• Journal of the Korean Ceramic Society
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• v.44 no.10
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• pp.585-588
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• 2007

Silicon nitride films for an anti-reflection coating were deposited on silicon via RF magnetron sputtering using a $Si_3N4$ target. The best result was obtained at the sputtering condition of 340 W RF power, 5 mtorr Ar atmosphere, $100^{\circ}C$ substrate temperature. The films showed 7.9% reflectance minimum with 2.35 refractive index. 0.21 absorption coefficient at 66.6 nm thickness. The surface morphology showed a smooth and dense film with good adhesion to silicon surface.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.9
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• pp.798-807
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• 2002

ZnO thin films on Si wafer were deposited by RF magnetron reactive sputter with various RF power, chamber pressure, argon/oxygen gas ratios ana substrate temperatures. Crystallinities, surface morphologies, and electrical properties of the films were investigated by XRD, AFM, RBS, and electrometer(keithley 617). ZnO films showed a strong c-axis preferred orientation. Surface roughness and resistivity were changed by the argon/oxygen gas ratio. The minimum surface roughness of 12${\AA}$ and maximum resistivity of $10^8\Omega cm$ were achieved at Ar/O$O_2$=0/100.

• Transactions on Electrical and Electronic Materials
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• v.14 no.2
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• pp.86-89
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• 2013

Dye-sensitized solar cells have a FTO/$TiO_2$/Dye/Electrode/Pt counter electrode structure, yet more than a 10% electron loss occurs at each interface. A passivating layer between the $TiO_2$/FTO glass interface can prevent this loss of electrons. In theory, ZnO has excellent electron collecting capabilities and a 3.4 eV band gap, which suppresses electron mobility. FTO glass was coated with ZnO thin films by RF-magnetron sputtering; each film was deposited under different $O_2$:Ar ratios and RF-gun power. The optical transmittance of the ZnO thin film depends on the thickness and morphology of ZnO. The conversion efficiency was measured with the maximum value of 5.22% at an Ar:$O_2$ ratio of 1:1 and RF-gun power of 80 W, due to effective prevention of the electron recombination into electrolytes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.387-387
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• 2010

최근 ZnO 박막은 투명 박막, 태양전지, LED 등으로의 응용을 위한 새로운 기능성 박막으로 활발히 연구되어 지고 있다. ZnO 기반의 투명 박막 트랜지스터는 상온에서 증착 가능하여 유리기판을 이용한 광학소자와 플라스틱 기판을 이용한 플럭서블 소자 같은 차세대 전자소자를 구현 할 수 있다. 본 연구에서는 RF Magnetron Sputtering System을 이용하여 coming 1737 유리기판 위에 ZnO 박막을 공정압력에 따라 증착하고, 투명 반도체에 적합한 활용을 위한 구조적, 광학적 분석을 실시하였다. 박막 증착 조건은 초기 압력 $1.0{\times}10^{-6}$Torr, RF 파워는 100W, Ar 유량은 100sccm, 그리고 증착온도는 상온이었다. 증착 압력은 $7.0{\times}10^{-3}$, $2.0{\times}10^{-2}$, $7.0{\times}10^{-2}$Torr로 변화시켰다. 표면 분석 (SEM, AFM) 결과 증착압력이 고진공으로 변화함에 따라 결정립들이 감소하였고 RMS roughness값이 낮아졌다. 그리고 XRD 분석을 통해 피크강도는 증가하고 FWHM은 감소함을 보이고 있는데 이는 결정성이 좋아짐을 나타낸다. 그리고 광학 투과도를 통해 가시광 영역에서의 높은 투과도(85% 이상)을 확인하였고, 고진공으로 변화함에 따라 밴드갭이 넓어지는 것을 확인하였다.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.3
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• pp.15-19
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• 2003

In This paper, we developed 1.96 GHz air gap type FBAR BPF using ZnO as piezoelectric sputtered by RF magnetron at room temperature. FBAR BPF was fabricated by sputtering bottom electrode (Al), ZnO as piezoelectric and top electrode (Mo) on Si wafer one by one with RF magnetron sputter, then Si was dry etched to make an air hole. XRD test result of fabricated FBAR BPF showed that ZnO crystal was well pre-oriented as (002) and sigma value of XRC was 1.018. IL(Insertion loss) showed excellent result as 1 dB.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.11a
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• pp.143-147
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• 2002

In this paper, we investigated the deposition condition of Bragg reflector formation that will be expected to play an important role in future FBAR device applications. The thin films were deposited using an RF/DC magnetron sputtering technique. The material characteristics such as deposition rates, grain structures and surface roughnesses of the deposited silicon dioxide (SiO$_2$) and tungsten (W) films were investigated for various deposition conditions. As a result, it was found that the deposition condition could significantly affect the material characteristics of the deposited films and also the optimization of the deposition process is essentially important to obtain the desirable Brags reflector structure consisted of high-quality in films.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.201-201
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• 2010

본 연구에서는 RF magnetron co-sputtering을 이용하여 Zn-O-Ga 구성비에 따른 광투과도 및 전기적 특성을 연구하였다. 타겟으로 ZnO 및 $Ga_2O_3$ 소결체를 이용하였으며, 두 개의 RF magnetron sputter의 RF power를 동시에 조절하여 타겟의 구성비를 조절하였으며, 기판과 타겟의 거리를 25 mm~75 mm 범위 내에 조절하여 거리에 따른 Zn-O-Ga 박막의 광투과 특성 및 전기적 특성을 관찰하였다. $Ga_2O_3$ 소결체의 magnetron sputter의 RF power를 30 watt에서 100 watt로 증가함에 따라 박막내의 Ga 성분은 0.5%에서 7.4%로 증가하였으며 Zn 성분은 46.3%에서 40.9%로 O성분은 53.2%에서 51.6%로 각각 줄어들었다. 이에 따라 ZnO의 우선방위 (002) 결정각($2{\theta}$)은 34.24에서 33.87로 줄어들었으며, 이동도 $5.5\;cm^2/Vs$ 에서 $1.99\;cm^2/Vs$ 정도로 감소하는 경향을 보였다. 광투과도는 가시광선 영역에서 85% 이상 보였으며, carrier 밀도는 $0.5\;{\sim}\;4.0^*10^{20}/cm^3$로 증가함에 따라 이동도는 $1.5{\sim}5.5\;cm^2/Vs$로 투명전도막의 특성을 보였다.

• Journal of the Korean Vacuum Society
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• v.11 no.1
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• pp.1-7
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• 2002

We deposited $Ba_{0.5}Sr_{0.5}TiO_3$(BST) thin-films on Pt/Ti/$SiO_2$/Si substrates using RF magnetron sputtering method. A Substrate temperature was fixed at room temperature, while working gas flow ratio and RF Power were changed from 90:10 to 60:40 and 50 W, 75 W respectively. Also after BST thin films were deposited, we performed annealing in oxygen atmosphere using Rapid Thermal Annealing. For capacitor application we deposited Pt using E-beam evaporator of UHV system. In a structural property study through XRD measurement we found that crystallization depends on annealing rather than working gas ratio or and RF Power. Electrical properties showed relatively superior characteristic on the annealed sample with 50 W of RF Power.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.160-160
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• 2015

InGaZnO (IGZO) thin-film transistors (TFTs) are very promising due to their potential use in high performance display backplane [1]. However, the stability of IGZO TFTs under the various stresses has been issued for the practical IGZO applications [2]. Up to now, many researchers have studied to understand the sub-gap density of states (DOS) as the root cause of instability [3]. Nomura et al. reported that these deep defects are located in the surface layer of the IGZO channel [4]. Also, Kim et al. reported that the interfacial traps can be affected by different RF-power during RF magnetron sputtering process [5]. It is well known that these trap states can influence on the performances and stabilities of IGZO TFTs. Nevertheless, it has not been reported how these defect states are created during conventional RF magnetron sputtering. In general, during conventional RF magnetron sputtering process, negative oxygen ions (NOI) can be generated by electron attachment in oxygen atom near target surface and accelerated up to few hundreds eV by self-bias of RF magnetron sputter; the high energy bombardment of NOIs generates bulk defects in oxide thin films [6-10] and can change the defect states of IGZO thin film. In this study, we have confirmed that the NOIs accelerated by the self-bias were one of the dominant causes of instability in IGZO TFTs when the channel layer was deposited by conventional RF magnetron sputtering system. Finally, we will introduce our novel technology named as Magnetic Field Shielded Sputtering (MFSS) process [9-10] to eliminate the NOI bombardment effects and present how much to be improved the instability of IGZO TFTs by this new deposition method.

• Korean Journal of Materials Research
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• v.4 no.4
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• pp.453-458
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• 1994

$(Ba_{0.5}Sr_{0.5)/TiO_3$(BST) thin films were prepared for the application of 256 Mb DRAM by RF magnetron sputtering. The crystallinity of BST thin films increased with increasing deposition tempera lure. The composition of thin films was $(Ba_{0.48}Sr_{0.48)/TiO_{2.93}$ Pt/Ti barrier layer suppressed the diffusion of Si into BST layer. The films showed a dielectric constant of 320 and a dissipation factor of 0.022 at 100 kHz. the change of capacitance of the films with applied voltage was small, showing paraelectric property. The charge storage density and leakage current density were 40fC/$\mu \textrm{m}^{2}$ and 0.8$\mu A/\textrm{cm}^2$, respectively at a field of 0.15 MV/cm. The BST films obtained by RF magnetron sputtering appeared to be potential thin film capacitors for 256 Mb DRAM application.