• 품질경영학회지
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• 제50권3호
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• pp.473-490
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• 2022

Purpose: The purpose of this study is to propose a new useful suggestion to monitor the stability of process by developing a stability ratio or index related to investigating how well the process is controlled or operated to the specified target. Methods: The proposed method to monitor the stability of process is building up a new measure index which is making up for the weakness of the existing index in terms of short or long term period of production. This new index is a combined one considering both stability and capability of process to the specification limits. We suppose that both process mean and process variation(or deviation) are changing on time period. Results: The results of this study are as follows: regarding the stability of process as well as capability of process, it was shown that two indices, called SI(stability index) and PI(performance index), can be expressed in two-dimensional X-Y graph simultaneously. This graph is categorized as 4 separated partitions, which are characterized by its numerical value intervals of SI and PI which are evaluated by test statistics. Conclusion: The new revised index is more robust than the existing one in investigating the stability of process in terms of short and long period of production, even in case both process mean and variation are changing.

• Communications for Statistical Applications and Methods
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• 제6권1호
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• pp.77-88
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• 1999

A new measure of the process capability index(PCI) $\textit{C}_{cpk}$ is proposed that takes into account the proximity to the target value as well as process mean and process variation when we assessing process performance. using the semivariance estimators proposed by Choobineh and Branting (1986) and Josephy and Aczel (1993) the estimator($\textit{C}_{cpk}$) of new index has been solved and the properties of these estimators have been examined through simulations. Also we compare the performance between $\textit{C}_{cpk}$ and $\textit{C}_{jpk}$ which is developed by Johnson kotz and Pearn(1992).

• 한국대기환경학회지
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• 제33권6호
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• pp.605-615
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• 2017

Efficient simultaneous reduction conditions for $NO_x$ and $NH_3$-slip was investigated in SCR (Selective Catalytic Reduction) process with load variation by applying dual catalysts (SCR catalyst, $NH_3$ decomposition catalyst) system. $N_2O$ formation characteristics were analyzed to look into possible undesirable reaction pathways. In the experiments of catalyst characteristics, various operational variables were tested for the combined catalytic system, such as $NH_3/NO_x$ ratio, temperature, oxygen concentration and $H_2O$. The reaction characteristics of $NO_x$, $NH_3$ and $N_2O$ were analyzed and optimal conditions could be evaluated for the combustion facility with varied load. In terms of $NO_x/NH_3$ simultaneous reduction and $N_2O$ formation suppression, optimal condition was considered NSR 1.2 and temperature $300^{\circ}C$. At this operational condition, $NO_x$ conversion was 98%, $NH_3$ reduction efficiency was 95%, generated $N_2O$ concentration 9.5 ppm with inlet $NO_x$ concentration of 100 ppm. In $NH_3-SCR$ process with $NH_3$ decomposition catalyst, $NO_x$ and $NH_3$ can be considered to be reduced simultaneously at limited conditions. The results of this study may be utilized as basic data at facilities requiring simultaneous $NO_x$ and $NH_3$ reduction for facilities with load variation.

• 대한전자공학회논문지SD
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• 제43권1호
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• pp.59-64
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• 2006

단일 기울기 ADC에 사용되는 램프 신호의 기울기는 공정과 주파수 변화에 민감하다. 이러한 변화는 ADC 이득 변화와 이미지 신호 프로세싱의 성능까지 영향을 준다. 본 논문에서는 자동 교정된 램프 신호를 이용한 단일 기울기 ADC를 이용하여 공정과 주파수 변화에 영향을 받지 않은 CMOS 이미지 센서를 제안하다. 본 논문에서 제안된 built-in-self-calibration (BISC) 구조는 공정과 주파수 변화에 상관없이 입력 조도별로 일정한 출력 값을 갖는 단일 기울기 ADC 동작을 가능하게 한다. 제안된 BISC를 탑재한 CMOS 이미지 센서는 $0.35{\mu}m$ 공정을 이용하여 제작하였다. 측정 결과는 제안된 구조가 공정이나 클럭 주파수의 변화에 따라 효과적으로 램프 기울기를 교정한다는 것을 보여준다. 칩 면적의 증가 정도는 $0.7\%$ 미미하였다.

• 전기전자학회논문지
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• 제22권2호
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• pp.420-426
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• 2018

가까운 미래에, 전자의 ballastic 혹은 near-ballastic 이동이 가능한 CNT(Carbon NanoTube)를 활용한 CNTFET(Carbon NanoTube Field Effect Transistor)은 현재의 실리콘 기반 트랜지스터를 교체할 유력한 후보 중 하나로 고려되고 있다. 고성능의 CNTFET으로 대규모 집적회로를 구현하기 위해서는 semiconducting CNT가 CNTFET 안에 동일한 간격과 높은 밀도로 정렬되어 배치되어야 하지만, CNTFET 공정의 미성숙으로, CNTFET 안의 CNT는 불규칙하게 배치하게 되고, 현존하는 HSPICE 라이브러리 파일은 불규칙한 CNT 배치에 의한 성능의 변화를 회로 레벨에서 평가할 수 있는 기능을 지원하지 않는다. 이러한 성능의 변화를 평가하기 위해서 선형 프로그래밍을 활용한 방법이 과거에 제안되었으나, CNTFET의 전류와 게이트 커패시턴스를 계산하는 과정에서 오차가 발생할 수 있는 문제점이 있다. 본 논문에서는 언급한 오차가 발생되는 이유에 대해서 자세히 논하고, 이 오차를 줄일 수 있는 새로운 방법을 제시하고자 한다. 시뮬레이션 검토 결과, 새롭게 제시된 방법이 기존 방법의 오차, 7.096%를 3.15%까지 줄일 수 있음을 보이고 있다.

• 한국물환경학회지
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• 제18권4호
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• pp.387-394
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• 2002

본 연구는 $TiO_2$ 광촉매 및 응집-여과-중화공정을 거친 아크릴폐수를 UF(tubular)/RO(spiral wound)공정에 적용하여 적용압력과 온도변화에 따른 성능변화를 고찰하였다. 한외여과 관형모듈에서 광촉매 전처리수와 응집-여과-중화 전처리수의 COD, T-N은 온도 및 압력변화에 크게 영향을 받지 않고, 제거효율도 낮은 것으로 확인할 수 있었다. TDS 및 turbidity의 경우 한외여과 관형 모듈에서 광촉매 전처리수가 응집-여과-중화공정의 처리수에 비해 처리효율이 우수함을 확인하였다. T-N, TDS는 역삼투막 공정에서 우수한 제거효율을 나타내었다.

• 한국산업보건학회지
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• 제29권4호
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• pp.488-499
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• 2019

Objectives: This study was conducted to identify the characterization of organics solvent exposure among painting workers in the shipbuilding painting process, especially for their daily variations(within worker variance). Methods: Charcoal passive dosimeters were worn throughout each work shift for 20 days for five painting workers from October 19 to November 26, 2015. A total of 100 samples were collected, analyzed and compared with statutory workplace environmental measurements. Results: The geometric mean(GM) and geometric standard deviation(GSD) of mixed organic solvent(six substances) exposure index(EI) for the 100 samples were 0.42 and 4.42 respectively. The median and range of GSD for within worker EI representing five workers' daily EI variation is 3.72 and 2.63 ~ 5.20, respectively, which is classified as a very large variation(GSD>3). We were able to divide the painting process into two similar exposure groups(SEGs), Touch-up and Spray. Spray painting workers were much more exposed to organic solvent than Touch-up painting workers(GM=0.71 vs. 0.19), but less variably (GSD=3.64 vs. 4.10). xylene is the substance to which the workers were most exposed(GM=16.19 ppm, GSD=4.36), and the exposure characteristics of six substances including xylene is similar to those of EI. Conclusions: The daily variation of organic solvent exposure in the shipbuilding painting process is so high that statutory Assessment of Reliability of Work Environment Monitoring needs to be conducted with statistically sufficient number of samples and evidence.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2013년도 추계학술대회
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• pp.375-378
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• 2013

본 논문에서는 EEPROM이나 MTP 등의 NVM 메모리 IP 설계에 필요로 하는 PVT(Process-Voltage-Temperature) 변동에 둔감한 기준전압(Reference Voltage) 회로를 설계하였다. 매그나칩반도체 $0.18{\mu}m$ EEPROM 공정을 이용하여 설계된 BGR(Bandgap Reference Voltage) 회로는 wide swing을 갖는 캐스코드 전류거울 (cascode current-mirror) 형태의 저전압 밴드갭 기준전압발생기 회로를 사용하였으며, PVT 변동에 둔감한 기준전압 특성을 보이고 있다. 최소 동작 전압은 1.43V이고 VDD 변동에 대한 VREF 민감도(sensitivity)는 0.064mV/V이다. 그리고 온도 변동에 대한 VREF 민감도는 $20.5ppm/^{\circ}C$이다. 측정된 VREF 전압은 평균 전압이 1.181V이고 $3{\sigma}$는 71.7mV이다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.245-249
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• 2009

According to the increase of intelligent vehicles many automotive electric components are installed. The wire harness which connects those also increases. The crimping process for compressing the copper wire bundle into the terminal is a key process to assure the good quality of wire harness. For the case of inadequate forming condition many shape failures such as less-filling, over-filling are happen in the crimping process. Even though the quality of crimping shape is satisfactory the quality check for electrical resistance of wire harness is sometime not satisfied the qualification due to large variation of electrical resistance of wire harness under climate test. This large variation is thought to be related with the malfunction automotive electric system and caused by the internal stress of wire, which occurred during the crimping process. In this paper we develop the 3D-FEM simulation scheme and design methodology of optimum terminal shape. Also the effect of terminal shape on the residual stress is discussed.

• 한국CDE학회논문집
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• 제16권6호
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• pp.414-423
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• 2011

The collaboration hub has been developed since 2004 as an online collaboration space, which supports the various collaborative works amongst small and medium enterprises using information sharing, collaboration project management, and project history management. Because of the change of manufacturing environment and rapid development of information technologies, it should be evolved from the existing version called Collaboration Hub 1.0. Recently, a lot of manufacturing enterprises know the importance of business process management(BPM) and start to introduce BPM systems. Our research group has developed the new version of Collaboration Hub 1.0 called Collaboration Hub 2.0 which contains the BPM concept, the consistent product data management, and the specialized functions overcoming the various variation of manufacturing. This study scrutinizes the meaning and role of the Collaboration Hub 2.0 and introduces an application study of it to the value chain of automobile module development consisted of a leading company and subcontractors. The case study covers the definition, execution and monitoring of collaboration process, the specialized functions overcoming the manufacturing variation and the key performance index of collaboration business.