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Diamond Films on Electroless Ni-P Plated WC-Co Substrates (무전해 Ni-P도금층/WC-Co기판 상에 다이아몬드 막 제조)

  • Kim, Jin-Oh;Kim, Hern;Park, Jeong-Il;Park, Kwang-Ja
    • Applied Chemistry for Engineering
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    • v.8 no.5
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    • pp.742-748
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    • 1997
  • Diamond films which have high hardness and thermal conductivity can be used to improve the performance of WC-Co as a cutting tool material. However, it is difficult to get such coatings of good uniformity and adhesiveness due to the surface characteristics of WC-Co. To get better coatings, some techniques, such as the surface treatment of substrate or the formation of interlayer between substrate and diamond film, have been tried. In the present work, the nickel interlayer is formed onto WC-Co by electroless Ni-P plating, which is introduced as a new method, and then diamond film is deposited on the interlayer. Formation and uniformity of three layers, i.e., substrate, electroless plate, and diamond film, and the adhesiveness of interlayers were studied. To investigate the effects of pretreatment on electroless plating, two different methods such as acid treatment and diamond powder treatment were used. The effects of heat treatment of the electroless plated surface on adhesiveness between the substrate and the interlayer were examined. It was found that as the temperature increases, the Ni crystals grow and then result in improved adhesiveness. Diamond film coatings of pure diamond phase were obtained at $800^{\circ}C$. It is concluded that the heat treated electroless Ni-P plating can be effectively used as a interlayer between WC-Co substrate and diamond film.

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Characteristics of graphene sheets synthesized by the Thermo-electrical Pulse Induced Evaporation (전계 펄스 인가 증발 방법을 이용한 그라핀의 특성 연구)

  • Park, H.Y.;Kim, H.W.;Song, C.E.;Ji, H.J.;Choi, S.K.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.412-412
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    • 2009
  • Carbon-based nano materials have a significant effect on various fields such as physics, chemistry and material science. Therefore carbon nano materials have been investigated by many scientists and engineers. Especially, since graphene, 2-dimemsonal carbon nanostructure, was experimentally discovered graphene has been tremendously attracted by both theoretical and experimental groups due to their extraordinary electrical, chemical and mechanical properties. Electrical conductivity of graphene is about ten times to that of silicon-based material and independent of temperature. At the same time silicon-based semiconductors encountered to limitation in size reduction, graphene is a strong candidate substituting for silicon-based semiconductor. But there are many limitations on fabricating large-scale graphene sheets (GS) without any defect and controlling chirality of edges. Many scientists applied micromechanical cleavage method from graphite and a SiC decomposition method to the fabrication of GS. However these methods are on the basic stage and have many drawbacks. Thereupon, our group fabricated GS through Thermo-electrical Pulse Induced Evaporation (TPIE) motivated by arc-discharge and field ion microscopy. This method is based on interaction of electrical pulse evaporation and thermal evaporation and is useful to produce not only graphene but also various carbon-based nanostructures with feeble pulse and at low temperature. On fabricating GS procedure, we could recognize distinguishable conditions (electrical pulse, temperature, etc.) to form a variety of carbon nanostructures. In this presentation, we will show the structural properties of OS by synthesized TPIE. Transmission Electron Microscopy (TEM) and Optical Microscopy (OM) observations were performed to view structural characteristics such as crystallinity. Moreover, we confirmed number of layers of GS by Atomic Force Microscopy (AFM) and Raman spectroscopy. Also, we used a probe station, in order to measure the electrical properties such as sheet resistance, resistivity, mobility of OS. We believe our method (TPIE) is a powerful bottom-up approach to synthesize and modify carbon-based nanostructures.

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Millimeter-Scale Aligned Carbon Nanotubes Synthesized by Oxygen-Assisted Microwave Plasma CVD (MPCVD를 이용하여 밀리미터 길이로 수직 정렬된 탄소나노튜브의 합성)

  • Kim, Y.S.;Song, W.S.;Lee, S.Y.;Choi, W.C.;Park, C.Y.
    • Journal of the Korean Vacuum Society
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    • v.18 no.3
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    • pp.229-235
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    • 2009
  • Millimeter-scale aligned arrays of thin-multiwalled carbon nanotube (t-MWCNT) on layered Si substrates have been synthesized by oxygen-assisted microwave plasma chemical vapor deposition (MPCVD). We have succeeded in growth of vertically aligned MWCNTs up to 2.7 mm in height for 150 min. The effect of $O_2$ and water vapour on growth rate was systematically investigated. In the case of $O_2$ gas, the growth rate was ${\sim}22{\mu}m/min$, which is outstanding growth rate comparing with those of conventional thermal CVD (TCVD). Scanning electron microscope (SEM), energy-dispersive spectroscopy (EDS), and Raman spectroscopy were used to analyze the CNT morphology, composition and growth mechanism. The role of $O_2$ gas during the CNT growth was discussed on.

Structural, Optical, and Electrical Characterization of p-type Graphene for Various AuCl3 Doping Concentrations (AuCl3를 도핑하여 제작한 p형 그래핀의 도핑농도에 따른 구조적, 광학적, 및 전기적 특성 연구)

  • Kim, Sung;Shin, Dong Hee;Choi, Suk-Ho
    • Journal of the Korean Vacuum Society
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    • v.22 no.5
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    • pp.270-275
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    • 2013
  • Single-layer graphene layers have been synthesized by using chemical vapor deposition, subsequently transferred on 300 nm $SiO_2/Si$ and quartz substrates, and doped with $AuCl_3$ by spin coating for various doping concentrations ($n_D$) from 1 to 10 mM. Based on the $n_D$-dependent variations of Raman frequencies/peak-intensity ratios, sheet resistance, work function, and Dirac point, measured by structural, optical, and electrical analysis techniques, the p-type nature of graphene is shown to be strengthened with increasing $n_D$. Especially, as estimated from the drain current-gate voltage curves of graphene field effect transistors, the hole mobility is very little varied with increasing $n_D$, in strong contrast with the $n_D$-dependent large variation of electron mobility. These results suggest that $AuCl_3$ is one of the best p-type dopants for graphene and is promising for device applications of the doped graphene.

Generation of Charged Clusters and their Deposition in Polycrystalline Silicon Hot-Wire Chemical Vapor Deposition (열선 CVD 증착 다결정 실리콘에서 전하를 띈 클러스터의 생성 및 증착)

  • Lee, Jae-Ik;Kim, Jin-Yong;Kim, Do-Hyeon;Hwang, Nong-Moon
    • 한국신재생에너지학회:학술대회논문집
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    • 2005.11a
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    • pp.561-566
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    • 2005
  • Polycrystalline silicon films were deposited using hot wire CVD (HWCVD). The deposition of silicon thin films was approached by the theory of charged clusters (TCC). The TCC states that thin films grow by self-assembly of charged clusters or nanoparticles that have nucleated in the gas phase during the normal thin film process. Negatively charged clusters of a few nanometer in size were captured on a transmission electron microscopy (TEM) grid and observed by TEM. The negatively charged clusters are believed to have been generated by ion-induced nucleation on negative ions, which are produced by negative surface ionization on a tungsten hot wire. The electric current on the substrate carried by the negatively charged clusters during deposition was measured to be approximately $-2{\mu}A/cm^2$. Silicon thin films were deposited at different $SiH_4$ and $H_2$ gas mixtures and filament temperatures. The crystalline volume fraction, grain size and the growth rate of the films were measured by Raman spectroscopy, X-ray diffraction and scanning electron microscopy. The deposit ion behavior of the si1icon thin films was related to properties of the charged clusters, which were in turn controlled by the process conditions. In order to verify the effect of the charged clusters on the growth behavior, three different electric biases of -200 V, 0 V and +25 V were applied to the substrate during the process, The deposition rate at an applied bias of +25 V was greater than that at 0 V and -200 V, which means that the si1icon film deposition was the result of the deposit ion of charged clusters generated in the gas phase. The working pressures had a large effect on the growth rate dependency on the bias appled to the substrate, which indicates that pressure affects the charging ratio of neutral to negatively charged clusters. These results suggest that polycrystalline silicon thin films with high crystalline volume fraction and large grain size can be produced by control1ing the behavior of the charged clusters generated in the gas phase of a normal HWCVD reactor.

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Fuel Supply of Direct Carbon Fuel Cells via Thermal Decomposition of Hydrocarbons Inside a Porous Ni Anode (다공성 니켈 연료 전극 내부에서 탄화수소의 열분해를 통한 직접 탄소 연료 전지의 연료공급)

  • Yi, Hakgyu;Li, Chengguo;Jalalabadi, Tahereh;Lee, Donggeun
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.39 no.6
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    • pp.527-534
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    • 2015
  • This study offers a novel method for improving the physical contact between the anode and fuel in a direct carbon fuel cell (DCFC): a direct generation of carbon in a porous Ni anode through the thermal decomposition of gaseous hydrocarbons. Three kinds of alkane hydrocarbons with different carbon numbers (CH4, C2H6, and C3H8) are tested. From electron microscope observations of the carbon particles generated from each hydrocarbon, we confirm that more carbon spheres (CS), carbon nanotubes (CNT), and carbon nanofibers (CNF) were identified with increasing carbon number. Raman scattering results revealed that the carbon samples became less crystalline and more flexible with increasing carbon number. DCFC performance was measured at $700^{\circ}C$ with the anode fueled by the same mass of each carbon sample. One-dimensional carbon fuels of CNT and CNF more actively produced and had power densities 148 and 210 times higher than that of the CS, respectively. This difference is partly attributed to the findings that the less-crystalline CNT and CNF have much lower charge transfer resistances than the CS.

Simultaneous Transfer and Patterning of CVD-Grown Graphene with No Polymeric Residues by Using a Metal Etch Mask

  • Jang, Mi;Jeong, Jin-Hyeok;Trung, T.Q.;Lee, Nae-Eung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.642-642
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    • 2013
  • Graphene, two dimensional single layer of carbon atoms, has tremendous attention due to its superior property such as high electron mobility, high thermal conductivity and optical transparency. Especially, chemical vapor deposition (CVD) grown graphene has been used as a promising material for high quality and large-scale graphene film. Unfortunately, although CVD-grown graphene has strong advantages, application of the CVD-grown graphene is limited due to ineffective transfer process that delivers the graphene onto a desired substrate by using polymer support layer such as PMMA(polymethyl methacrylate). The transferred CVD-grown graphene has serious drawback due to remaining polymeric residues generated during transfer process, which induces the poor physical and electrical characteristics by a p-doping effect and impurity scattering. To solve such issue incurred during polymer transfer process of CVD-grown graphene, various approaches including thermal annealing, chemical cleaning, mechanical cleaning have been tried but were not successful in getting rid of polymeric residues. On the other hand, lithographical patterning of graphene is an essential step in any form of microelectronic processing and most of conventional lithographic techniques employ photoresist for the definition of graphene patterns on substrates. But, application of photoresist is undesirable because of the presence of residual polymers that contaminate the graphene surface consistent with the effects generated during transfer process. Therefore, in order to fully utilize the excellent properties of CVD-grown graphene, new approach of transfer and patterning techniques which can avoid polymeric residue problem needs to be developed. In this work, we carried out transfer and patterning process simultaneously with no polymeric residue by using a metal etch mask. The patterned thin gold layer was deposited on CVD-grown graphene instead of photoresists in order to make much cleaner and smoother surface and then transferred onto a desired substrate with PMMA, which does not directly contact with graphene surface. We compare the surface properties and patterning morphology of graphene by scanning electron microscopy (SEM), atomic force microscopy(AFM) and Raman spectroscopy. Comparison with the effect of residual polymer and metal on performance of graphene FET will be discussed.

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A Study of Copper Production Techniques at the Archaeological Site in Gwanbukri, Buyeo in the 6th and 7th Centuries (6~7C 부여 관북리 유적의 동 생산기법 연구)

  • Lee, Ga Young;Cho, Nam Chul
    • Journal of Conservation Science
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    • v.36 no.3
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    • pp.162-177
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    • 2020
  • Research was conducted to characterize the copper production and smelting process with 11 copper smelting by-products (copper slag and copper crucible) excavated from the NA and LA areas at the Gwanbuk-ri archeological site in Buyeo. Scanning electron microscopy-energy dispersive spectroscopy, wavelength dispersive X-ray fluorescence, X-ray diffraction, and Raman microspectroscopy were employed in the analysis. The research results reveal that the copper slag from Gwanbuk-ri contained silicate oxide, magnetite, fayalite, and delafossite, which are typical characteristics of crucible slag and refined slag. The outward appearance and microstructure of the slag were grouped as follows: 1. glassy matrix + Cu prill, 2. glassy matrix + Cu prill + magnetite, 3. silicate mineral matrix + Cu prill, 4. crystalline (delafossite and magnetite) + amorphous (Cu prill), 5. magnetite + fayalite, and 6. slag from slag. The copper slags from Guanbuk-ri were found to contain residues of impurities such as SiO2, Al2O3, CaO, SO4, P2O5, Ag2O, and Sb2O3 in their microstructure, and, in some cases, it was confirmed that copper, tin and lead are alloys. These results indicate that refining of intermediate copper(including impurities) and refining of alloys of copper(including impurities) - tin and refining of copper(including impurities) - tin - lead took place during the copper production process at Gwanbuk-ri, Buyeo.

The Photovoltaic Effect of Iodine-Doped Metal Free Phthalocyanine/ZnO System (Ⅱ). The Photovoltaic Effect of $ZnO/H_2Pc(I)_x$ Dispersed in Poly(9-vinylcarbazole) (요오드가 도핑된 무금속 프탈로시아닌/산화아연계의 광기전력 효과 (Ⅱ). Poly(9-vinylcarbazole)에 분산된 $ZnO/H_2Pc(I)_x$계의 광기전력 효과)

  • Heur, Soun-Ok;Kim, Young-Soon
    • Journal of the Korean Chemical Society
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    • v.39 no.3
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    • pp.176-185
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    • 1995
  • To improve photosensisitizing efficiency of ZnO/$H_2Pc(I)_x$ system, ZnO/$H_2Pc(I)_x$ system was dispersed in a typical photoconductive polymer of poly(9-vinylcarbazole)(PVCZ). The iodine dopant level(x) of ZnO/${\chi}-H_2Pc(I)_x$ is proportional to concentration of iodine, whereas x of ZnO/${\beta}-H_2Pc(I)_x$ decreased from the highest x=0.97 at more than $6.3{\times}10^{-3}$ M iodine solution. The Raman spectra of ZnO/${\chi}-H_2Pc(I)_x$ at 514 nm exhibited characteristic $I_3^-$ patterns in the range of 50∼550 $cm^{-1}$ at $x{\geq}0.57.$ The surface photovoltage of ZnO/${\chi}-H_2Pc(I)_{0.48}$/PVCZ was approximately 1.6 times greater than ZnO/${\chi}-H_2 Pc(I)_{0.48}$ and was 1.8 times of ZnO/${\chi}-H_2Pc(I)_{0.57}$/PVCZ at 670 nm. With ZnO/$H_2Pc(I)_x$/PVCZ, the highest iodine dopant levels showed a higher photovoltage. Therefore the injection of holes from H2Pc into PVCZ resulted in that photosensisitizing effect of ZnO/$H_2Pc(I)_x$/PVCZ system was improved compared to ZnO/$H_2Pc(I)_x$ case.

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Characterization of Nitrogen-Doped $TiO_2$ Thin Films Prepared by Metalorganic Chemical Vapor Deposition (유기금속 화학 기상증착법으로 실리콘 기판위에 증착된 질소치환 $TiO_2$ 박막의 특성분석)

  • 이동헌;조용수;이월인;이전국;정형진
    • Journal of the Korean Ceramic Society
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    • v.31 no.12
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    • pp.1577-1587
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    • 1994
  • TiO2 thin films with the substitution of oxygen with nitrogen were deposited on silicon substrate by metalorganic chemical vapor deposition (MOCVD) using Ti(OCH(CH3)2)4 (titanium tetraisopropoxide, TTIP) and N2O as source materials. X-ray diffraction (XRD) results indicated that the crystal structure of the deposited thin films was anatase TiO2 with only (101) plane observed at the deposition temperatures of 36$0^{\circ}C$ and 38$0^{\circ}C$, and with (101) and (200) plane at above 40$0^{\circ}C$. Raman spectroscopic results indicated that the crystal structure was anatase TiO2 in accordance with the XRD results without any rutile, fcc TiN, or hcp TiN structure. No fundamental difference was observed with temperature increase, but the peak intensity at 194.5 cm-1 increased with strong intensity at 143.0 cm-1 for all samples. The crystalline size of the films varied from 49.2 nm to 63.9 nm with increasing temperature as determined by slow-scan XRD experiments. The refractive index of the films increased from 2.40 to 2.55 as temperature increased. X-ray photoelectron spectroscopy (XPS) study showed only Ti 2s, Ti 2p, C 1s, O 1s and O 2s peaks at the surface of the film. The composition of the surface was estimated to be TiO1.98 from the quatitative analysis. In the bulk of the film Ti 2s, Ti 2p, O 1s, O 2s, N 1s and N 2s were detected, and Ti-N bonding was observed due to the substitution of oxygen with nitrogen. A satellite structure was observed in the Ti 2p due to the Ti-N bonding, and the composition of titanium nitride was determined to be about TiN1.0 from the position of the binding energy of Ti-N 2p3/2 and the quatitative analysis. The spectrum of Ti 2p energy level could be the sum of a 4, 5, or 6 Gaussian curve reconstruction, and the case of the sum of the 6 Gaussian curve reconstruction was physically most meaningful. From the results of Auger electron spectroscopy (AES), it was known that the composition was not varied significantly throughout the whole thickness of the film, and silicon oxide was not observed at the interface between the film and the substrate. The composition of the film was possible (TiO2)1-x.(TiN)x or TiO2-2xNx and in this experimental condition x was found to be about 0.21-0.16.

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