• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• Journal of the Korean Society of Marine Environment & Safety
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• v.26 no.6
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• pp.732-741
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• 2020

Environmental regulations have recently been strengthened. Consequently, floating LNG(Liquefied Natural Gas) power plants are being developed, which are new power generation plants that generate electricity by utilizing LNG. A floating LNG power plant generates BOG(Boil-Off Gas) during its operation, and the system design of such a plant should be capable of removing or re-liquefying BOG. However, the design of an offshore plant differs according to the marine requirements. Hence, a process simulation model of the BOG re-liquefaction system is needed, which can be continuously modified to avoid designing the floating LNG power plant through trial and error. In this paper, to develop a model appropriate for the floating LNG power plant, a commercial process simulation program was employed. Depending on the presence of refrigerants, various BOG re-liquefaction systems were modeled for comparing and analyzing the re-liquefaction rates and liquid points of BOG. Consequently, the BOG re-liquefaction system model incorporating nitrogen refrigerants is proposed as the re-liquefaction system model for the floating LNG power plant.

• Journal of the Korea Safety Management & Science
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• v.6 no.4
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• pp.155-170
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• 2004

Among the semiconductor If-chips, unlike memory chips, a majority of Application Specific IC(ASIC) products are produced by customer orders, and meeting the customer specified due date is a critical issue for the case. However, to the one who understands the nature of semiconductor manufacturing, it does not take much effort to realize the difficulty of meeting the given specific production due dates. Due to its multi-layered feature of products, to be completed, a semiconductor product(called device) enters into the fabrication manufacturing process(FAB) repeatedly as many times as the number of the product specified layers, and fabrication processes of individual layers are composed with similar but not identical unit processes. The unit process called photo-lithography is the only process where every layer must pass through. This re-entrant feature of FAB makes predicting and planning of due date of an ordered batch of devices difficult. Parallel machines problem in the photo process, which is bottleneck process, is solved with restricted roll out algorithm. Roll out algorithm is a method of solving the problem by embedding it within a dynamic programming framework. Restricted roll out algorithm Is roll out algorithm that restricted alternative states to decrease the solving time and improve the result. Results of simulation test in condition as same as real FAB facilities show the effectiveness of the developed algorithm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.3
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• pp.231-237
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• 2003

RE(Nd, Sm) elements doped (RE/Y)$_{1.8}$B $a_{2.4}$C $u_{3.4}$$O_{7-x}$ [(RE/Y)1.8] high $T_{c}$ superconductors were directionally grown by Top Seed Melt Growth(TSMG) process in air atmosphere. The (001)melt-textured N $d_{1.8}$B $a_{2.4}$C $u_{3.4}$ $O_{7-X}$(Nd1.8) seed crystals were used for achieving the c-axis alignment large grains perpendicular to surface of the samples. The (RE/Y)1.8 SEM micrographs of the melt-textured (RE/Y)1.8 samples revealed that the nonsuperconducting (RE/Y)211 inclusions are uniformly distributed in the superconducting (RE/Y)123 matrix except the region very close to the Nd seed crystal. The microstructure and superconducting properties were investigated by XRD, SEM, TEM and SQUID magnetometer. The Melt-textured (RE/Y)1.8 samples showed an onset $T_{c}$=91K and sharp superconducting transition. Also, the magnetization value of the (RE/Y)1.8 samples were compared with those of Y1.8 sample at 77 K. 77 K. 77 K. 77 K.K.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2003.10a
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• pp.119-119
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• 2003

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.3
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• pp.1-7
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• 2016

The cutting processes used for monitoring engineering includes analysis and feedback about strange conditions, tools collision and tools wear in real time, for improving the working ratio of equipment and productivity. In this study, we proposed monitoring using profibus to increase the reliability as the most important factor for cutting monitoring. The profibus can increase the reliability of cutting monitoring for cutting torque of a main spindle motor and a feed motors through PLC-based interface.

• Journal of Information Technology Services
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• v.9 no.4
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• pp.169-185
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• 2010

According to software growth, also software maintenance has been continuously improving. In addition, the existing concept of software maintenance process demands operational management and improvement of service task. However, when we perform maintenance task, we have several constraints about applying service based requirement to system. Therefore, in order to solve these problems, we need a study of task of process for service based maintenance. In this paper, we propose a Service based Software Maintenance Process. Proposed process based on MaRMI-RE standard for software development and maintenance and compares it with the service based representative standards. In a related works, we study activity of ITIL and identify activities and tasks for maintenance. After this, identified activities and tasks compare with activities of MaRMI-RE. And then, we derive activities and tasks of a Service based Software Maintenance Process. Finally, we validate a result by comparing the proposed process with a general service operational process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.3
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• pp.135-140
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• 2016

In this study, we developed the solution-processed PMMA-$HfO_x$ hybrid ReRAM devices to overcome the respective drawbacks of organic and inorganic materials. The performances of PMMA-$HfO_x$ hybrid ReRAM were compared to those of PMMA- and $HfO_x$-based ReRAMs. Bipolar resistive switching behavior was observed from these ReRAMs. The PMMA-$HfO_x$ hybrid ReRAMs showed a larger operation voltage margin and memory window than PMMA-based and $HfO_x$-based ReRAMs. The reliability and electrical instability of ReRAMs were remarkably improved by blending the $HfO_x$ into PMMA. An Ohmic conduction path was commonly generated in the LRS (low resistance state). In HRS (high resistance state), the PMMA-based ReRAM showed SCLC (space charge limited conduction). the PMMA-$HfO_x$ hybrid ReRAM and $HfO_x$-based ReRAM revealed the Pool-Frenkel conduction. As a result of flexibility test, serious defects were generated in $HfO_x$ film deposited on PI (polyimide) substrate. On the other hand, the PMMA and PMMA-$HfO_x$ films showed an excellent flexibility without defect generation.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2007.11a
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• pp.488-492
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• 2007

In this study, we investigated how to distinguish customer delivered value to re-purchasing in fierce B2C industry. To identify key managerial variables that could distinctively impact re-purchasing, we first identified customer value proposition as per the customer buying decision process. Next, core value propositions of choice efficiency and competitive price are defined to determine vendor satisfaction during the searching stage and purchasing stage. The trust level is also introduced in the sense of reflecting confirmation to guarantee after purchase security. Then, significant managerial variables to impact on core value propositions are extracted. The resulting structural model illustrated that search convenience and quality assurance affect the choice efficiency, and re-purchase intention is strongly explained by both the vendor satisfaction and trust level. The empirical testing results also support that transaction cost reduction is key determinant of shopping at the Internet shopping mall. Furthermore, trust level should be combined to induce re-purchasing in addition to transaction cost savings.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.1
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• pp.1-7
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• 2018

We aimed to develop a high quality 3.5 ton class swing reducer by studying the efficiency improvement of the reducer through the optimum design and performance evaluation of the assembled, high efficiency, lightweight 3.5 ton swing reducer. Based on the optimal design of the worm and worm wheel, the optimal manufacturing method of the worm wheel, the optimized casing design, and the optimum design of the output pinion, Respectively. Therefore, in this paper, to improve the efficiency of the worm gear reducer system, we will develop the manufacturing technology and verify the mass production by combining the manufacturing process design, processing and assembling technology according to the optimization design. We have conducted research to realize mass production by product verification such as product efficiency, reliability and durability according to optimal design of worm gear reducer.