• 한국전기전자재료학회논문지
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• 제24권1호
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• pp.17-21
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• 2011

Copper (Cu) had been attractive material due to its superior properties comparing to other metals such as aluminum or tungsten and considered as the best metal which can replace them as an interconnect metal in integrated circuits. CMP (Chemical Mechanical Polishing) technology enabled the production of excellent local and global planarization of microelectronic materials, which allow high resolution of photolithography process. Cu CMP is a complex removal process performed by chemical reaction and mechanical abrasion, which can make defects of its own such as a scratch, particle and dishing. The abrasive particles remain on the Cu surface, and become contaminations to make device yield and performance deteriorate. To remove the particle, buffing cleaning method used in post-CMP cleaning and buffing is the one of the most effective physical cleaning process. AE(Acoustic Emission) sensor was used to detect dynamic friction during the buffing process. When polishing is started, the sensor starts to be loaded and produces an electrical charge that is directly proportional to the applied force. Cleaning efficiency of Cu surface were measured by FE-SEM and AFM during the buffing process. The experimental result showed that particles removed with buffing process, it is possible to detect the particle removal efficiency through obtained signal by the AE sensor.

• Composites Research
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• 제27권6호
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• pp.248-253
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• 2014

본 연구에서는 발포 알루미늄으로 구성된 접착 구조물에서의 접합면에 대한 파괴 특성을 조사하기 위하여 각도를 변수로 정하고 TDCB 시험편을 설계하였다. 이 시험편들은 길이는 200 mm이고 시험편에 대한 접착면의 경사 각도는 $6^{\circ}$, $8^{\circ}$, $10^{\circ}$와 $12^{\circ}$인 네 가지로 모델링을 하였다. 이 시험편들의 실험 및 해석을 분석한 결과, 경사면 각도가 $6^{\circ}$, $8^{\circ}$, $10^{\circ}$와 $12^{\circ}$인 경우에 시험편들의 최대 하중은 각각 약 120 N, 137 N, 154 N과 171 N으로 발생하였다. 해석의 결과 값이 실험치에 가까워져 많은 차이를 보이지 않는 것을 확인할 수 있다. 따라서 이와 같은 연구 방법을 응용하여 실험 대신 시뮬레이션을 통하여 접착제로 접착된 알루미늄 폼으로 된 재료의 전단 거동에 관한 물성치를 효율적으로 파악할 수 있다고 사료된다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1999년도 추계학술발표회 초록집
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• pp.15-15
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• 1999

In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the conventional rotating barrel. vibrational barrel (vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components, The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed that the average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value, Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components, However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. $2HD{\;}+{\;}e{\;}{\rightarrow}20H{\;}+{\;}H_2$ Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure thereby resulting to bad plating condition. 1 lot of chip was divided into two equal partion. Each portion was loaded to the same barrel one after the other. Nickel plating and tin-lead plating was performed in the same station. Portion A maintained the normal barrel vibration intensity and portion B vibration intensity was increased two steps higher. All other parameters, current, solution condition were maintained constant. Generally, plating method find procedures were carried out in a best way to maintained the best plating condition. After plating, samples were taken out from each portion. molded and polished. Plating thickness was investigated for both. To check consistency of results. 2nd trial was done now using different lot of another characteristics.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.17-18
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• 2011

Plasma in liquid phase has attracted great attention in the last few years by the wide domain of applications in material processing, decomposition of organic and inorganic chemical compounds and sterilization of water. The plasma in liquid is characterized by three main regions which interact each - other during the plasma operation: the liquid phase, which supply the plasma gas phase with various chemical compounds and ions, the plasma in the gas phase at atmospheric pressure and the interface between these two regions. The most complex region, but extremely interesting from the fundamental, chemical and physical processes which occur here, is the boundary between the liquid phase and the plasma gas phase. In our laboratory, plasma in liquid which behaves as a glow discharge type, is generated by using a bipolar pulsed power supply, with variable pulse width, in the range of 0.5~10 ${\mu}s$ and 10 to 30 kHz repetition rate. Plasma in water and other different solutions was characterized by electrical and optical measurements. Strong emissions of OH and H radicals dominate the optical spectra. Generally water with 500 ${\mu}S/cm$ conductivity has a breakdown voltage around 2 kV, depending on the pulse width and the repetition rate of the power supply. The characteristics of the plasma initiated in ultrapure water between pairs of different materials used for electrodes (W and Ta) were investigated by the time-resolved optical emission and the broad-band absorption spectroscopy. The deexcitation processes of the reactive species formed in the water plasma depend on the electrode material, but have been independent on the polarity of the applied voltage pulses. Recently, Coherent anti-Stokes Raman Spectroscopy method was employed to investigate the chemistry in the liquid phase and at the interface between the gas and the liquid phases of the solution plasma system. The use of the solution plasma allows rapid fabrication of the metal nanoparticles without being necessary the addition of different reducing agents, because plasma in the liquid phase provides a reaction field with a highly excited energy radicals. We successfully synthesized gold nanoparticles using a glow discharge in aqueous solution. Nanoparticles with an average size of less than 10 nm were obtained using chlorauric acid solutions as the metal source. Carbon/Pt hybrid nanostructures have been obtained by treating carbon balls, synthesized in a CVD chamber, with hexachloro- platinum acid in a solution plasma system. The solution plasma was successfully used to remove the template remained after the mesoporous silica synthesis. Surface functionalization of the carbon structures and the silica surface with different chemical groups and nanoparticles, was also performed by processing these materials in the liquid plasma.

• Applied Microscopy
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• 제36권4호
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• pp.271-277
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• 2006

본 연구에서는 흰쥐 발바닥에 complete Freund's adjuvant(CFA)를 투여한 후 염증부위에서 관찰되는 비만세포의 분포양상 및 미세구조를 zinc selenium autometal-lography$(AMG^{ZnSe})$로 염색한 후 광학 및 전자현미경으로 관찰하였다. 광학현미경으로 관찰된 CFA투여에 의한 염증성 반응은 피하층에 국한되어 있었으며, zinc함유 비만세포는 주로 피하조직의 혈관 주변에 분포하고 있었다. AMG 염색에 의한 흑갈색을 띠는 과립이 세포질을 채우고 있었으며, 많은 비만세포의 경우 세포막이 파괴되어 과립이 주위조직으로 퍼져 관찰되었다. 전자현미경으로 관찰된 zinc함유 비만세포는 불규칙한 외형을 띠었으며, 표면에는 작은 돌기들이 관찰되었다. AMG염색에 따른 은입자(silver grains)가 세포질내 과립에 국한되었으며, 높은 전자 밀도의 동질성 기질로 구성되어 있었으며, 경계막으로 싸여 있었다. 세포질내 세포소기관 중에서 특히 골지 복합체가 잘 발달되어 있었으며, 형질내세망과 사립체는 비교적 적게 가지고 있었다. 이들 세포의 핵은 비교적 작고 둥글고, 세포의 중심부에 위치하였으며, 이질염색질로 이루어져 있었다.

• 청정기술
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• 제21권4호
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• pp.248-256
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• 2015

MnO₂를 KMnO₄와 MnCl₂･4H₂O을 이용해 자연침전을 유도한 후, 수열방법으로 120-200 ℃, 0.5-5시간 범위에서 제조하여 300 ℃에서 열처리 후 CO 산화반응을 수행하였다. 촉매활성 원인의 규명과 물리화학적 특성을 분석하기 위해 X 선 회절 분석, 질소 흡착, 주사전자현미경, 수소 또는 일산화탄소 승온환원 분석(H₂- 또는 CO-TPR)을 실시하였다. 합성조건에 따라 순수한 α-MnO₂ 혹은 α/β-혼합상을 가진 MnO₂가 각각 합성되었다. 촉매활성과 안정성은 순수한 α-MnO₂ 상에서 α/β-혼합상을 가진 MnO₂보다 우수하게 관찰되었다. 특히, 150 ℃에서 1시간 수열 합성된 촉매는 가장 큰 비표면적인 214 m² g^-1을 가졌으며 H₂, CO-TPR 분석에서 가장 우수한 환원성과 격자산소 종의 활성을 보였으며 일산화탄소의 승온 및 등온 산화반응에서 가장 우수한 촉매활성을 나타내었다. 이것은 촉매의 물리화학적 특성에 기인한 것으로 촉매의 결정구조, 비표면적, 환원성 및 격자산소 종의 활성은 촉매활성과 깊은 상관관계가 존재함을 확인하였다.

• 한국응용과학기술학회지
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• 제33권1호
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• pp.51-57
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• 2016

이 연구에서는 계면활성제에 작용기를 첨가하여 유화제 뿐만 아니라 합성에서의 모노머로 작용할 수 있는 반응성 계면활성제를 합성하였다. 반응성 계면 활성제는 메타아크릴 산, 아크릴산과 비이온성 계면 활성제인 폴리 옥시 에틸렌 라우릴 에테르 (POE 23)를 사용하여 합성되었으며 벤젠을 용매로서 사용하였고, P-TsOH를 촉매로서 사용 하였다. 합성된 계면 활성제는 FT-IR, $^1H$-NMR 스펙트럼, 원소 분석을 하였다. 물성 평가는 HLB, Cloud point, 표면 장력, 임계 미셀 농도를 측정 하였다. HLB 값은 11.62~12.09 범위로 평가 하였다. cmc 값은 표면 장력 법으로 측정하였을 때 $1{\times}10^{-4}{\sim}5{\times}10^{-4}$의 값을 가졌다. 실험을 통해 측정된 Cloud point은 35, $39^{\circ}C$ 이었다. 합성 계면 활성제의 유화 특성은 polyoxyethylene lauryl ether보다 낮았다. 또한, 유화력은 벤젠에서 보다 대두유에서 더 좋았다. 실험결과 합성 수율은 93.27 ~ 94.49%로 확인되었다.

• 대한화장품학회지
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• 제30권2호
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• pp.189-195
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• 2004

카본 블랙은 매우 낮은 밀도로 화장품에는 사용되지 않고 있지만 독성이 없고 안정한 물리적 특성과 검은색의 특성으로 이용 가치가 있다고 사료되는 바이다. 본 연구에서는 TEOS, a) PEO/ lecithin, b) PEO/polyethylene glycol, c) lecithin/polyethylene을 ethanol/water 수용액상에서 계면활성제를 탄화시켜 sol-gei반응에 의해 meso-porous silica샘플을 얻었고 N2 조건하 50$0^{\circ}C$에서 열처리된 organic-inorganic hybrid silica를 합성하였다. Pore안에 카본 블랙을 함유하는 meso-porous silica는 친수성, 소수성 용매에서 모두 좋은 분산성을 보여준다. 이 샘플은 BET에 의해 specific surface area (750$m^2$/g)과 pore size (4-6 nm)이고, XRD측정으로 pore structure (cylindrical type)를, 샘플의 SEM촬영으로 morphology(0.1-0.5$\mu\textrm{m}$ 입자 크기를 갖는 spherical powder)를 갖는다는 것을 알아냈다. 이렇게 합성한 카본-실리카 블랙 컬러를 마스카라에 적용하면 일반적으로 마스카라에 사용되던 블랙 컬러 사용시 보다 좀더 검은색을 보여주는 것은 물론이고 우수한 분산성도 갖는다. 무엇보다 이 파우더의 밀도 조절이 가능하여 마스카라 뿐 만 아니라 모든 화장품에의 사용이 가능하다.

• 공업화학
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• 제33권5호
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• pp.459-465
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• 2022

천연 흑연의 전기화학적 특성 향상을 목적으로 피치 코팅을 실시하였다. 최적 코팅용 피치의 합성조건을 알아보기 위해 다양한 온도에서 합성된 피치를 코팅하여 음극 특성을 알아보았다. 합성온도가 증가할수록 연화점, 잔탄율이 증가하며 열적 안정성이 높아졌으나, 430 ℃에서는 과한 축합반응으로 NI (NMP Insoluble)가 다량 합성되었다. 높은 열적 안정성으로 표면의 균일도와 코팅 두께가 증가함에 따라 제조된 음극재의 향상된 초기쿨롱효율과 출력특성의 결과를 얻을 수 있었다. 하지만 과한 NI가 함유된 피치로 코팅한 음극재는 코팅이 실시되지 않은 흑연보다 저하된 전기화학 특성을 나타냈다. NI는 분산성이 낮고 열처리 후 구체 형성의 영향으로 불균일한 SEI층 형성에 기인한다는 결과를 얻을 수 있었다. 피치 합성온도를 제어하여 균일한 표면과 적절한 코팅층 형성이 이루어지는 최적 조건을 도출하였다.

• Archives of Plastic Surgery
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• 제36권3호
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• pp.318-321
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• 2009

Purpose: The bony mallet finger injury is generally managed by conservative treatments, but operative treatments are needed especially when the fractures involve above 30% of articular surface or distal phalanx is accompanied by subluxation in the volar side. This is the reason they often result in chronic instability, articular subluxation and unsatisfactory cosmetic. In this report, We describe new method using the hook plate as an operative treatment of Mallet finger deformity. Methods: Among 13 patients with Mallet finger deformity who came from February 2006 to February 2008, six patient were included in surgical indication. Under local anesthesia, H or Y type incision was made at the DIP joint area. After the DIP joint extension, the hook plate was put on the fracture line, and one self tapping screw was used for fixation. 2 hole plate which was one of the holes in 1.5 mm diameter was cut in almost half and bended through approximately $100^{\circ}$. Results: In all six cases which applied the hook plate, complications such as loss of reduction or nail deformity were not seen. In only one patient, hook pate was removed due to inflammatory reaction after surgery. At 2 weeks after operation, active motion of DIP joint was performed. The result was satisfactory not only cosmetically but also functionally. At 6 weeks after operation, the range of motion of DIP joint was average $64^{\circ}$. Conclusion: The purpose of the operative treatment for mallet finger deformity using the hook plate is to provide anatomical reduction with rigid fixation and to prevent contracture at the DIP joint. While other operations take 6 weeks, the operation using the hook plate begins an active motion at 2 weeks after operation. Complication rate was low and the method is rather simple. Thus, the operation using the hook plate is recommended as a good alternative method of the mallet finger deformity treatment.