• Proceedings of the KSME Conference
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• 2007.05a
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• pp.321-325
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• 2007

Recently, demands on thin multi-layer printed circuit boards(PCB) have been rapidly increased with broad spread of personal portable digital appliances such as multi-media. In case of mobile phone, however, the fact that PCBs have low flexural strength might cause defects. The purpose of this study is to improve the flexural strength by substituting the well-known GFRP(glass fiber reinforced plastic) for CFRP(carbon fiber reinforced plastic). Firstly, finite element simulation was carried out using ABAQUS to find out a unique CFRP layer that has a role to sustain the applied forces mainly in PCB. Secondly, three point bending tests were conducted with the newly designed CFRP PCB model to verify the improvement of the flexural strength. Consequently, it is shown that PCB layered with the CFRP on both outer sides of the board can be used to improve the flexural strength effectively.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.193-197
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• 2001

This study was carried out to recover gold, silver and other valuable metals from the printed circuit boards (PCB) of waste computers. PCB samples were crushed to under 1mm by a shredder and initially separated into 30% conducting and 70% non-conducting materials by an electrostatic separator. The conducting materials, which contained the valuable metals, were then used as the feed material for magnetic separation where it was found that 42% was magnetic and 58% non- magnetic. The non-magnetic materials contained 0.227mg/g Au and 0.697mg/g Ag. Further leaching of the non-magnetic component using 2.0M sulfuric acid and 0.2M hydrogen peroxide at 85$^{\circ}C$ extracted more than 95% copper, iron, zinc, nickel and aluminium. Au and Ag were not extracted in this solution, however, more than 95% of Au and 100% of Ag were selectively leached with a mixed solvent (0.2M ammonium thiosulfate, 0.02M copper sulfate, 0.4M ammonium hydroxide). Finally, the residues were reacted with a NaCl solution to leach out Pb while sulfuric acid was used to leach out Sn. Recoveries reached 95% and 98% in solution, respectively.

• Proceedings of the Korea Air Pollution Research Association Conference
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• 2005.11a
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• pp.402-402
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• 2005

• Resources Recycling
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• v.30 no.2
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• pp.24-30
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• 2021

Dismantling tests were performed to separate components from waste printed circuit boards (PCBs) using HCl solution with Sn4+. Then, the effects of agitation speed, reaction temperature, initial Sn4+ concentration, and HCl concentration on the dismantling of components were investigated. No significant effect on the dismantling speed was observed upon changing the agitation speed from 100 to 300 rpm. However, the dismantling rate increased with increasing reaction temperature, Sn4+ concentration, and HCl concentration. In the all-component dismantling tests, when the dismantling ratio increased to 100%, no solder was observed on the boards, and the Sn4+ concentration was ~1,500 mg/L. The dismantling ratio of the components from the PCB increased to 100% within 2 h when 1 mol/L HCl solution with 10,000 mg/L Sn4+ was used at an agitation speed and temperature of 200 rpm and 90 ℃, respectively.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.87-88
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• 2007

• Journal of information and communication convergence engineering
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• v.14 no.3
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• pp.184-190
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• 2016

We present experimental demonstrations of electromagnetic bandgap (EBG) structures for the wideband suppression of radiated emissions from a power bus in high-speed printed circuit boards (PCBs). In most of the PCB designs, a parallel plate waveguide (PPW) structure is employed for a power bus. This structure significantly produces the wideband-radiated emissions resulting from parallel plate modes. To suppress the parallel plate modes in the wideband frequency range, the power buses based on the electromagnetic bandgap structure with a defected ground structure (DGS) are presented. DGSs are applied to a metal plane that is connected to a rectangular EBG patch by using a via structure. The use of the DGS increases the characteristic impedance value of a unit cell, thereby substantially improving the suppression bandwidth of the radiated emissions. It is experimentally demonstrated that the DGS-EBG structure significantly mitigates the radiated emissions over the frequency range of 0.5 GHz to 2 GHz as compared to the PPW.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.8
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• pp.76-85
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• 2003

In this paper, a technical method for removing the solder from PCBs has been proposed to simplify the pulverizing process and to get higher quality of materials for recycling of the electronic parts in the Printed Circuit Boards (PCBs). There are several techniques to remove the solder from PCB, such as physical and chemical method, vibration, suction and blowing and so on. Among them, the suction technique turned out the best method by investigation. In the suction method, there are three variables for removing the solder. They are a temperature of the thermal wire, a velocity of moving PCB and a gap between PCB and thermal wire. To find the optimal variables for the system, an experiment has been conducted by a trial and error method. The optimal variables were found $220^{\circ}C$ of temperature, 11.58mm/s of velocity, 10mm of gap (A gap between suction hole and bottom of PCBs is 5mm). The result of the experiment shows that 50% of the solder were removed.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.1
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• pp.35-42
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• 2003

Differential signaling has become a popular choice for high-speed interconnection schemes on Printed Circuit Boards (PCBs), offering superior immunity to external noise. However, conventional differential transmission lines on PCBs have problems, such as crosstalk and radiated emission. To overcome these, we propose a Twisted Differential Line (TDL) structure on a multi-layer PCB. Its improved immunity to crosstalk noise and the reduced radiated emission has been successfully demonstrated by measurement. The proposed structure is proven to transmit 3 Gbps digital signals with a clear eye-pattern. Furthermore, it is subject to much less crosstalk noise and achieves a 13 dB suppression of radiated emission. Index Terms - Twisted Differential Line, Differential Signaling, Crosstalk, Radiated Emission, Transmission Line, Twisted Pair

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.625-628
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• 1999

Recently. high-density printed circuit boards(PCB) become indispensable with the minaturization of components. Nickel is deposited on the copper patterns and followed by the gold deposition for improving connection reliability between the printed circuit boards and electronic components. Conventionally electrodeposition has been applied to metalization of copper patterns. However metalization by this method is not applicable for the isolated fine and concentrated patterns. Therefore, metalization technology of the fine patterns by electroless plating is required in place of electrodeposition. The application of electroless nickel plating for interconnection with solder strongly relies on the solderability and the interactions between nickel and solder. Factors such as phosphorus content of the deposit additive and bath temperature may influence solderability of the electroless nickel deposit. So solderability of electroless nickel/ gold deposits was investigated with substrates plated changing the condition of nickel solution.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.1
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• pp.56-62
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• 2013

The laser cutting process which is flexible and rapid usually provides a better result in cutting of flexible printed circuit boards (FPCB). However, circuit-short by the re-deposition of debris from laser ablation or its heat affect zone (HAZ) on the cutting surfaces can be a problem. A laser cutting process of FPCB in the presence of liquid can minimize these negative effects. The temperature distribution of copper and polymer parts of FPCB was analyzed with numerical simulation and the experimental results were presented to evaluate this process. Generally, laser cutting under liquid has advantages of less re-deposition of carbides and less HAZ on the cutting edges. However, bubble generation and laser beam control through the liquid media should be considered carefully to obtain a successful result.