• Title/Summary/Keyword: process rate

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Interrelation of the Diamond Disk and pad PCR in the CMP Process (CMP 공정에서 Diamond Disk와 Pad PCR 상관관계 연구)

  • Yun, Young-Eun;No, Yong-Han;Yoon, Bo-Earn;Bae, Sung-Hun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.11a
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    • pp.359-361
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    • 2006
  • As circuits become increasingly complex and devices sizes shrinks, the demands placed on global planarization of higher level. Chemical Mechanical Polishing (CMP) is an indispensable manufacturing process used to achieve global planarity. In the CMP process, Diamond Disk (DD) plays an important role in the maintenance of removal rate. According to studies, the cause of removal rate decrease in the early or end stage of diamond disk lifetime comes from pad surface change. We also presented pad cutting rate (PCR) as a useful cutting ability index of DD and studied PCR trend about variable parameters that including size, hardness, shape of DD and RPM, pressure of conditioner It has been shown that PCR control ability of pressure and shape is superior to RPM and size. High pressure leads to a decrease of cell open ratio of pad surface because polyurethane of pad is destroyed by pressure. So low pressure high RPM condition is a proper removal rate sustain. By examining correlations between RPM and pressure of conditioner, it has been shown that PCR safe zoneto satisfy proper removal rate has the range 0.06mm/hr to 0.12mm/hr.

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Effects of a Non-absorbable Gas on the Absorption Process in a Vertical Tube Absorber

  • Hur, ki-Joon;Jeong, Eun-Soo;Jeong, Si-Young
    • International Journal of Air-Conditioning and Refrigeration
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    • v.7
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    • pp.69-78
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    • 1999
  • Effects of a non-absorbable gas on the absorption process in a vertical tube absorber has been investigated numerically. The water vapor mixed with air is absorbed into LiBr/water solution film. The flow is assumed to be laminar and fully developed in both liquid and gas phases. The diffusion and energy equations were solved in both phases to give the temperature and concentrations, from which heat and mass fluxes were determined. The local absorption rate has been shown to decrease as the mass fraction of air in the water vapor increases. The vapor pressure of water at the liquid-vapor is interface reduced significantly since the non-absorbable gas accumulates near the interface. The effects of non-absorbable gases on absorption rate become larger as the mass flow rate of the vapor decreases. For a small amount of non-absorbable gases, the total absorption rate of water vapor increases as the mass flow rate of the vapor decreases. The total absorption rate increases as the mass flow rate of the vapor increases for large concentrations of non-absorbable gases at the inlet of an absorber.

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A Study on Effect of Tool Wear Rate upon Cutting Tool Shape in a Titanium Rough Cut Machining (티타늄 황삭가공에 있어서 공구형상이 공구마모율에 미치는 영향에 관한 연구)

  • Jung, Hwa
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.18 no.10
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    • pp.27-33
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    • 2019
  • The aviation industry has grown beyond the simple processing and assembling of aircraft parts and now designs and exports finished aircraft. In this study, the vertical CNC milling rotational speed and feed rate were parameters to investigate the life of tools according to their shape: (flat, round, and ball end mill) in the rough cutting of titanium. These tools are widely used in aircraft manufacturing and assembly. The purpose of this study is to measure the cutting temperature generated during the cutting process and calculate the rate of tool wear. This will be accomplished by measuring the tool weight before and after cutting the specimen and to compare it with the results of previous studies. Our study showed that the maximum cutting temperature increased as cutting time, tool rotational speed, and feed rate increased. The highest cutting temperatures were recorded for the ball, round, and flat end mill, respectively. Tool wear for the ball, round, and flat end mill increased as the speed and feed rate increased. The flat end mill exhibited the highest rate of wear from a minimum of 0.62% to a maximum of 2.88%.

Term Structure Estimation Using Official Rate

  • Rhee, Joon Hee;Kim, Yoon Tae
    • Communications for Statistical Applications and Methods
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    • v.10 no.3
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    • pp.655-663
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    • 2003
  • The fundamental tenn structure model is based on the modelling of the short rate. It is well-known that the short rate depends on the interest rate policy of monetary authorities, especially on the official rate. Babbs and Webber(1994) modelled the tenn structure of interest rates using the official rate. They assume that the official rate follows a jump process. This reflects that the official rate infrequently changes. In this paper, we test this official tenn structure model and compare the jump-diffusion model with the pure diffusion model.

A Study of Vision Algorithm Development for Growth Monitoring of Potato Microtubers (인공씨감자 생육상태 모니터링을 위한 화상처리 알고리즘 개발에 관한 연구)

  • Choi, J.W.;Chung, G.J.;Lim, S.J.;Choi, S.L.;Chung, H.;Nam, H.W.
    • Journal of Biosystems Engineering
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    • v.23 no.4
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    • pp.373-380
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    • 1998
  • The contribution of this paper is to provide the methods for the production automation of potato microtuber using the vision process in growth monitoring. The first method deals with computation for the growth density in the primary growth process. The second method addresses cognition process to identify the number and the volume of potato microtuber in secondary growth process. The third is to decide whether potato microtubers are infected by a virus or bacteria in growth process. The computation for the growth density in the primary growth process uses the method of Labeling. The second and third methods use template matching based on color patterns. With the developed method using vision process, this experiment is capable of discriminating weekly growth-rate in primary growth process, 85% cognition rate in secondary process and identifying whether there are infections. Therefore, we conclude that our experimental results are capable of growth monitoring for mass production of potato microtubers.

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Effect of Pad Buffing process on Material Removal Characteristics in Silicon Chemical Mechanical Polishing (실리콘 연마에서 패드 버핑 공정이 연마특성에 미치는 영향)

  • Park, Ki-Hyun;Jeong, Hae-Do;Park, Jae-Hong;Kinoshita, Masaharu
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.20 no.4
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    • pp.303-307
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    • 2007
  • This paper investigated the effect of the pad buffing process on the material removal characteristics and pad stabilization during silicon chemical mechanical polishing. The pads surface were controlled by the buffing process using a buffer made by the sandpaper. The buffing process is based on abrasive machining by using a high speed sandpaper. The controlled pad by the buffing process show less deformation deviation and stable material removal rate during the CMP process. In addition, the controlled pad ensure better uniformity of removal rate than comparative pads. As a result of monitoring, the controlled pad by the buffing process demonstrated constant and stable friction force signals from initial polishing stage. Therefore, the tufting process could control the pad surface to be uniform and improve the performance of the polishing pad.

The design parameter evaluation of ion exchange process for ultra pure water production (초순수 생산을 위한 이온교환공정 설계특성 평가)

  • Park, Se-Chool;Kwon, Boung-Su;Lee, Kyung-Hyuk;Jung, Kwan-Sue
    • Journal of Korean Society of Water and Wastewater
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    • v.29 no.1
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    • pp.65-75
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    • 2015
  • In this study, cation and anion exchange process for performance evaluation was conducted. A pilot plant for the ultrpure water production was installed with the capacity of $25m^3/d$. The various production rate and regeneration of ion exchange rate were tested to investigate the design parameters. The test resulst was applied to calculate the operating costs. Changing the flow rate of the ion exchange capacity of the reproduction reviewed the cation exchange process as opposed to the design value is 120 to 164% efficiency, whereas both anion exchange process is 82 to 124% efficiency, respectively. This results can be applied for more large scale plant if the scale up parameters are consdiered. The ion exchange capacity of the application in accordance with the design value characteristic upon application equipment is expected to be needed. In this study, the performance of cation and anion exchange resin process was evaluated with pilot plant($25m^3/d$). The ion exchange capacity along with space velocity and regeneration volume was evaluated. In results, the operation results was compared with design parameters.

A Study on the Characteristics of Poly-Si Etching Process Parameter Using ECR Plasma (ECR 플라즈마의 식각 공정변수에 관한 연구)

  • 안무선;지철묵;김영진;윤송현;유가선
    • Journal of the Korean Vacuum Society
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    • v.1 no.1
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    • pp.37-42
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    • 1992
  • Abstract-The ECR(E1ectron Cyclotron Resonance) plasma etcher was developed for process of manufacturing 16M164' DRAM and applied to poly-Si etching process. The etching rate and selectivity of poly-Si were investigated by changing the process factor of pressure gas and microwave power. The increasing power of microwave will have the trend of increasing the etching rate and selectivity of Oxide, and have suitable value process pressure at 6 mTorr. The increasing value of process gas SFdSF6+ Clz will cause the decrease of etching rate and selectivity, this is because the best process factor is not found.

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Process Modeling and Optimization for Characteristics of ZnO Thin Films using Neural Networks and Genetic Algorithms (신경망과 유전 알고리즘을 이용한 광소자용 ZnO 박막 특성 공정 모델링 및 최적화)

  • Ko, Young-Don;Kang, Hong-Seong;Jeong, Min-Chang;Lee, Sang-Yeol;Myoung, Jae-Min;Yun, Il-Gu
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.07a
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    • pp.33-36
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    • 2004
  • The process modeling for the growth rate in pulsed laser deposition(PLD)-grown ZnO thin films is investigated using neural networks(NNets) and the process recipes is optimized via genetic algorithms(GAs). D-optimal design is carried out and the growth rate is characterized by NNets based on the back-propagation(BP) algorithm. GAs is then used to search the desired recipes for the desired growth rate. The statistical analysis is used to verify the fitness of the nonlinear process model. This process modeling and optimization algorithms can explain the characteristics of the desired responses varying with process conditions.

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Effect of Free Abrasives on Material Removal in Lap Grinding of Sapphire Substrate

  • Seo, Junyoung;Kim, Taekyoung;Lee, Hyunseop
    • Tribology and Lubricants
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    • v.34 no.6
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    • pp.209-216
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    • 2018
  • Sapphire is a substrate material that is widely used in optical and electronic devices. However, the processing of sapphire into a substrate takes a long time owing to its high hardness and chemical inertness. In order to process the sapphire ingot into a substrate, ingot growth, multiwire sawing, lapping, and polishing are required. The lap grinding process using pellets is known as one of the ways to improve the efficiency of sapphire substrate processing. The lap grinding process ensures high processing efficiency while utilizing two-body abrasion, unlike the lapping process which utilizes three-body abrasion by particles. However, the lap grinding process has a high material removal rate (MRR), while its weakness is in obtaining the required surface roughness for the final polishing process. In this study, we examine the effects of free abrasives in lap grinding on the material removal characteristics of sapphire substrate. Before conducting the lap grinding experiments, it was confirmed that the addition of free abrasives changed the friction force through the pin-on-disk wear test. The MRR and roughness reduction rate are experimentally studied to verify the effects of free abrasive concentration on deionized water. The addition of free abrasives (colloidal silica) in the lap grinding process can improve surface roughness by three-body abrasion along with two-body abrasion by diamond grits.