Reliable Measurement Methodology of Wafer Bonding Strength in 3D Integration Process Using Atomic Force Microscopy (삼차원집적공정에서 원자현미경을 활용한 Wafer Bonding Strength 측정 방법의 신뢰성에 관한 연구)
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- Journal of the Microelectronics and Packaging Society
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- v.20 no.2
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- pp.11-15
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- 2013