• Title/Summary/Keyword: printed electronics base paper

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Improvement of Paper Smoothness for the Printed Electronics Base Paper (인쇄 전자 용지의 특성 구현을 위한 종이의 평활도 증가에 대한 연구)

  • Kim, Byong-Hyun;Yoo, Hee-Tae;Kang, Young-Ree
    • Journal of the Korean Graphic Arts Communication Society
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    • v.29 no.1
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    • pp.89-99
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    • 2011
  • The making of high leveled smoothness for the printed electronics base paper, wood pulp and sea algal pulp were mixed. If sea algal pulp contents is increased to 9%, the smoothness was moderately increased, and more effective in Softwood mixture than Hardwood, low freeness(high wetness) than high freeness(low wetness).

Improvement of Paper Dimensional Stability for The Printed Electronics Base Paper (인쇄 전자 용지의 특성 구현을 위한 치수 안정성 향상에 대한 연구)

  • Kim, Byong-Hyun;Yoo, Hee-Tae;Kang, Young-Reep
    • Journal of the Korean Graphic Arts Communication Society
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    • v.29 no.1
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    • pp.35-44
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    • 2011
  • For printed electronic paper making which is high leveled dimensional stability. The furnish which is hard wood pulp and soft wood pulp, mixed with hard and soft wood pulp is added sea algae pulp. If sea algae pulp was added 15% contents, paper which is made with hard wood pulp is increased about 28% dimensional stability and soft wood pulp is increased about 32%, dimensional stability and hard wood 30% and soft wood 70% mixed pulp is increased about 40% dimensional stability.

Development of Multi Piezo Ink-Jet Printing System Using Arbitrarily Waveform Generator (임의 전압파형발생기를 이용한 다중 피에조 잉크젯 3D 프린팅 장비 개발)

  • Kim, Jung Su;Kim, Dong Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.32 no.9
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    • pp.781-786
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    • 2015
  • Recently, studies of 3D printing methods have been working in various applications. For example, the powder base method laminates the prints by using a binding or laser sintering method. However, the draw back of this method is that the post process is time consuming and does not allow for parts to be rapidly manufactured. The binding method requires the post process while the time required for the post process is longer than the manufacturing time. This paper proposes a UV curing binding method with an integrated piezo printing head system. The optimization of an arbitrary waveform generation for the control of a UV curable resin droplet was researched, in addition to developed optimized UV curing processes in multi nozzle ink jet heads.

A LATERAL CONTROL ALGORITHM FOE ROLL-TO-ROLL WEB SYSTEM BASED ON BACK-STEPPING APPROACH

  • Choi, Kyung-Huyn;Thanh, Tran Trung;Ko, Jeong-Beom;Kim, Su-Jin;Doh, Yang-Hoi;Kim, Dong-Soo
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1091-1097
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    • 2008
  • Roll-to-roll based manufacturing plays an important role in producing devices at high speed with lower production cost in printed electronics and publishing industry. Web lateral control is one of the most important factors in improving the quality of product and contributes a considerable point in making devices at micrometer-level accuracy. In recent years, most algorithms proposed for web lateral control base on the Shelton‘s model for designing the feedback control system using the PI controller. Experimental results showed that the existing models do not fully describe the characteristics of the lateral dynamics for some typical operating conditions and so result in poor control algorithms. In this paper, a new lateral control algorithm is proposed for web lateral control system based on back-stepping approach. The outcome of this study proves the reliability throughout simulation results in Matlab/Simulink and comparison with the algorithms based on the existing results.

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VIBRATION ANALYSIS OF PCB MANUFACTURING SYSTEM USING MASKLESS EXPOSURE METHOD (Maskless 방식을 이용한 PCB 생산시스템의 진동 해석)

  • Jang, Won-Hyuk;Lee, Jae-Mun;Cho, Myeong-Woo;Kim, Joung-Su;Lee, Chul-Hee
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2009.10a
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    • pp.421-426
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    • 2009
  • This paper presents vibration analysis of maskless exposure module in Printed Circuit Board (PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the Finite Element Analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

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Vibration Analysis of PCB Manufacturing System Using Maskless Exposure Method (Maskless 방식을 이용한 PCB생산시스템의 진동 해석)

  • Jang, Won-Hyuk;Lee, Jae-Mun;Cho, Myeong-Woo;Kim, Joung-Su;Lee, Chul-Hee
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.19 no.12
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    • pp.1322-1328
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    • 2009
  • This paper presents vibration analysis of maskless exposure module in printed circuit board(PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the finite element analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.