• Clean Technology
• /
• v.28 no.3
• /
• pp.227-231
• /
• 2022

The demand for high-voltage power devices is rising in various industries, but especially in the transportation industry due to autonomous driving and electric vehicles. IGBT module parts of 3.3 kV or more are used in the power propulsion control device of electric vehicles, and the procurement of these parts for new construction and maintenance is increasing every year. In addition, research to optimize high-voltage IGBT parts is urgently required to overcome their very high technology entry barrier. For the development of high-voltage IGBT devices over 3.3 kV, the resistivity range setting of the wafer and the optimal conditions for major unit processes are important variables. Among the manufacturing processes to secure the optimal junction depth, the optimization of the diffusion process, which is one step of the unit process, was examined. In the diffusion process, the type of gas injected, the injection time, and the injection temperature are the main variables. In this study, the range of wafer resistance (Ω cm) was set for the development of high voltage IGBT devices through unit process simulation. Additionally, the well drive in (WDR) condition optimization of the diffusion process according to temperature was studied. The junction depth was 7.4 to7.5 ㎛ for a ring pattern width of 23.5 to25.87 ㎛, which can be optimized for supporting 3.3 kV high voltage power devices.