• Journal of Broadcast Engineering
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• v.17 no.3
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• pp.503-518
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• 2012

In this paper, we propose a complexity-based parallelization method of the sample adaptive offset (SAO) algorithm which is one of HEVC in-loop filters. The SAO algorithm can be regarded as region-based process and the regions are obtained and represented with a quad-tree scheme. A offset to minimize a reconstruction error is sent for each partitioned region. The SAO of the HEVC can be parallelized in data-level. However, because the sizes and complexities of the SAO regions are not regular, workload imbalance occurs with multi-core platform. In this paper, we propose a LCU-based SAO algorithm and a complexity prediction algorithm for each LCU. With the proposed complexity-based LCU processing, we found that the proposed algorithm is faster than the sequential implementation by a factor of 2.38 times. In addition, the proposed algorithm is faster than regular parallel implementation SAO by 21%.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.6
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• pp.633-643
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• 2013

GDS format files, as well as layout of the chip are noticeably needed so as to analyze the PDN (Power Delivery Network) inside of IC; however, commercial IC in the market has not supported design information which is layout of IC. Within this, in terms of IC having on-chip PDN, characteristic of inside PDN of the chip is a core parameter to predict generated noise from power/ground planes. Consequently, there is a need to scrutinize extraction method for unknown PDN of the chip in this paper. To extract PDN of the chip without IC circuit information, the de-embedding test vehicle is fabricated based on IEC62014-3. Further more, the extracted inside PDN of chip from de-embedding technique adopts the Co-simulation model which composes PCB, QFN (Quad-FlatNo-leads) Package, and Chip for the PDN, applied Co-simulation model well corresponds with impedance from measured S-parameters up to 4 GHz at common measured and simulated points.