• Journal of the Korean Society for Precision Engineering
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• v.19 no.2
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• pp.195-202
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• 2002

An automated process planning system for cold forging of non-axisymmetric parts of comparatively simple shape was developed in this study. Programs for the system have been written with Visual LISP in the AutoCAD using a personal computer and are composed of four main modules such as input module, shape cognition and shape expression module, material diameter determination module and process planning module. The design rules and knowledges for the system are extracted from the plasticity theories, handbook, relevant reference and empirical knowledge of field experts. Generally, in forging, only front view is needed for expression of axisymmetric parts, but non-axisymmetric parts need front and plane view. At the plane, this system cognizes the external shape of non-axisymmetric, parts - number of sides of regular polygon and radius of a circle circumscribing the polygon of n sides. At the front view, the system perceives diameter of axisymmetric portions and height of primitive geometries such as polygon, cylinder, cone, concave, convex, etc.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.3
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• pp.265-271
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• 2008

TCP(Tape Carrier Package), COG (Chip On Glass), COF(Chip On Film) are three methods for connecting LDI(LCD Driver IC) with LCD panels. Especially COF is growing its portion of market place because of low cost and fine pitch correspondence. But COF has a problem of the lead broken failure in LCD module process and the usage of customer. During PCB (Printed Circuit Board) bonding process, the mismatch of the coefficient of thermal expansion between PCB and D-IC makes stress-concentration in COF lead, and also D-IC bending process during module assembly process makes the level of stress in COF lead higher. As an affecting factors of lead-broken failure, the effects of SR(Solder Resister) coating on the COF lead, surface roughness and grain size of COF lead, PI(Polyimide) film thickness, lead width and the ACF(Anisotropic Conductive Film) overlap were studied, The optimization of these affecting manufacturing processes and materials were suggested and verified to prevent the lead-broken failure.

• Journal of Korean Physical Therapy Science
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• v.13 no.2
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• pp.57-65
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• 2006

This study was conducted to develop the PBL module using simulation(S-PBL), to apply it to the physical therapy curricula, and its effect on students; learning contents, learning process, and its overall impacts. The S-PBL module was apply on 47 students of first year physical therapy in Jeju Halla College for 8 weeks from 2005 Feb to April. The data was analyzed via SPSS 10.0; the evaluation of learning contents and process was divided into 5 areas; the learning impacts in 4 areas. The research sought average and standard deviations. The students; satisfaction regarding S-PBL learning contents and process averaged >3.5 (on the Likert Scale of 1 thru 5) which indicated high learning achievement. For the learning impact, using an S-PBL module, it averaged >2.8 (on the Likert Scale of 1 thru 4) which indicated high learning impact. Significantly, the students showed high satisfaction in the areas of clinical practicum, the learning process, the opportunity to participate in clinical affiliation, and motivation for acquiring professional knowledge. This study proved that the application of S-PBL is effective for the physical therapy students; ability to carry out physical therapy, and it is also worth to apply in the physical therapy curricula to improve the students; participation in clinical skills.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.67 no.1
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• pp.33-36
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• 2018

The purpose of this study is to improve the efficiency of anti-pollution film for PV module. The anti-pollution coating process was performed on a glass substrate, which is the same material as the glass substrate for the PV module. We coated the anti-pollution film on the glass substrate by spray coating. After coating process, annealing process was performed during 1 hour at $200^{\circ}C$, $300^{\circ}C$, and $400^{\circ}C$. And then we analyzed the surface characteristics according to the annealing temperature of the film. Annealing process can also improve the durability of the coated film. And then we analyzed the anti-pollution characteristics, particle size of anti-pollution film, light transmittance. The particle size of anti-pollution film was analyzed with FE-SEM. The light transmittance was analyzed with UV-Visible spectroscopy including integrating sphere.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.41-42
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.41-42
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• 2009

• Journal of Korean Elementary Science Education
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• v.31 no.1
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• pp.40-56
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• 2012

The purpose of this study was to understand the teaching effects after conducting ASI module in the open inquiry activities of the elementary science class. in order to understand the effects of ASI(Authentic Scientific Inquiry) module application using science research notes in open inquiry activities to students' science research ability. The results of this study were as follow. First, the after test results were covariance-analyzed to be the effects to science process skills were statistically significant in 0.5 significance level. Second, in the covariance analysis of the after test of the study group and the comparative group, the effects to scientific creative problem solving skills were statistically significant in 0.5 significance level. Third, the covariance analysis of the after test in the effects of ASI module application using science notebooks to students' scientific attitude revealed that the two groups' average difference was statistically significant in 0.5 significance level. In conclusion, application of the ASI module using science notebooks had a positive effect on improvements of students' science process skills, science creative problem solving ability and scientific attitude. Therefore, the ASI module using science notebooks is hopefully to be provided as an effective instructive strategy in the open inquiry activities courses in school in the future.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2009.10a
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• pp.421-426
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• 2009

This paper presents vibration analysis of maskless exposure module in Printed Circuit Board (PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the Finite Element Analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

• Journal of the Korea Convergence Society
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• v.11 no.10
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• pp.1-7
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• 2020

The manufacturing process of the resistive variable memory device, which is the based of neuromorphic device, maintained the continuity of vacuum process and applied plasma module suitable for the production of the ReRAM(resistive random access memory) and process technology for the neuromorphic computing, which ensures high integrated and high reliability. The ReRAM device of the oxide thin-film applied to the plasma module was fabricated, and research to improve the properties of the device was conducted through various experiments through changes in materials and process methods. ReRAM device based on TiO₂/TiOx of oxide thin-film using plasma module was completed. Crystallinity measured by XRD rutile, HRS:LRS current value is 2.99 × 10³ ratio or higher, driving voltage was measured using a semiconductor parameter, and it was confirmed that it can be driven at low voltage of 0.3 V or less. It was possible to fabricate a neuromorphic ReRAM device using oxygen gas in a previously developed plasma module, and TiOx thin-films were deposited to confirm performance.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.19 no.12
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• pp.1322-1328
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• 2009

This paper presents vibration analysis of maskless exposure module in printed circuit board(PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the finite element analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.