• Journal of the Korea Society of Computer and Information
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• v.24 no.5
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• pp.49-58
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• 2019

In this paper, we propose an edge cloud platform architecture for implementing smart factory. The edge cloud platform is one of edge computing architecture which is mainly focusing on the efficient computing between IoT devices and central cloud. So far, edge computing has put emphasis on reducing latency, bandwidth and computing cost in areas like smart homes and self-driving cars. On the other hand, in this paper, we suggest not only common functional architecture of edge system but also light weight cloud based architecture to apply to the specialized requirements of smart factory. Cloud based edge architecture has many advantages in terms of scalability and reliability of resources and operation of various independent edge functions compare to typical edge system architecture. To make sure the availability of edge cloud platform in smart factory, we also analyze requirements of smart factory edge. We redefine requirements from a 4M1E(man, machine, material, method, element) perspective which are essentially needed to be digitalized and intelligent for physical operation of smart factory. Based on these requirements, we suggest layered(IoT Gateway, Edge Cloud, Central Cloud) application and data architecture. we also propose edge cloud platform architecture using lightweight container virtualization technology. Finally, we validate its implementation effects with case study. we apply proposed edge cloud architecture to the real manufacturing process and compare to existing equipment engineering system. As a result, we prove that the response performance of the proposed approach was improved by 84 to 92% better than existing method.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.29-36
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• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

• The Journal of the Korea Contents Association
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• v.11 no.2
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• pp.79-87
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• 2011

Although products with the fingerprint recognition system currently show a rapid growth in quantity, it is also true that efforts to consider the product quality have been lacking until now. Accordingly, this paper analyzed technological elements with domestic and foreign market situations for products with the fingerprint recognition system to develop an evaluation model to support the quality increase by evaluating aspects of product quality for the knowledge information security, identifying the level of quality and deriving directions for improvements. A model for the reliability quality evaluation was constructed that can be applied comprehensively to non-functional elements that have not been done in the existing evaluations central to the security functions by analyzing requirements for the security, performance and reliability in consideration of features on products. It is considered that this paper can make contributions to the overall quality increase for products with the knowledge information security by reflecting features and trends for the fingerprint recognition products and building a model for the reliability and evaluation to perform evaluations by product.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.22 no.9
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• pp.1220-1227
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• 2018

Avionics electronic equipment refers to the electronic equipment installed on an aircraft. Failure of avionics equipment can have a significant impact on aircraft operations as well as threaten the safety of pilots and passengers. Therefore, avionics electronic equipment is required to have higher reliability and safety than electronic equipment used for other purposes. Avionics equipment must consider various component selection and system design to meet reliability and safety-related requirements from the initial design stage. In this paper, we describe safety, reliability performance analysis method of avionics equipment, and introduce various design improvement methods that can be performed to meet safety requirement performance. Finally, the safety performance of the improved avionics equipment was reanalyzed and compared with the value before the improvement, the validity of the proposed design change was verified.

• Bulletin of the Society of Naval Architects of Korea
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• v.27 no.4
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• pp.67-71
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• 1990

This study is concerned with the optimum design of stiffened cylindrical members frequently found in floating offshore platforms with constraints on reliability. Minimised is the expected total cost which is composed of the structural cost and the expected failure cost. Some design requirements drawn from variotus design codes are also considered as constraints. Reliability of critical component in a structure only is considered in this paper and the system failure is discarded since the probability of system failure is in general much smaller than the probability of component failure and it is very difficult to evaluate the cost due to system failure. Ultimate strength only is considered and not the fatigue strength. Several parametric studies are illustrated and the optimum solutions for different strength models which are now in use for the design of stiffened cylinders are derived to show the optimum designs against different strength models for the same type of structural component. The present results lead to the important conclusions relating to the posibility of more cost saving in the design of such structure through the reliability-based optimisation process.

• Korean Journal of Metals and Materials
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• v.47 no.8
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• pp.500-507
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• 2009

Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.

• KIPS Transactions on Software and Data Engineering
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• v.8 no.7
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• pp.265-274
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• 2019

The reliability test performed when developing the weapon system software is classified into static test and dynamic test. In static test, checking the coding rules, vulnerabilities and source code metric are performed without executing the software. In dynamic test, its functions are verified by executing the actual software based on requirements and the code coverage is measured. The purpose of this static/dynamic test is to find out defects that exist in the software. However, there still exist defects that can't be detected only by the current reliability test on the weapon system software. In this paper, whether defects that may occur in the software can be detected by static test and dynamic test of the current reliability test on the weapon system is analyzed through experiments. As a result, we provide guidance on improving the reliability test of weapon system software, especially the dynamic test.

• Journal of the Korean Society of Safety
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• v.33 no.5
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• pp.170-176
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• 2018

Laboratory inspection and diagnosis is a means of investigating and assessing various hazards or the state of research equipment in a laboratory, then taking appropriate safety measures to prevent accidents and injury. In many cases, laboratory inspection and diagnosis carried out by agencies are performed in a perfunctory manner that only barely satisfies the legal requirements. The aim of the present study is to provide clearly established pricing criteria for laboratory inspection and diagnosis, so as to prevent recurrence of laboratory accidents and to establish a safe laboratory environment. In order to clarify previously unclear matters, such as the lower limit for bids submitted by laboratory inspection and diagnosis agencies, technical manpower requirements, and number of laboratories inspected and diagnosed per day, a questionnaire survey was administered to agency personnel. First, when asked what the lower limit for bids submitted by agencies should be in order to improve reliability of inspection and diagnosis results and make up for the shortcomings of the lowest-bidder-wins system, 85.5% of respondents answered that the lower limit for bids should stand at no lower than 90% of the estimated price. The level of technical expertise among the technical personnel committed to laboratory inspection and diagnosis was shown to impact the reliability of results, and questionnaire results indicated a need to vary technical expertise levels depending on the degree of hazard, substances handled, and equipment used in a given laboratory. Level of technical expertise(67.1%) and number of personnel(52.6%) were shown to have a greater impact on reliability of diagnosis than on reliability of inspection. According to the results, it is determined that three persons(specialist, advanced and intermediate) should be committed to inspections, while four persons(professional, specialist, advanced and intermediate) should be committed to diagnoses. The respondents indicated a larger number of laboratories could be inspected than diagnosed per day. This can be attributed to differences in the amount of work each task involves, and the time each task takes. Assuming a six-hour work day not counting transportation, paperwork and rest, it is thought that inspection of up to 36 laboratories will be possible if each laboratory is assigned no more than 10 minutes(34.7%), while up to 24 laboratories could be inspected and diagnosed if each laboratory is assigned 15 to 20 minutes(35.1%).

• Journal of Korea Society of Industrial Information Systems
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• v.29 no.2
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• pp.55-68
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• 2024

Plant engineering companies create or refer to requirements documents for each related field, such as plant process/equipment/piping/instrumentation, in different engineering departments. The process-related requirements document includes not only a description of the process but also the requirements of the equipment or related facilities that will operate it. Since the authors and reviewers of the requirements documents are different, there is a possibility that inconsistencies may occur between equipment or parts design specifications described in different requirement documents. Ensuring consistency in these matters can increase the reliability of the overall plant design information. However, the amount of documents and the scattered nature of requirements for a same equipment and parts across different documents make it challenging for engineers to trace and manage requirements. This paper proposes a method to analyze requirement sentences and calculate the similarity of requirement sentences in order to identify semantically identical sentences. To calculate the similarity of requirement sentences, we propose a named entity recognition method to identify compound words for the parts and properties that are semantically central to the requirements. A method to calculate the similarity of the identified compound words for parts and properties is also proposed. The proposed method is explained using sentences in practical documents, and experimental results are described.

• Journal of Aerospace System Engineering
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• v.12 no.4
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• pp.98-105
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• 2018

The satellite is exposed to various launch environments such as random vibrations and shock. Accordingly, structural design of electronic equipment mounted on satellite must meet reliability requirements at the box level. In addition, it is essential to secure the reliability of the solder joint applied to electronic equipment. In this paper, we performed a modal and quasi-static analysis for the purpose of satisfaction of the design requirements of the CCB (Camera Controller Box) present on the 500 kg-class compact advanced satellite (CAS500). In addition, structural safety of electronic components was verified by the Steinberg's method and random equivalent static analysis.