• Journal of the Korean Society for Precision Engineering
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• v.10 no.2
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• pp.66-75
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• 1993

This paper proposes a monitoring method for nondestructive and in-process measurement of the case depth in LASER surface heat treatment process. The method is essentially an eddy-current method, and measures sensing coil's electrical impedance which varies with the changes of the material microstructure due to hardening. To investigate te validity of the proposed method a series of experiments were performed for various hardning depths. The results show that the relationship between the eddy- current sensor output and the changes in case depth is almost linear. This indicates that the eddy-current measuring method can be used as one of the possible monitoring method for mesauring the hardened depth in LASER heat treatment processes.

• Design & Manufacturing
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• v.15 no.1
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• pp.14-20
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• 2021

The objective of this study is to introduce the new possibility of sensing technology based on inductive displacement sensors to monitor the status of wheel position in the hot forging process. In order to validate effectiveness of proposed sensing technology, the indirect forging force measurement with displacement sensor was applied into a typical closed hot forging die-set used for the manufacturing of flange bolts. The locations to implement the displacement sensor were selected carefully by simulating forming process and static structural. From the measurement results of the forging force change during one hot forging cycle, it was found that the proposed monitoring system can provide useful information to understand the detailed behaviors of die-set in the closed hot forging process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.2
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• pp.321-328
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• 2019

A military shelter for communication and information is necessary to optimize the integrated combat ability of weapon systems in the network centric warfare. Therefore, the military shelter is required for EMI shielding performance. This study examines the stable measurement points for EMI shielding effectiveness of a military shelter for communication and information. The measurement points were found by analyzing the EMI shielding effectiveness measurement data with data mining technique and process capability analysis. First, a support vector machine was used to separate the measurement point that has stable EMI shielding effectiveness according to set condition. Second, this process was conducted with process capability analysis. Finally, the results of data mining technique were compared with those of process capability analysis. As a result, 24 measurement points with stable EMI shielding effectiveness were found.

• The KIPS Transactions:PartD
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• v.15D no.3
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• pp.375-386
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• 2008

Recently, development paradigm of information system is turning into object oriented and component based, and this methodology is leading the software industry. To acclimatize aptly to this trend, users demand the assessment of software expenses to change with the appropriate model of computing costs of the environment, and some people are actually studying the concept of Object Oriented Function Point and UCP method. Especially, Object Oriented Function Point Measurement Process has good points in overcoming the bound of LOC and the existing the Function Point Measurement Process because Object Oriented Function Point Measurement Process is applicable to the early stage of development project mainly with the used cases, and valid to the life long period as the each stage of software products develops, and always understandable to communicate with users by the UML mark rules. Accordingly, this research is to measure Functional Point at ROFP and AOFP in accordance with the development project of information system by the national defense CBD methodology procedures and UML Interrelation Analysis that are recently and widely used in the developmental environment of object oriented information system. Furthermore, this study suggests the measurement method to obtain Functional Point, and identifies service function and object/class function in the correlation analysis of use case and class based on the products and UML modeling via traditional FPA model and object oriented FPA model. Above all, this study is to demonstrate the improvement of traditional Function Point Measurement Process, IFPUG-CPM and software cost basis, and reveal Function Point Measurement Process, which is appropriate to the development of object oriented information system, and suggest the evaluation results of the compatibility through case studies.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2008.04a
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• pp.518-523
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• 2008

In this study, we analyzed applicability of object database, designed the concept model based on object-oriented idea for measurement data management, and applied the design model to object database. The concept model composes three sub models Infrastructure managing information model, Infrastructure measurement data model, and Measurement unit model. The process to expand measurement data of new type was executed easily without changing database schema in object database. The process to expand measurement data of new type was executed easily without changing database schema in object database. Therefore, applicability of new technology to infrastructures for building a safety management network of road bridges could be increased with object database system.

• Journal of Korean Institute of Industrial Engineers
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• v.24 no.2
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• pp.211-221
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• 1998

It is very important to have a satisfactory measurement system, since it is useless to try to improve the manufacturing process without an adequate measurement system. Therefore, evaluation of the measurement system is the first step for the quality improvement of the manufacturing process. To estimate the measurement error we must conduct a controlled gage repeatability and reproducibility(gage R&R) study. Many manufacturers use a gage or instrument to measure multiple dimensions for the overall quality of the manufactured parts. In this case, it is necessary to estimate the gage R&R for multiple dimensions. When a gage measures a large number of dimensions of a part, it is very time-consuming and costly to measure all the dimensions. In this paper we propose the use of the principal component analysis method to identify a few principal components out of the original multivariate measurement capability to explain most of the measurement system variation pattern.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.3
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• pp.61-68
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• 2013

Automatic measurement system is required since cycle time and cost of production are increased by various factors in manual systems. This paper presents a machine vision based prototype measurement system for the automotive axisymmetric shape parts which are generally measured by a manual system that is required the tolerance of the part is very small on each machined surface. This measurement system adopts a method in which optical lens is transferred along the profile of the part to minimize measurement cycle time. The main interest of this paper is a development of an optimum measurement algorithm to the outside diameter of the parts that can be applied to various combinations of hardware. The operating system used to implement the whole system is Window XP and corresponding environment.

• Journal of ILASS-Korea
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• v.6 no.1
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• pp.35-43
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• 2001

Previous studies on image processing techniques for panicle size measurement usually have focused on a single panicle or weakly overlapped particles. In the present work, the image processing algorithm for particle size measurement has been improved to process heavily-overlapped spherical-particle images. The algorithm consists of two steps; detection of boundaries which separate the images of the overlapped panicles from the background and the panicle identification process. For the first step, Sobel operator (using gray-level gradient) and the thinning process was adopted, and compared with the gray-level thresholding method that has been widely adopted. In the second, Hough transform was used. Hough transform is the detection algorithm of parametric curves such as straight lines or circles which can be described by several parameters. To reduce the measurement error, the process of finding the true center was added. The improved algorithm was tested by processing an image frame which contains heavily overlapped spherical panicles. The results showed that both the performances of detecting the overlapped images and separating the panicle from them were improved.