• 제목/요약/키워드: printed circuit boards(PCBs)

검색결과 65건 처리시간 0.03초

A Study on the Deposit Uniformity and Profile of Cu Electroplated in Miniaturized, Laboratory-Scale Through Mask Plating Cell for Printed Circuit Board (PCBs) Fabrication

  • Cho, Sung Ki;Kim, Jae Jeong
    • Korean Chemical Engineering Research
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    • 제54권1호
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    • pp.108-113
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    • 2016
  • A miniaturized lab-scale Cu plating cell for the metallization of electronic devices was fabricated and its deposit uniformity and profile were investigated. The plating cell was composed of a polypropylene bath, an electrolyte ejection nozzle which is connected to a circulation pump. In deposit uniformity evaluation, thicker deposit was found on the bottom and sides of substrate, indicating the spatial variation of deposit thickness was governed by the tertiary current distribution which is related to $Cu^{2+}$ transport. The surface morphology of Cu deposit inside photo-resist pattern was controlled by organic additives in the electrolyte as it led to the flatter top surface compared to convex surface which was observed in the deposit grown without organic additives.

금형보정을 이용한 PCB 품질향상에 관한 실험 (A Test on Quality Improvement of Printed Circuit Board Using Mold Compensation)

  • 전영호;권이장
    • 품질경영학회지
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    • 제25권1호
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    • pp.135-141
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    • 1997
  • The Copper-Clad Laminate (CCL) is a main electronic component of specialtype printed circuit boards (PCBs) such as Silver Through Hole PCB. This CCL should have high reliability under the aging test, and usually the test is done at a higher temperature (110-$150^{\circ}C$) than the normal. Then, this test condition of high temperature may cause such quality problems as hole eccentricity and reduction of distance between part holes. After measuring the CCL shrinkage affected by temperature, the correction factor of a press mold was a, pp.ied to solve these problems. The results showed that the tolerance of hole pitch(${\pm}$$100{\mu}m$) was satisfactory and the internal and external failure costs were reduced by 55%.

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RAM용 경질다층 PCB의 신뢰성 평가기준 (Reliability Assessment Criteria of Rigid Multi-layer PCB for RAM)

  • 홍원식;송병석;백재욱;정해성
    • 한국신뢰성학회지:신뢰성응용연구
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    • 제9권3호
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    • pp.259-274
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    • 2009
  • Printed circuit boards for RAM are widely used in modern electronics such as computers, artificial satellites and consumer durables. They are exposed to a very diverse environment and consists of many complicated components and therefore needs careful approach to the enhancement and assessment of reliability of the item. In this article reliability standards for PCBs for RAM are established in terms of quality certification tests and failure rate tests.

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LED조명에서 MPCB와 FPCB의 방열 성능 비교 연구 (Comparisons of the Heat Dissipation Performances of MPCB and FPCB in LED Lights)

  • 신상묵;문덕영;유경선;현동훈
    • 한국생산제조학회지
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    • 제26권4호
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    • pp.371-377
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    • 2017
  • In this study, the heat dissipation performances of metal printed circuit boards (MPCBs) and flexible printed circuit boards (FPCBs) used in light-emitting diode (LED) lights were compared and analyzed by performing a heat dissipation simulation using a thermal flow analysis program. The results were summarized graphically. The temperature distribution of the MPCB was found to be better than that of the FPCB, indicating the better heat dissipation performance of the MPCB. For the two FPCB structures studied, we confirmed the LED temperature and temperature distribution by thermal flow analysis and found that for better overall heat dissipation performance, PCBs should preferably have an asymmetric structure. We confirmed the possibility of using FPCBs, which are characterized by a flexible structure, for LED lighting.

차량 전장부품 손상으로 인한 차량화재 사고사례 분석 (Analysis on the Fire Accident of Vehicle Due to Damage of the Vehicle's Electrical Components)

  • 박남규;김진표;남정우;사승훈;송재용
    • 한국안전학회지
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    • 제30권4호
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    • pp.32-38
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    • 2015
  • In this paper, we analyzed the vehicle fire accidents due to damage of vehicle's electrical components, which is applied to a vehicle. In recent development of electrical components technology, approximately 40% of vehicle manufacturing parts have applied electronic circuit technology. Phenomenon such deterioration of insulating performance or electric breakdown on the vehicle's electrical components and printed circuit boards(PCBs) resulted from moisture, contamination and aging due to repetitive operations, lead to the vehicle fire. Therefore, the application of electrical components with adequate electric capacity for vehicle and usage of molding techniques using a non-combustible materials to shut off the oxygen should be applied in order to prevent vehicle fire due to damage of the electrical components and PCBs.

전기시스템의 절전모드에 적용되는 PCB의 오작동 원인 개선에 관한 연구 (Study on the Causes of Malfunctions of PCBs Applied to the Power Saving Mode of Electrical Systems and its Solution)

  • 박형기;최충석
    • 한국안전학회지
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    • 제28권3호
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    • pp.51-55
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    • 2013
  • The purpose of this study is to find the causes of malfunctions and defective operation of printed circuit boards(PCBs) built into home refrigerators to perform power saving functions. This study performed an electrostatic test of a PCB built-in using an Auto Triggering system; lightning and impulse tests using an LSS-15AX; and an impulse test using an INS-400AX. From the analysis of a secondarily developed product, it was found that electrostatic discharge(ESD) caused more malfunctions and defective operations than electric overstress(EOS) due to overvoltage. As a result of increasing the condenser capacity of the PCB circuit, withstanding voltage was increased to 7.4 kV. In addition, this study changed the power saving mode and connected a varistor to the #2 pin of an IC chip. As a result, the system consisting of all specimens of a finally developed product was operated stably with an applied voltage of less than 10 kV. This study found it necessary to perform quality control at the manufacturing stage in order to reduce the occurrence of electrostatic accidents to IC chips built into a PCB.

Line scan camera를 이용한 검사 시스템에서의 새로운 영상 처리 알고리즘 (Development of improved image processing algorithms for an automated inspection system using line scan cameras)

  • 장동식;이만희;부창완
    • 제어로봇시스템학회논문지
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    • 제3권4호
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    • pp.406-414
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    • 1997
  • A real-time inspection system is developed using line scan cameras. Several improved algorithms are proposed for real-time detection of defects in this automated inspection system. The major improved algorithms include the preprocessing, the threshold decision, and the clustering algorithms. The preprocessing algorithms are for exact binarization and the threshold decision algorithm is for fast detection of defects in 1-D binary images. The clustering algorithm is also developed for fast classifying of the defects. The system is applied to PCBs(Printed Circuit Boards) inspection. The typical defects in PCBs are pits, dent, wrinkle, scratch, and black spots. The results show that most defects are detected and classified successfully.

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폐프린터 기판 재활용을 위한 물리적 전처리 및 침출 (Physical Separation and Leaching for Waste Printer PCBs Recycling)

  • 정진기;이재천;김민석;김은영;김상배
    • 한국자원리싸이클링학회:학술대회논문집
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    • 한국자원리싸이클링학회 2005년도 추계정기총회 및 제26회 학술발표대회 고분자리싸이클링기술 특별심포지엄
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    • pp.304-307
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    • 2005
  • Printed circuit boards (PCBs) of the printer are composed of various organic and inorganic compounds as well as metals and alloys. This study was conducted to recover valuable metals from used PCBS by physical separation and leaching. The PCBs was crushed, sieved, classified by zig zag classifier and magnetic constituents were removed by the magnetic separation. The non-magnetic constituents of sizes between 1.2 and 0.6 mm especially containing high quantity of Cu (e.g. 83% on metal base and 31% on total base) were used for the leaching experiment. The effect of the nature and concentration of acids and reaction temperature were investigated. The Cu leaching rate to 98.5% in 2M nitric acid, pulp density 100g/L, $90^{\circ}C$, 300rpm, 1hr leaching.

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고온 밀링 공정을 통한 폐인쇄회로기판으로부터 구리 회수 (Recovery of Copper from Waste Printed Circuit Boards by High-temperature Milling Process)

  • 정우철;임병용;김대근
    • 자원리싸이클링
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    • 제33권4호
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    • pp.22-28
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    • 2024
  • 폐 PCB에는 구리를 포함한 다량의 유가 자원이 포함되어 있으며 이를 회수하기 위한 기술 개발이 꾸준히 이루어지고 있다. 일반적으로 폐 PCB를 재활용하기 위해서는 파쇄 및 분쇄와 같은 물리적 전처리가 필요하다. 그러나 물리적 전처리 과정에서 금속의 손실률이 높고 선별도가 낮아 효율적인 재활용 전처리 공정이 필요하다. 본 연구에서는 폐 PCB에서 효율적인 구리 회수를 위해 열처리와 볼 밀링을 동시에 진행하는 고온밀링공정을 적용하였다. 350 ℃에서 밀링 시간과 밀링 속도, 볼의 무게를 변수로 두어 실험을 수행하였으며 볼의 무게 500 g, 밀링 속도 70 RPM, 볼 밀링 시간 5시간 조건에서 90% 이상의 구리 회수율을 보였다. 회수된 구리의 순도는 약 93%이며, 고온 밀링공정 후 회수된 구리를 후공정을 통해 고순도의 구리로 재소재화 가능성을 확인하였다.

Development of a Virtual Frisch-Grid CZT Detector Based on the Array Structure

  • Kim, Younghak;Lee, Wonho
    • Journal of Radiation Protection and Research
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    • 제45권1호
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    • pp.35-44
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    • 2020
  • Background: Cadmium zinc telluride (CZT) is a promising material because of a high detection efficiency, good energy resolution, and operability at room temperature. However, the cost of CZT dramatically increases as its size increases. In this study, to achieve a large effective volume with relatively low cost, an array structure comprised of individual virtual Frisch-grid CZT detectors was proposed. Materials and Methods: The prototype consisted of 2 × 2 CZTs, a holder, anode and cathode printed circuit boards (PCBs), and an application-specific integrated circuit (ASIC). CZTs were used and the non-contacting shielding electrode method was applied for virtual Frisch-grid effect. An ASIC was used, and the holder and the PCBs were fabricated. In the current system, because the CZTs formed a common cathode, a total of 5 channels were assigned for data processing. Results and Discussion: An experiment using 137Cs at room temperature was conducted for 10 minutes. Energy and timing information was acquired and the depth of interaction was calculated by the timing difference between the signals of both electrodes. Based on obtained three-dimensional position information, the energy correction was carried out, and as a result the energy spectra showed the improvements. In addition, a Compton image was reconstructed using the iterative method. Conclusion: The virtual Frisch-grid CZT detector based on the array structure was developed and the energy spectra and the Compton image were successfully acquired.