• 반도체디스플레이기술학회지
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• 제19권2호
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• pp.16-21
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• 2020

How accurately reproducible energy is delivered to the wafer in the process of making thin films using PE-CVD (Plasma enhanced chemical vapor deposition) during the semiconductor process. This is the most important technique, and most of the reaction on the wafer surface is made by thermal energy. In this study, we studied the method of monitoring the change of thermal energy transferred to the wafer surface by monitoring the temperature change according to the change of the thin film formed on the showerhead facing the wafer. Through this research, we could confirm the monitoring of wafer thin-film which is changed due to abnormal operation and accumulation of equipment, and we can expect improvement of semiconductor quality and yield through process reproducibility and equipment status by real-time monitoring of problem of deposition process equipment performance.

• 한국경영과학회:학술대회논문집
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• 대한산업공학회/한국경영과학회 1990년도 춘계공동학술대회논문집; 한국과학기술원; 28 Apr. 1990
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• pp.326-334
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• 1990

A monitoring process of a communication network with two links is analyzed. The Markov process is introduced to compute busy and idle portions of monitoring processor and monitored rate of each link. Inter-idle times and inter-monitoring ties of monitoring processor between two links are respectively computed. A recursive formula is introduced to make the computational procedure rigorous.

• International Journal of Contents
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• 제4권4호
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• pp.7-11
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• 2008

This paper embodies the agent based cinder monitoring system which supports PDA{Personal Digital Assistant). Monitoring system automatically manages data by using data managing agents such as a state managing agent, a location managing agent, a badness managing agent, a circumstances managing agent, etc, and uses a massive data processing agent to manage massive data. The development of agent based data monitoring system for the stable cinder reuse will be an epoch-making method to develop the process mechanized or manual-labored that widely spreads into the real-time automated process.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.230-235
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• 1997

During laser welding, a laser induced matal vapour and plasuma is formed. The plasma shows strong fluctuation combined with acoustic sound emission. On-line monitoring of the process is possible by measuring and analysing the plasma and acoustic sound emission. This paper introduce the method of on line process monitoring in the laser beam welding and analysis being monitoring signal. The results show the complementary information on the process.

• 한국생산제조학회지
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• 제5권1호
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• pp.43-50
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• 1996

From a manufacturing standpoint it would be desirable to monitor the degradation of drawing die, that is essential for the maintenance of die quality, the evaluation of product integrity and the reducing scrap. Acoustic emission is powerful method in monitoring fine wire drawing process, especially in detecting the die fracture at early stage. Experiments also suggested that acoustic emission sigals contained valuable information regarding the stage of a drawing process such as the surface appearance of products and the condition of lubrication. These informations are AE monitoring techniques a possible tool in monitoring the drawing process operation. In order to approach this, this paper discusses the nature of acoustic emission signal presented which illustrate the effects of wire and die material, lubricants, and drawing speed on the generation and the mean voltage level of acoustic emission signal. From these experimental, results, we understanded controlling factors of acoustic emission generation.

• JSTS:Journal of Semiconductor Technology and Science
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• 제11권1호
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• pp.1-5
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• 2011

To enter next process control, numerous approaches, including run-to-run (R2R) process control and fault detection and classification (FDC) have been suggested in semiconductor manufacturing industry as a facilitation of advanced process control. This paper introduces a novel type of optical plasma process monitoring system, called plasma eyes chromatic system (PECSTM) and presents its potential for the purpose of fault detection. Qualitatively comparison of optically acquired signal levels vs. process parameter modifications are successfully demonstrated, and we expect that PECSTM signal can be a useful indication of onset of process change in real-time for advanced process control (APC).

• Korean Chemical Engineering Research
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• 제46권2호
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• pp.233-247
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• 2008

공정 모니터링 기술은 공정 내에서 일어나는 예상치 못한 조업변화 및 이상을 조기에 감지하고 조업 이상에 영향을 끼친 근본 원인을 밝혀내어 제거해 줌으로써 공정의 안정적인 조업과 양질의 제품생산의 기반을 제공하여 준다. 데이터에 기반한 통계적 공정 모니터링 방법은 양질의 공정 데이터만 주어진다면 통계적 처리를 접목하여 비교적 쉽게 모니터링을 할 수 있고 공정의 데이터 분석에 이용할 수 있는 도구를 얻을 수 있다는 장점이 있다. 그러나 실제 공정에서는 비선형성, non-Gaussianity, 다중 운전모드, 공정상태변화로 인해 기존의 다변량 통계적 방법을 이용한 공정 모니터링 기법은 비효율적이거나, 공정 감시 성능의 저하, 종종 신뢰할 수 없는 결과를 야기한다. 이러한 경우 기존의 방법으로는 더이상 공정을 정확히 감시할 수 없기 때문에 최근에 많은 새로운 방법들이 개발 되었다. 본 총설에서는 이러한 단점을 보안하기 위해 최근 주목할 만한 연구결과인 공정 비선형성을 고려한 커널주성분분석(kernel principle component analysis) 모니터링 기법, 주성분분석 모델 조합을 이용한 다중모델(mixture model) 모니터링 기법, 공정 변화를 고려한 적응모델(adaptive model) 모니터링 기법, 그리고 센서 이상진단과 보정의 이론과 응용결과에 대하여 소개한다.

• Transactions on Electrical and Electronic Materials
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• 제14권2호
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• pp.71-77
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• 2013

Advanced semiconductor manufacturing technology requires methods to maximize tool efficiency and improve product quality by reducing process variability. Real-time plasma process monitoring and diagnosis have become crucial for fault detection and classification (FDC) and advanced process control (APC). Additional sensors may increase the accuracy of detection of process anomalies, and optical monitoring methods are non-invasive. In this paper, we propose the use of a chromatic data acquisition system for real-time in-situ plasma process monitoring called the Plasma Eyes Chromatic System (PECS). The proposed system was initially tested in a six-inch research tool, and it was then further evaluated for its potential to detect process anomalies in an eight-inch production tool for etching blanket oxide films. Chromatic representation of the PECS output shows a clear correlation with small changes in process parameters, such as RF power, pressure, and gas flow. We also present how the PECS may be adapted as an in-situ plasma arc detector. The proposed system can provide useful indications of a faulty process in a timely and non-invasive manner for successful run-to-run (R2R) control and FDC.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.653-657
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• 2000

The paper describes the contents and results of the national project named "Development of Computer Integrated Product Design for Automation Equipment". It is focussed on the real-time control '||'&'||' monitoring of manufacturing process for automobile rubber parts. Automobile rubber parts industy is one of the typical process that high11 depends upon manufacturing facilities and equipments. So. it requires high cost and engineering technolog) on plant implementation. But most companies of rubber parts industries are small or mid companies that habe weak abilities for plant implementation properly and systematically. Therefore, for upgrading the levelof automation. it is necessar). to dekelope the computer based management and monitoring slsteni that enables to build-up the common base of automation and systemization. 'Through this project. we developed low cost real-time monitoring system for banbun mixing process '||'&'||' mold injection process of rubbcr parts manufacturing, that is composed with DDCU(Distributed Digital Control Unit),signal interfaces to gathering mon~toring terms and speciall\ developed functional sofhare including some algorithm for management '||'&'||' process monitoring

• 한국경영과학회지
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• 제36권1호
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• pp.39-55
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• 2011

Process monitoring has been emphasized for the monitoring of complex system such as chemical processing industries to achieve the efficiency enhancement, quality management, safety improvement. Recently, ICA (Independent Component Analysis) based MSPC (Multivariate Statistical Process Control) was widely used in process monitoring approaches. Moreover, DICA (Dynamic ICA) has been introduced to consider the system dynamics. However, the existing approaches show the limitation that their performances are strongly dependent on the statistical distributions of control variables. To improve the limitation, we propose a novel approach for process monitoring by integrating DICA and LOF (Local Outlier Factor). In this paper, we aim to improve the fault detection rate with the proposed method. LOF detects local outliers by using density of surrounding space so that its performance is regardless of data distribution. Therefore, the proposed method not only can consider the system dynamics but can also assure robust performance regardless of the statistical distributions of control variables. Comparison experiments were conducted on the widely used benchmark dataset, Tennessee Eastman process (TE process), and showed the improved performance than existing approaches.