• Title/Summary/Keyword: process measurement

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Die Shift Measurement of 300mm Large Diameter Wafer (300mm 대구경 웨이퍼의 다이 시프트 측정)

  • Lee, Jae-Hyang;Lee, Hye-Jin;Park, Sung-Jun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.17 no.6
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    • pp.708-714
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    • 2016
  • In today's semiconductor industry, manufacturing technology is being developed for the purpose of processing large amounts of data and improving the speed of data processing. The packaging process in semiconductor manufacturing is utilized for the purpose of protecting the chips from the external environment and supplying electric power between the terminals. Nowadays, the WLP (Wafer-Level Packaging) process is mainly used in semiconductor manufacturing because of its high productivity. All of the silicon dies on the wafer are subjected to a high pressure and temperature during the molding process, so that die shift and warpage inevitably occur. This phenomenon deteriorates the positioning accuracy in the subsequent re-distribution layer (RDL) process. In this study, in order to minimize the die shift, a vision inspection system is developed to collect the die shift measurement data.

An Approach on Life Cycle Based Efficiency Measurement in Construction Industry (건설 생산의 Life Cycle을 고려한 효율성 측정방안)

  • Jung Soon-Oh;Yoon Su-Won;Chin Sangyoon;Kim Yea-Sang;Park Ji-Hoon
    • Proceedings of the Korean Institute Of Construction Engineering and Management
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    • 2004.11a
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    • pp.608-611
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    • 2004
  • Efficiency of the construction process is one of the most important factors to project success. However efficiency is not well defined or measured in construction projects in general. More importantly, efficiency of the construction should be viewed through the life-cycle of the whole production system not in a single phase of the construction process. Therefore, this study defines the concept of efficiency and suggests the efficiency measurement model in construction. As a case study, the suggested model was applied to the curtain wall construction process of the high rise buildings as well.

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Construction of Hydrographic Pump Dredge Process Management System Based on Beacon DGPS (비콘 DGPS기반 펌프식 해상준설 공정관리시스템의 구축)

  • Lee, Jin-Duk;Lee, Jae-Bin;Kim, Hyun-Ho
    • Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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    • v.29 no.6
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    • pp.613-620
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    • 2011
  • In order to perform scientific evaluation of dredge results, it is needed to construct the system which is able to manage and evaluate the work process by monitoring in real-time the dredge process such as dredge ship position, dredge depth and dredge volume. This research aims to develop the hydrographic dredge surveying system adding water depth measurement method to both precise positioning and navigation methods using GPS, which allows a high rate of measurement and long distances between the control point and dredging points, operate in all weather conditions, and does not require line of sight to points. We constructed Beacon DGPS-based hydrographic dredger guidance and position management system and developed the operation program which makes the dredge operation perform as monitoring work situation in real-time. It is expected that this developed system will be able to contributes to reducing ultimately the cost in hydrographic dredging or hydrographic construction industries.

Three Dimension Car Body Measuring System Using Industrial Robots (산업용 로봇을 이용한 3차원 차체측정 시스템)

  • Kim, Mun-Sang;Cho, Kyung-Rae;Park, Kang;Shin, Hyun-Oh
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.8
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    • pp.2555-2560
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    • 1996
  • Inspecting the dimensional accuracy of a car-body in assembly line is a very important process to assure high productivity. Now there exist two common inspecting methods in practice. One is to measure a sampled car-body with three dimensional measuring machine, and the other is to measure car-body with three dimensional measuring machine, and the other is to measure car-body in assembly line using many sensors fixed to a large jig frame. The formal method takes too long to inspect a sampled car-body of a same sort, and cannot therefore give an useful error trend for the whole production. On the other hand, the latter lacks flexibility and is very cost-intensive. By using industrial robots and sensors, an in-line Car-Body Measuring(CBM) system which ensured high flexiblity and sufficient accuracy was developed. This CBM cell operates in real production line and measures the check points by the non-contact type using camera and laser displacement sensor(LDS). This system can handle about 15 Measuring points within a cycle time of 40 seconds. A process computer controls whole process such as data acquisition file handling and data analysis. Robot arms changes in length due to ambient temperature fluctuation affecting the measuring accuracy. To compensate this error, a robot arm calibration process was developed.

Electrochemical Characteristics of Electrolyte Membrane for Hydrogen Production in High Temperature Electrolysis (고온 수증기 전해 수소제조를 위한 전해질 막의 전기화학적 특성 고찰)

  • Choi Ho-Sang;Son Hyo-Seok;Sim Kyu-Sung;Hwang Gab-Jin
    • Membrane Journal
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    • v.15 no.4
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    • pp.349-354
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    • 2005
  • YSZ (yttria-stabilized zirconia) determined with an electrolyte that analyzed thermal stability along sintering condition and an electric characteristic. As sintering temperature increases by SEM, grain grows and it showed that pore decreases relatively. and confirmed effect by grain size. It evaluated that particle internal resistance and electric performance by resistance in an electrolyte and electricity conductivity measurement through ac impedance measurement in temperature of $800\~1000^{\circ}C$ in 2-probe method In order to recognize an electric characteristic. In dry process and wet process, density was each 6.13, 6.25 $g/cm^3$ and the relative density was each 98, 99$\%$ when sintering condition is $1400^{\circ}C$.

An Practical Study on the Effect of ERP System Introduction Type on the Enterprise's IT·SW Utilization (ERP 시스템 도입유형이 기업의 IT·SW 활용에 미치는 영향에 관한 실증연구)

  • Yang, Heejung;Sung, Wookjoon
    • Journal of Information Technology Services
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    • v.20 no.2
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    • pp.57-76
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    • 2021
  • Today's ERP system has become a core system of IT·SW that not only supports and manages enterprise resources efficiently, but also encompasses major business tasks. In other words, the ERP system is an essential strategic element for the survival of a company as a powerful means to innovate the management of an organization. This study analyzed the impact on the utilization of IT·SW from the perspective of the entire organization's process without limiting the performance evaluation of the ERP system itself, which is a core system of a company. The measurement data for evaluating the performance of the ERP system was the 2018 domestic company IT·SW utilization survey result report (subject to survey : 3,017 domestic companies with 10 or more employees). Based on this data, this study analyzed the impact of the ERP system on the entire enterprise's IT·SW utilization. In particular, attention was paid to whether there would be a difference in the use of IT·SW if the type of ERP system introduction was changed through the improvement of the business process of the company. Multiple regression analysis was performed using the statistical package SPSS 25. As a result, among the ERP system introduction types, the greatest degree of (+)influence on the company's IT·SW utilization is when the ERP package SW or ASP service is used as it is. Although the difference is insignificant, the second case was to build an ERP system through self-development or outsourcing, followed by customizing the package SW or system through self-development or outsourcing. Through the results of this study, it is expected that the organization will improve the business process and use the standard ERP package SW as it is without modification, thereby effectively enhancing the use of IT·SW of the company and leading to management performance.

Analysis of the trueness and precision of complete denture bases manufactured using digital and analog technologies

  • Leonardo Ciocca;Mattia Maltauro;Valerio Cimini;Lorenzo Breschi;Angela Montanari;Laura Anderlucci;Roberto Meneghello
    • The Journal of Advanced Prosthodontics
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    • v.15 no.1
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    • pp.22-32
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    • 2023
  • PURPOSE. Digital technology has enabled improvements in the fitting accuracy of denture bases via milling techniques. The aim of this study was to evaluate the trueness and precision of digital and analog techniques for manufacturing complete dentures (CDs). MATERIALS AND METHODS. Sixty identical CDs were manufactured using different production protocols. Digital and analog technologies were compared using the reference geometric approach, and the Δ-error values of eight areas of interest (AOI) were calculated. For each AOI, a precise number of measurement points was selected according to sensitivity analyses to compare the Δ-error of trueness and precision between the original model and manufactured prosthesis. Three types of statistical analysis were performed: to calculate the intergroup cumulative difference among the three protocols, the intergroup among the AOIs, and the intragroup difference among AOIs. RESULTS. There was a statistically significant difference between the dentures made using the oversize process and injection molding process (P < .001), but no significant difference between the other two manufacturing methods (P = .1227). There was also a statistically significant difference between the dentures made using the monolithic process and the other two processes for all AOIs (P = .0061), but there was no significant difference between the other two processes (P = 1). Within each group, significant differences among the AOIs were observed. CONCLUSION. The monolithic process yielded better results, in terms of accuracy (trueness and precision), than the other groups, although all three processes led to dentures with Δ-error values well within the clinical tolerance limit.

The Effect of Mobilization Combined with Shoulder Active Contraction of Depth between the Coracoid Process and Humeral Head (어깨의 능동 수축을 동반한 관절가동술이 부리돌기와 위팔뼈 머리 사이의 거리에 미치는 영향)

  • Sun-min Kim;Sang-hun Jang
    • The Journal of Korean Academy of Orthopedic Manual Physical Therapy
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    • v.29 no.2
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    • pp.69-75
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    • 2023
  • Purpose: This study examined the distance between the coracoid process and the humeral head using an ultrasonography device when shoulder active contraction were applied according to the guided direction in the end range of shoulder mobilization. This study aims to provide essential data on treating shoulder disease patients. Methods: The subjects of this study were 20 adults with healthy shoulder joints. ultrasonography (US) equipment was used to examine shoulder joint mobilization under two conditions: (1) anteroposterior (AP) joint mobilization and (2) superoinferior (SI) joint mobilization. Shoulder active contraction was assessed in the end range. The distance between the coracoid process and the humeral head was measured. A linear probe was used for US; the frequency was set to 7.5MHz, and the US image display method was set to B-mode. The US measurement values were measured in (1) the starting position, (2) the end range position, and (3) the end range position of the shoulder active contraction, and the moving distance was drawn in a straight line through the US image. The distance was determined as the measurement value, and the average values were compared. Reults: The results were as follows: (1) the measured AP Joint mobilization increased by an average of .52cm from the end range of the joint mobilization with shoulder active contraction; (2) the measured SI Joint mobilization increased by an average of .49cm from the end range of the joint. Conclusion: When shoulder mobilization is applied, the distance between the coracoid process and the humeral head increases when muscle contraction occurs through shoulder active contraction in the end range, according to the therapist's guidance. Therefore, shoulder mobilization combined with shoulder active contraction is an effective treatment method for patients with shoulder injuries.

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A Study on Smart Suthentication Process for Non-face-to-face Body heat Detector with Smart Authentication (비대면 스마트 인증 발열 감지기를 위한 스마트 인증 프로세스 연구)

  • Kim, Hyung-O;Hong, ChangHo;Lee, Hyo Jae;Kim, Eung-seok
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2021.05a
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    • pp.244-245
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    • 2021
  • Recently, A fever test is essential in a crowded places over the world because of COVID-19. A fever test is also conducted for visitors through a thermometer or a thermal imaging camera In Korea leading world with K-quarantine. However, the current body heat measurement process is divided into the steps of body heat examination and entry register. Therefore, access control person must be deployed at the entrance. In addition, since the accessor directly measures body heat and records personal information, the reliability of the information is low and the risk of personal information leakage is high. Therefore, in this paper, we consider the non-face-to-face smart authentication fever detector and propose a smart authentication process to unify the process for dualized body heat measurement and access recording.

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Measurement of effective cure shrinkage of EMC using dielectric sensor and FBG sensor (유전 센서 및 광섬유 센서를 이용한 EMC 유효 경화 수축 측정)

  • Baek, Jeong-hyeon;Park, Dong-woon;Kim, Hak-sung
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.4
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    • pp.83-87
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    • 2022
  • Recently, as the thickness of the semiconductor package becomes thinner, warpage has become a major issue. Since the warpage is caused by differences in material properties between package components, it is essential to precisely evaluate the material properties of the EMC(Epoxy molding compound), one of the main components, to predict the warpage accurately. Especially, the cure shrinkage of the EMC is generated during the curing process, and among them, the effective cure shrinkage that occurs after the gelation point is a key factor in warpage. In this study, the gelation point of the EMC was defined from the dissipation factor measured using the dielectric sensor during the curing process similar with actual semiconductor package. In addition, DSC (Differential scanning calorimetry) test and rheometer test were conducted to analyze the dielectrometry measurement. As a result, the dielectrometry was verified to be an effective method for monitoring the curing status of the EMC. Simultaneously, the strain transition of the EMC during the curing process was measured using the FBG (Fiber Bragg grating) sensor. From these results, the effective cure shrinkage of the EMC during the curing process was measured.