• Proceedings of the KSME Conference
• /
• 2000.04a
• /
• pp.176-181
• /
• 2000

Stress intensity factors for a rigid line inclusion tying along a bimaterial interface are calculated by the boundary element method with the multiregion and double-Point techniques. The formula between the stress intensity factors and the inclusion surface stresses are derived. The numerical values of the stress intensity factors for the bimaterial interface rigid line inclusion in the infinite body are proved to be in good agreement within 3% when compared with the previous exact solutions. In the finite bimaterial systems, the stress intensity factors for the center and edge rigid line inclusions at interface are computed with the variation of the rigid line inclusion length and the shear modulus ratio under the biaxial and uniaxial loading conditions.

• Structural Engineering and Mechanics
• /
• v.25 no.4
• /
• pp.383-403
• /
• 2007

The contact problem for an elastic layer resting on an elastic half plane is considered according to the theory of elasticity with integral transformation technique. External loads P and Q are transmitted to the layer by means of two dissimilar rigid flat punches. Widths of punches are different and the thickness of the layer is h. All surfaces are frictionless and it is assumed that the layer is subjected to uniform vertical body force due to effect of gravity. The contact along the interface between elastic layer and half plane will be continuous, if the value of load factor, ${\lambda}$, is less than a critical value, ${\lambda}_{cr}$. However, if tensile tractions are not allowed on the interface, for ${\lambda}$ > ${\lambda}_{cr}$ the layer separates from the interface along a certain finite region. First the continuous contact problem is reduced to singular integral equations and solved numerically using appropriate Gauss-Chebyshev integration formulas. Initial separation loads, ${\lambda}_{cr}$, initial separation points, $x_{cr}$, are determined. Also the required distance between the punches to avoid any separation between the punches and the layer is studied and the limit distance between punches that ends interaction of punches, is investigated. Then discontinuous contact problem is formulated in terms of singular integral equations. The numerical results for initial and end points of the separation region, displacements of the region and the contact stress distribution along the interface between elastic layer and half plane is determined for various dimensionless quantities.

• Journal of Electrical Engineering and Technology
• /
• v.12 no.3
• /
• pp.1320-1327
• /
• 2017

In this paper, a contact loss simulator for a rigid catenary system was designed and used to analyze the effect on the power source according to the conditions of the rigid catenary system and pantograph. R-bar applied to a high-speed train among the real rigid catenary system was used in the contact loss simulator for rigid catenary systems. The excitation frequency generated with the movement of the railway vehicle was simulated. The characteristics according to the frequency and amplitude of the excitation frequency and the presence or absence of pantograph movement were analyzed. This work is considered to be helpful in analyzing the characteristics of contact loss in the interface between a real rigid catenary system and a rail vehicle.

• The Journal of Korean Academy of Prosthodontics
• /
• v.29 no.3
• /
• pp.1-32
• /
• 1991

Tho osseointegrated dental prosthetic treatment has develped for the edentulous patient with severely resorbed alveolar ridge, and has given us a successful clinical results to date. Nowadays the partially edentulism is included among the indications of the osseointegrated prosthetic treatment. The purpose of this study was to analyze the stress distribution at supporting bone according to the types of connection modality between implant and tooth in the superstructure. Two dimensional finite element stress analysis was applied for this study. FEM models were created using software Super SAP for MBM 16bit personal computer. Three modalities of connection were modeled and analyzed under load condition. The results were as follws: 1. The stress develped at tooth and implant in the cancellous bone was lower in the case of rigid connection than in the case of norigid connection, but higher between the two implants in the case of rigid connection than in the case of nonrigid connection. 2. The stress developed at the cortical bone and at the supporting bone interface was lower in the case of rigid connection than in the case of nonrigid connection 3. The stress developed at the supporting tissue interface of the implant nearby the tooth, was lower in the case of rigid connection than in the case of nonrigid connection. 4. The stress developed at the supporting tissue interface of posteriormost implant, was same between the cases of rigid and nonrigid connection. 5. The stress distribution related to the freestanding case was generally similar to the stress distribution pattern of nonrigid connection case. 6. The magnitude of applied load which produces deformation within elastic limit, had influence on the absolute value of stress, but had no influence on the pattern of stress distribution of the same case.

• Journal of Information Display
• /
• v.8 no.4
• /
• pp.1-4
• /
• 2007

In the present study, we propose Monte Carlo simulation that takes into consideration the interface phenomena between liquid crystal and substrate. We use rigid model molecules of liquid crystal and substrate. Interface is generated using potential field that induces decomposition of molecules. We use hard spherocylinders as model liquid crystal molecules. Substrate is modeled as region composed of shorter spherocylinders. Our results show that there is a case in which nematic order is reinforced in the vicinity of rubbed substrate.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2007.08a
• /
• pp.952-953
• /
• 2007

In the present study, we propose MC simulation that takes interface phenomena between liquid crystal and substrate into consideration. We use rigid model molecules of liquid crystal and substrate. Interface is generated using potential field that induces decomposition of molecules.

• Proceedings of the Computational Structural Engineering Institute Conference
• /
• 1999.04a
• /
• pp.19-26
• /
• 1999

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate as the film absorbs moisture from the ambient environment. The rime-domain boundary element method is employed to investigate the behavior of interface stresses. The order of the free-edge singularity is obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time,'while the order of the singularity increases with time for the viscoelastic model considered.

• Proceedings of the Computational Structural Engineering Institute Conference
• /
• 1999.10a
• /
• pp.437-443
• /
• 1999

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to uniform temperature change. The viscoelastic film has been assumed to be thermorheologically simple. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The order of the free-edge singularity has been obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

• Interaction and multiscale mechanics
• /
• v.3 no.4
• /
• pp.343-363
• /
• 2010

The present paper is concerned with vibrations of an elastic bridge loaded by a moving elastic beam of a finite length, which is an extension of the authors' previous study where the second beam was modeled as a semi-infinite beam. The second beam, which represents a train, moves with a constant speed along the bridge and is assumed to be connected to the bridge by the limiting case of a rigid interface such that the deflections of the bridge and the train are forced to be equal. The elastic stiffness and the mass of the train are taken into account. The differential equations are developed according to the Bernoulli-Euler theory and formulated in a non-dimensional form. A solution strategy is developed for the flexural vibrations, bending moments and shear forces in the bridge by means of symbolic computation. When the train travels across the bridge, concentrated forces and moments are found to take place at the front and back side of the train.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.223-227
• /
• 2003

A new flexible electronic packaging technology and its medical applications are presented. Conventional silicon chips and electronic modules can be considered as "mechanically rigid box." which does not bend due to external forces. This mechanically rigid characteristic prohibits its applications to wearable systems or bio-implantable devices. Using current MEMS (Microelectromechanical Systems) technology. a surface micromachined flexible polysilicon sensor array and flexible electrode array fer neural interface were fabricated. A chemical thinning technique has been developed to realize flexible silicon chip. To combine these techniques will result in a realization of truly flexible sensing modules. which are suitable for many medical applications.