentation loading curve by residual stress through a new proposed theoretical model. The residual stress from the indentation method was compared with that from the saw-cutting method.

Development of a Belt Pick-up One-row Soybean Cutter (벨트 파지식 1조 콩 예취기 개발)

  • Jun, Hyeon-Jong;Kang, Tae-Gyoung;Lee, Choung-Keun;Choi, Yong;Lee, Chai-Sik;Hong, Jong-Tae
    • Journal of Biosystems Engineering
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    • v.35 no.6
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    • pp.373-379
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    • 2010
  • This study was carried out to develop a belt pick-up type one-row soybean cutter, using physical properties and production conditions of soybeans. The prototype soybean cutter consisted of 4 parts: cutting part, conveying part, collecting part, and travelling part. The prototype soybean cutter was designed to cut soybeans planted with a row spacing of 600 mm, and at a height of 30 mm from the bed bottom using a disk saw. Through various trials with different peripheral velocities of the disk saw and forward speed of the cutter, determined ranges of the peripheral velocity of the disk saw cutting soybeans stems were greater than 18.3 m/s. Spacing between pick-up belts (clearance) was in a range of 60~90 mm so that soybeans could be picked at heights greater than 25 cm, and the size and shape of the pick-up belt were determined the conventional manual harvesting method. The optimal ratio between the forward speed of cutter and the peripheral speed of pick-up belts were from 1 to 1.2 by theoretical analysis. the pick-up belts had a $35^{\circ}$ of tilted angle and $90^{\circ}$ of twisted angle to pick up soybeans safely from the plant input to the lower end of the belts and convey soybeans to the upper end of belts nearby a container. The soybeans at the rear container were dropped down on the soybean row with an interval. The effective field capacity of the prototype soybean cutter was 0.136 ha/h, reducing the working hour by 92% when compared with the manual cutting.

Research for Patent Application Tendency in the Super Fine Machining System Using the Wet Waterjet (습식워터젯을 채용한 초정밀 절삭 가공시스템의 특허동향조사에 관한 연구)

  • Kim, Sung-Min;Ko, Jun-Bin;Park, Hee-Sang
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.18 no.1
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    • pp.1-12
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    • 2009
  • Presently, the semiconductor industry has the chronic problem. In the semiconductor industry, it has the semiconductor wafer, a package, the optical filter cut by using the saw blade, the mold, a laser etc. The cutting technique has the difficulty due to the rising of the production cost by the wearing of mold, the poor quality problem due to generated heat at the moment of cutting procedure and curve cutting etc. The goal of this time of national research and development project is develop the apparatus for solving the problem that the existing cutting technique has. The technology is so called waterjet abrasive method. This technology will be mainly applied to cut a semiconductor package and a wafer. Two important things to be considered are ripple effect(in other words, the scale of a market) and simplicity of an application.

Analysis of Working Posture Using OWAS in Forest Work (산림작업(山林作業)에서 OWAS기법(技法)을 이용(利用)한 작업자세(作業姿勢) 분석(分析))

  • Lee, Joon Woo;Park, Bum-Jin
    • Journal of Korean Society of Forest Science
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    • v.90 no.3
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    • pp.388-397
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    • 2001
  • In forestry, where improvement of labor environment is quite impossible, improved posture would result in direct effects by preventing waste of physical strength, prevention of accidental injury caused by fatigue accumulated on certain body parts, and prevention of human error by inattentiveness due to weakened body. Therefore, this research carried on analysis of working posture in manual forest work(thinning using chain-saw, salvage cutting using chain-saw, clearing using hand saw, clearance of twiner using sickle, pruning using saw with a long handle, and tending of young growth using sickle) using OWAS analysis system. According to the OWAS method, percentage of OWAS action categories III and IV in the tasks using chain-saw and sickle was higher than another tasks. For the compared middle skillful worker group and low skillful worker group at felling work using chain-saw, percentage of OWAS action categories IV in middle skillful worker group was 5.1%, and low skillful worker group was 14.1%.

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XU-TEC PROCESS AND XU-TEC SAW BLADES

  • Xu, Z.;Gao, Y.;Wang, C.Z.;Su, Y.A.;Tang, B.
    • Proceedings of the Korean Vacuum Society Conference
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    • 1995.06a
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    • pp.154-154
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    • 1995
  • The Xu-Tec process is also called the double glow surface alloying technology and is a new method of surface metallurgy which can produce an alloy layers with sp ecial phisical and chemical properties on the surface of common and inexpensive mater ials. Many super alloys and alloy steels, sueh as nickel base alloys, high speed steels and staiinless steels, have been produced by Xu-Tee Process on the surfaces of carbon steels. The depth of the alloy lasyers may vary from several microns up to 300 micr ons with alloying elements in a concentration of few percentage to 100%. World wide patents for Xu-Tec process have been granted in the United states, Canada, United Ki ngdom, Australia and Japan. High performance saw blades have been successfully produced by the Xu-Tee process with much simper processing steps and less cost than bimetal high speed saw blades. A comparison of the cutting times and wear rates of the Xu-Tee blades with the conventional bimetal blades has been made. The Xu-Tee bIases demonstrates sim ilar or better performance than bimetal blades. A Xu-Tec Unit for the commercial pr oduction of Xu-Tec saw blades has been designed and manufactured. This Unit can t reat 10,000 haek saw blades at one time. Three Xu-Tec hack saw blades production I ines have been set up in China. China.

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Shape Design Improvement of the Rotary Cutting Machine to Improve the Dust Capturing Efficiency using CFD (회전톱 재단기의 미세먼지 집진효율 향상을 위한 형상 설계 개선)

  • Kim, G.H.;Rhee, H.N.;Jeon, W.H.
    • 한국전산유체공학회:학술대회논문집
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    • 2011.05a
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    • pp.508-511
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    • 2011
  • Dust released from the rotating timber cutting process causes various kinds of diseases as well as safety issues. Although there were lots of efforts to reduce the amount of dust by installing large-sized dust collectors or by using expensive high-quality cutters, they proved to be not so effective. In this study we want to modify and improve the design of the rotary cutter system to prevent dust from being released to the environment as possible by using computational fluid dynamics (CFD) analysis. We have developed CFD models of the conventional cutter and several design modifications. Through the CFD analysis the characteristics of the air flow was predicted, and then the behavior of dust produced during the cutting process was analyzed for different designs. The most efficient design feature to capture dust inside the cutter as much as possible was chosen based on the CFD analysis results. Finally the prototype of the ratary saw machine was constructed and tested to check the dust capturing efficiency, which result is reasonably consistent with the predicted performance through the CFD analysis.

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A study on the surface characteristics of diamond wire-sawn silicon wafer for photovoltaic application (다이아몬드 코팅 와이어로 가공된 태양전지용 실리콘 웨이퍼의 표면 특성에 관한 연구)

  • Lee, Kyoung-Hee
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.21 no.6
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    • pp.225-229
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    • 2011
  • Most of the silicon cutting methods using the multi-wire with the slurry injection have been used for wafers of the crystalline solar cell. But the productivity of slurry injection cutting type falls due to low cutting speeds. Also, the direct contact with the metal wire and silicon block increases the concentration of metallic impurities in the wafer's surface. In addition, the abrasive silicon carbide (SiC) generates pollutants. And production costs are rising because it does not re-use the worn wire. On the other hand, the productivity of the cutting method using the diamond coated wire is about 2 times faster than the slurry injection cutting type. Also, the continuous cutting using the used wire of low wear is possible. And this is a big advantage for reduced production costs. Therefore, the cutting method of the diamond coated wire is more efficient than the slurry injection cutting technique. In this study, each cutting type is analyzed using the surface characteristics of the solar wafer and will describe the effects of the manufacturing process of the solar cell. Finally, we will suggest improvement methods of the solar cell process for using the diamond cutting type wafer.