• 한국생물공학회:학술대회논문집
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• 2003.10a
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• pp.603-603
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• 2003

• 한국생물공학회:학술대회논문집
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• 2003.10a
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• pp.610-610
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• 2003

• 한국생물공학회:학술대회논문집
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• 2003.10a
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• pp.609-609
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• 2003

• 한국가스학회:학술대회논문집
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• 2000.09a
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• pp.215-220
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• 2000

• Proceedings of the Microbiological Society of Korea Conference
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• 2002.10a
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• pp.220.1-220.1
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• 2002

• Proceedings of the Membrane Society of Korea Conference
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• 2000.11a
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• pp.98-101
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• 2000

No Abstract, See Full Text

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.10 no.8
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• pp.4008-4022
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• 2016

This paper tries to extend the conventional conceptual framework of the Internet of Things (IoT) so as to reify an advanced pervasive IoT-community collaboration concept, which is called the process-aware Internet of Things. The extended conceptual framework is embodied as a referential architecture that can be a standardized reference model supporting the conceptual integration of the Internet of Things and the process awareness. The extended referential architecture covers the full range of the architectural details from abstracting the process-aware behavioral semantics to reifying the IoT-process enactments. These extended framework and architecture ought to be the theoretical basis for implementing a process-aware IoT-community computing system supporting process-aware collaborations of Things in pervasive computing environments. In particular, we do point up that the proposed framework of the process-aware Internet of Things is revised from the Internet of Things framework announced in ITU-T SG13³ Y.2060 [26] by integrating the novel concept of process awareness. We strongly believe that the extended conceptual framework and its referential architecture are able to deliver the novel and meaningful insight as a standardized platform for describing and achieving the goals of IoT-communities and societies.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.641-644
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• 2008

Traditional LTPS TFT needs additional LDD process to decrease leakage current. However the fabrication process is no suitable for PI substrate. Additional laser multi-irradiation will damage the poly-Si to cause the TFT electrical degrade. Therefore we propose the simplified process to activate the $N^+$ and $N^-$ at the same time.

• 한국생물공학회:학술대회논문집
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• 2005.10a
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• pp.634-634
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• 2005

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 2002.11a
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• pp.191-194
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• 2002

매체 순환식 연소(Chemical-Looping Combustion, CLC)는 금속 산화물(산소공여매체, oxygen carrier)의 산소를 이용하여 화석연료를 산화(연료 연소 공정)시키고, 환원된 금속을 다시 산화(매체 산화 공정)시키는 간접적인 연소 공정의 하나이다. 이 방식은 온실효과의 주발생원인 $CO_2$를 원천적으로 회수할 수 있고, 또한 화염이 없는 상태에서 연소반응이 진행됨으로 thermal NOx의 발생을 미연에 방지할 수 있어 고효율의 환경친화적인 연소공정이다.(중략)