• Korean Journal of Materials Research
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• v.22 no.2
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• pp.82-85
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• 2012

The effect of the alloy systems Al-Mg alloy and Al-Si alloy in this study on the characteristics of die-casting were investigated using solidification simulation software (MAGMAsoft). Generally, it is well known that the casting characteristics of Al-Mg based alloys, such as the fluidity, feedability and die soldering behaviors, are inferior to those of Al-Si based alloys. However, the simulation results of this study showed that the filling pattern behaviors of both the Al-Mg and Al-Si alloys were found to be very similar, whereas the Al-Mg alloy had higher residual stress and greater distortion as generated due to solidification with a larger amount of volumetric shrinkage compared to the Al-Si alloy. The Al-Mg alloy exhibited very high relative numbers of stress-concentrated regions, especially near the rib areas. Owing to the residual stress and distortion, defects were evident in the Al-Mg alloy in the areas predicted by the simulation. However, there were no visible defects observed in the Al-Si alloy. This suggests that an adequate die temperature and casting process optimization are necessary to control and minimize defects when die casting the Al-Mg alloy. A Tatur test was conducted to observe the shrinkage characteristics of the aluminum alloys. The result showed that hot tearing or hot cracking occurred during the solidification of the Al-Mg alloy due to the large amount of shrinkage.

• Journal of the Semiconductor & Display Technology
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• v.3 no.2
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• pp.35-40
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• 2004

The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film / substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 $\mu\textrm{m}$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI...

• The Korean Journal of Ceramics
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• v.3 no.4
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• pp.257-262
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• 1997

Aluminum nitride(AIN) thin films were deposited on SiO$_2$/Si substrates by reactive sputtering for the application of SAW devices. The major deposition parameters such as pressure, nitrogen fraction, rf power, substrate distance were changed to find out the optimal condition for c-axis oriented thin films on an amorphous substrate. The effects of deposition parameters on the crystal structure, residual stress, and growth morphology of thin films were characterized by XRD, SEM, and TEM. The FWHM of (002) rocking curve of the films deposited at the proper condition was lower than 2.2$^{\circ}$(C=0.93$^{\circ}$). Cross-sectional TEM showed that self-aligned structure was developed just after slightly random growth at the initial stage. The frequency characteristics of test device fabricated from AIN thin films confirmed their piezoelectric property and applicability for SAW devices.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.10a
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• pp.248-253
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• 1998

Recently, the uses of Ceramic/metal bonded joints, resin/metal joints, adhesive joints, composite materials which are composed of dissimiliar materials have increased in various industry fields. Since the ceramic/metal bonded joints material is made at a high temperature, residual stress distributions due to differences in material properties were investigated by varying material parameters. The two dimensional finite element analysis was performed to study residual stress distribution in Si3N4/SM45C bonded joint with a copper interlayer between the silicon nitride(Si3N4) and the structural carbon steel(SM45C) and 4-point bending tests were carried out under room temperature. Fracture surface and crack propagation path were observed using scanning electron microscope and characteristics of its fracture was discussed.

• Journal of the Korean Vacuum Society
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• v.1 no.1
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• pp.145-152
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• 1992

Si surfaces exposed to CHF3/C2F6 gas plasmas ih reactive ion etching (RIE) have been characterized by X-ray photoelectron spectroscopy (XPS). CHF3/C2F6 gas plasma exposure of Si surface leads to the deposition of residual film containing carbon and fluorine. The narrow scan spectra of C 1s show various bonding states of carbon as C-Si, C-F/H, C-CFx(x $\leq$ 3), C-F, C-F2, and C-F3. The chemical bonding states of fluorine are described with F-Si, F-C and F-O. And the oxygen and silicon are also detected. The effects of parameters for reactive ion etching as CHF3/C2F6 gas ratio, RF power, and pressure are investigated.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.5
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• pp.249-252
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• 2001

The paper represents the design and fabrication of an electrostatic micro actuator with $p^+$,/TEX> Si cantilevers. The micro actuator consists of a plate suspended by four $p^+$,/TEX> silicon cantilevers and an electrode on a glass substrate. The $p^+$,/TEX> Si structure is fabricated by the boron diffusion process and the anisotropic wet etch process. The cantilevers of the micro actuator curl down because of the residual stress gradient in $p^+$,/TEX> silicon. When the electrostatic forec is applied to the $p^+$,/TEX> cantilevers, the vertical displacement of the plate can be achieved. The deflection of the cantilever due to the residual stress gradient and the vertical displacement by electrostatic force were calculated. The displacement of the plate was measured with a laser displacement meter for various input voltages and frequencies. The feasibility of the proposed micro actuator for the applications to optical pickup devices or optical communication devices was confirmed by the experiments.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.10
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• pp.1541-1550
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• 1997

Since the ceramic/metal joint material is made at a high temperature, the residual stress develops when it is cooled from bonding temperature to room temperature due to remarkable difference of thermal expansion coefficient between ceramic and metal. As residual stress at ceramic/metal joints influences the strength of joints, it is important to estimate residual stress quantitatively. In this study, it is attempted to estimate joint residual stress of Si$_3$N$_4$STS304 joints quantitatively and to compare the strength of joints. The difference of residual stress is measured when repeated thermal cycl is loaded, under the conditions of the practical use of the ceramic/metal joint. The residual stress increases at 1 cycle of thermal load but decreases in 3 cycles to 10 cycles of thermal load. And 4-point bending test is performed to examine the influence of residual stress on fracture strength. As a result, it is known that the stress of joint decreases as the number of thermal cycle increases.

• Transactions of the Korean Society of Automotive Engineers
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• v.8 no.4
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• pp.26-33
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• 2000

In-cylinde flow and mixture formation are key contributors to both idle stability and combustion stability at part load condition in SI engine. The real time measurements of air-fuel ration and in- cylinder residual gas fraction are particularly important to obtain a better understanding of the mechanisms for combustion and emissions especially during cold start and throttle transient condition. This paper reports the cycle resolved measurements of residual gas fraction and equivalence ration near speak plug with value timing change and their effects on combustion characteristics at part load. The results showed that the effect of intake value opening on the residual gas fraction was smaller than that of exhaust valve closing because of the decreases of exhaust gas reverse flow from exhaust port. The variation of equivalence ratio near spark plug increased with the increase of value overlap and it closely related with heat release rate and combustion stability

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.7
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• pp.1664-1673
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• 1994

As a fundamental study on effects of thermal-cycles on residual stress of ceramics/metal joints, residual stresses in $Si_3N_4$/SUS304 joint specimens were measured before and single thermal-cycle by X-ray diffraction method and finite element method(FEM). The residual stress was found to increase after single thermal-cycle, which was agreeable with the results of residual stress measurement by X-ray diffraction method and residual stress analysis by finite element method. After the residual stress measurement, 4-point bending tests were performed. The relationship between the bending strength, the thermal-cycle temperature and hold time was examined. The bending strength was found to decrease with the increase of residual stress in linear relation.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.103-108
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• 2000

Since the ceramic/metal joint material is made at a high temperature, the residual stress development when it is cooled from bonding temperature to room temperature due to remarkable difference of thermal expansion coefficient between ceramic and metal. As residual stress at ceramic/metal joints influences the strength of joints, it is important to estimate residual stress quantitatively. In this study, it is attempted to estimate joint residual stress of $Si_3N_4/STS304$ joints quantitatively and to compare the strength of Joints. The difference of residual stress is measured when repeated thermal cycle is loaded under the conditions of the practical use of the ceramic/metal joint. And 4-point bending test is performed to examine the influence of residual stress on fracture strength. As a residual it is known that the stress of joint decreases as the number of thermal cycle increases.