• Tribology and Lubricants
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• v.29 no.4
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• pp.213-217
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• 2013

As commercial atomic force microscopy (AFM) probes made of Si and $Si_3N_4$ have low stiffness, it is difficult to induce sufficient elastic deformation on the surface of a specimen in a tapping mode. Therefore, high-guality phase contrast images can not obtained. On the other hand, a tungsten AFM probe has relatively higher stiffness than a commercial AFM probe. Accordingly, it is expected to provide an enhanced phase contrast image, which is an effective tool for achieving a better understanding of the micromechanical properties of worn surfaces and wear mechanisms. In this study, on electrochemical etching method was optimized to fabricate tungsten probe tips for an AFM. Electrochemical etching was performed by applying pulse waves with a 20% duty cycle at various voltages instead of only a DC voltage, which has been commonly used.

• Current Optics and Photonics
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• v.4 no.4
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• pp.330-335
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• 2020

We have investigated optimization of the working distance (WD) for a highly miniaturized imaging probe for endoscopic optical coherence tomography (OCT). The WD is the axial distance from the distal end of the imaging probe to its beam focus, which is demanded for dimensional margins of protective structures, operational safety, or full utilization of the axial imaging range of OCT. With an objective lens smaller than a few hundred micrometers in diameter, a micro-optic imaging probe naturally exhibits a very short WD due to the down-scaled optical structure. For a maximized WD careful design is required with the optical aperture of the objective lens optimally filled by the incident beam. The diffraction-involved effect was taken into account in our analysis of the apertured beam. In this study, we developed a simple design formula on the maximum achievable WD based on our diffraction simulation. It was found that the maximum WD is proportional to the aperture size squared. In experiment, we designed and fabricated very compact OCT probes with long WDs. Our 165-㎛-thick fiber-optic probes provided WDs of 3 mm or longer w ith reasonable OCT imaging performance.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.11
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• pp.4121-4128
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• 2010

A probe card is used in testing semiconductor wafers. It must maintain a precise location tolerance for a fine pitch due to highly densified chips. However, high heat transferred from its lower chuck causes thermal deformations of the probe card. Vertical deformation due to the heat will bring contact problems to the pins in the probe card, while horizontal deformation will cause positional inaccuracies. Therefore, probe cards must be designed with proper materials and structures so that the thermal deformations are within allowable tolerances. In this paper, heat transfer analyses under realistic loading conditions are simulated using ANSYS$^{TM}$ finite element analysis program. Thermal deformations are calculated based on steady-state temperature gradients, and an optimal structure of the probe card is proposed by adjusting a set of relevant design parameters so that the deformations are minimized.

• Journal of Electrical Engineering and Technology
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• v.6 no.1
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• pp.111-118
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• 2011

In recent years, various types of partial discharge (PD) methods such as capacitive, inductive, electromagnetic, and acoustic coupling techniques have been developed for diagnosing rotating machines. An electromagnetic (EM) probe, which is an inductively coupled type of sensor, is required for detecting corona and internal discharges during off-line tests. In this study, a new technique for enhancing the measurement sensitivities for corona and internal discharge based on an EM inductive position sensor is proposed. An EM probe that winds wires around horseshoe-shaped and cylindershaped ferrites as helices is designed and optimized for the implementation of off-line PD monitoring of the stator winding of a rotating machine. The measurement system based on this design is implemented, and it is verified from the results of the experiment performed in this study that the probe provides similar performance as existing commercial products.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1479_1480
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• 2009

부분방전시험은 고전압 고정자 권선의 절연상태를 검사, 평가 할 수 있는 중요한 수단이다. 전동기와 발전기에서 일어나는 절연 악화의 징후로써 부분방전이 발생되며 이러한 부분방전 결함의 정확한 위치 확인이 필요하다. 본 논문에서는 회전기 고정자권선의 결함위치를 판정하기위한 Prototype의 코로나 프로브를 설계하고자 Ferrite core를 이용한 Corona Probe를 제작하였으며 모의 결함을 가지는 6.6[kV] 회전기 고정자권선에 적용하여 부분방전펄스를 측정 하였으며 설계된 Probe의 신뢰성을 확인하고자 상용 HFCT센서와 PPM97(Corona Probe)센서를 통하여 검출감도를 비교분석하였다.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.11 s.176
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• pp.173-181
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• 2005

We report on the design and fabrication of an electrostatic 2-axis MEMS stage possessing a platform with a size of $5{times}5mm^2$. The stage, as a key component, would be used in developing probe-based storage devices in the future. It was fabricated by forming numerous $5{\times}5{\mu}m^2$ etching holes in the central platform, as a result, reducing the total number of masks to 1, thereby simplifying the whole fabrication process. Experimental results show that the driving range of the stage was $32{\mu}m$ at the supplied voltage of 20V and the natural frequency was approximately 300Hz. The mechanical coupling between x- and y-motion was also measured and verified to be $25\%$.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.6 no.1
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• pp.3-9
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• 1995

An isotropic electric-field probe, capable of characterizing and quantifying electromagnetic field, was fabricated. The probe consists of three short dipole antennas, a beam-lead Schottky diode and the high resistive transmission line. In order to get the isotropic response three mutually orthogonal dipoles are configured to form the probe. The probe's short dipole elements allow measurements of electric fields from 300MHz to 2GHz with a flatness of .+-. 2.9dB. The mutually orthogonal dipole configration shows a .+-. 1.2dB deviation in the isotropic response with respect to angle.

• Journal of the Optical Society of Korea
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• v.9 no.3
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• pp.107-110
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• 2005

An optical method of measuring hematocrit noninvasively is presented. An LED Light with multiple wavelengths was irradiated on fingernail and transmitted light from the finger was measured to predict hematocrit. A finger probe contained an LED array and detector. Our previous experience showed that prediction accuracy was sensitive to reliability of the finger probe hardware and we optimized the finger probe parameters such as the internal color, detector area and the emission area of a light source based on Design of Experiment. Using the optimized finger probe, we developed a hematocrit monitoring system and tested with 549 persons. For the calibration model with 368 persons, a regression coefficient of 0.74 and a standard deviation of 3.67 and the mean percent error of $8\%$ were obtained. Hematocrits for 181 persons were predicted. We achieved a mean percent error of $8.2\%$ where the regression coefficient was 0.68 and the standard deviation was 3.69.

• The Journal of the Acoustical Society of Korea
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• v.21 no.8
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• pp.766-771
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• 2002

In this study, we have developed a 3-dimensional diagnostic ultrasonic sector probe using a convex type ultrasonic probe with 128 active elements. The probe was made to operate at the center frequency of 4.5㎒ with the bandwidth of 66%. The driving part was designed to rotate the axis of the convex probe by means of a step motor equipped with reduction gears and spur gears attached to the motor so that the probe could enable us to acquire a series of 2-dimensional images to construct a 3-dimensional image. Acoustic cover of the probe was made of polymers to have the same radius of rotation as that of the convex probe. The controllability of the rotation angle and the structural stability of the probe were confirmed through experimental 3-dimensional images obtained using the developed 3-dimensional sector probe.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.4
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• pp.1210-1215
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• 2010

The probe card are test modules which are to classify the good semiconductor chips and thin film before the packaging process. In the rapid growth a technology of semiconductor, the number of pads per unit area is increasing and pad arrays are becoming irregular. Therefore, the technology of probe card needs narrow width and lots of probe tip. In this paper, the probe tip based on the MEMS(Micro Electro Mechanical System)technology was developed a new MEMS probe tip for vertical probe card applications. For the structural designs of probe tip were performed to mechanical characteristics and structural analysis using FEM(Finite Element Method). Also, the contact force of MEMS probe tip compared with FEM results and experimental results. Finally, the MEMS probe card was developed a fine pitch smaller than $50{\mu}m$.