• Proceedings of the Korea Society for Energy Engineering kosee Conference
• /
• 2003.11a
• /
• pp.67-70
• /
• 2003

• Journal of Korea Technology Innovation Society
• /
• v.4 no.1
• /
• pp.32-48
• /
• 2001

Many Korean companies have grown up through technology import, learning, development, innovation and export. This process is called as "the dynamic development process of technology". Among many companies which have grown up by way of this process, the Hyundai Motor Company has shown a very remarkable achievement in technological growth. In short, this paper deals with the growth of Korean companies in the view of the dynamic development process of technology. As a case study, the paper analyzes the Hyundai Motor Company.r Company.

• 한국생물공학회:학술대회논문집
• /
• 2005.04a
• /
• pp.483-483
• /
• 2005

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.14 no.3
• /
• pp.149-154
• /
• 2015

This study has focused on the deburring technology of a vacuum plate for MLCC lamination using electrolytic in-process dressing (ELID) grinding, and the magnetic-assisted polishing (MAP) process. The surface of the vacuum plate has many micro-holes for vacuum suction. They are easily blocked by the burrs created in the surface-flattening process, such as the conventional grinding process. In this study, the MAP process, the ELID grinding process, and an ultrasonic vibration table are examined to remove the micro-burrs that lead to the blockage of the holes. In the results of the experiments, the MAP process and ELID grinding technology showed significant improvements of surface roughness and deburring performance.

• Journal of Korean Institute of Industrial Engineers
• /
• v.34 no.4
• /
• pp.460-469
• /
• 2008

Process mining aims at mining valuable information from process execution results (called "event logs"). Even though process mining techniques have proven to be a valuable tool, the mining results from real process logs are usually too complex to interpret. The main cause that leads to complex models is the diversity of process logs. To address this issue, this paper proposes a trace clustering approach that splits a process log into homogeneous subsets and applies existing process mining techniques to each subset. Based on log profiles from a process log, the approach uses existing clustering techniques to derive clusters. Our approach are implemented in ProM framework. To illustrate this, a real-life case study is also presented.

• 한국생물공학회:학술대회논문집
• /
• 2003.10a
• /
• pp.613-613
• /
• 2003

• Korean Chemical Engineering Research
• /
• v.43 no.6
• /
• pp.728-739
• /
• 2005

An experiment and simulation were performed for hydrogen separation of mixtures by PSA (pressure swing adsorption) process on activated carbon. The binary ($H_2/Ar$; 80％/ 20％) and ternary ($H_2/Ar/CH_4$; 60％/ 20％/ 20％) mixtures were used to study the effects of feed composition. The cyclic performances such as purity, recovery, and productivity of 2bed-6step PSA process were experimentally and theoretically compared under non-isothermal and non-adiabatic conditions. The develped process produced the hydrogen with 99％ purity and 75％ recovery from both processes. Therefore, optimal separation condition was referred multicomponent gas mixtures.

• Journal of the Semiconductor & Display Technology
• /
• v.19 no.3
• /
• pp.55-60
• /
• 2020

The hard mask photo-resist strip inspection system for the semiconductor wafer manufacturing process inspects the position of the circuit pattern formed on the wafer by measuring the distance from the edge of the wafer to the strip processing area. After that, it is an inspection system that enables you to check the process status in real time. Process defects can be significantly reduced by applying a tester that has not been applied to the existing wafer strip process, edge etching process, and wafer ashing process. In addition, it is a technology for localizing semiconductor process inspection equipment that can analyze the outer diameter of the wafer and the state of pattern formation, which can secure process stability and improve wafer edge yield.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2006.10a
• /
• pp.279-280
• /
• 2006

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2006.10a
• /
• pp.637-638
• /
• 2006