• 센서학회지
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• 제9권5호
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• pp.389-395
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• 2000

본 논문에서는 보호용 실리콘 산화층과 Al 층을 이용한 $Al_2O_3$ 예비층의 형성을 제안하였다. 실리콘 기판 위의 보호용 산화막 위에 알루미늄을 증착하고 이를 $800^{\circ}C$에서 열처리함으로써 에피텍시 $Al_2O_3$ 예비층 형성시킬 수 있었다. 그리고 형성된 $Al_2O_3$ 예비층위에 ${\gamma}-Al_2O_3$ 층을 형성하였다. ${\gamma}-Al_2O_3$막 성장시 공정의 초기 상태에서 발생하는 $N_2O$ 가스에 의한 Si 기판의 식각을 $Al_2O_3$ 예비층을 이용함으로써 방지할 수 있었다. $Al_2O_3$ 예비층이 초박막 ${\gamma}-Al_2O_3$의 표면의 형태를 개선하는데 많은 효과가 있었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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• pp.1010-1013
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• 1998

In micromechanical system (MEMS) such as microactuators. thin film has been widely used as structural material. MEMS materials have difference with bulk in terms of mechanical properties. So, we design the advanced test structure for micromechanical properties of MEMS. The designed structure includes the newly developed pre-crack and it is driven by electrostatic force. To measure the fracture toughness, the pre-crack formation in the test structure is developed with conventional etching process. The advanced test structure is fabricated by application of semiconductor technology. After this, we propose analytical methodology to evaluate the fracture toughness and fatigue properties through a prediction of crack behavior from the variations of stiffness and frequency. Additionally, life time of a mirror plane used in DVD(Digital Video Disk) is measured as a function of capacitance and applied voltage under the accelerated conditions. Ultimately, we propose the method to evaluate the micromechanical reliabilities of the MEMS materials using the advanced test structure.

• 반도체디스플레이기술학회지
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• 제16권2호
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• pp.55-60
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• 2017

The supercritical $CO_2$ (sc-$CO_2$) mixture and the sc-$CO_2$-based Photoresist(PR) stripping(SCPS) process were applied to the removal of the post etch/ash PR residue on aluminum patterned wafers and the results were observed by scanning of electron microscope(SEM). In the case of MDII wafers, the carbonized PR was able to be effectively removed without pre-stripping by oxygen plasma ashing by using sc-$CO_2$ mixture containing the optimum formulated additives at the proper pressure and temperature, and the same result was also able to be obtained in the case of HDII wafer. It was found that the efficiency of SCPS of ion implanted wafer improved as the temperature of SCPS was high, so a very large amount of MEA in the sc-$CO_2$ mixture could be reduced if the temperature could be increased at condition that a process permits, and the ion implanted photoresist(IIP) on the wafer was able to be removed completely without pre-treatment of plasma ashing by using the only 1 step SCPS process. By using SCPS process, PR polymers formed on sidewalls of metal conductive layers such as aluminum films, titanium and titanium nitride films by dry etching and ashing processes were removed effectively with the minimization of the corrosion of the metal conductive layers.

• 마이크로전자및패키징학회지
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• 제30권4호
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• pp.98-104
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• 2023

대기 중 구리-구리 플립칩(flip-chip) 접합을 위해 제안된 효율적 공정의 실현 가능성을 평가하고자 구리(Cu) 필라(pillar) 상 다공성 구리층의 형성 및 액상 환원제 투입 후 열압착 접합을 실시하였다. 구리 필라 상 다공성 구리층은 아연(Zn) 도금-합금화 열처리-선택적 아연 에칭(etching)의 3단계 공정으로 제조되었는데, 형성된 다공성 구리층의 두께는 평균 약 2.3 ㎛였다. 본 플립칩 접합은 형성 다공성 구리층에 환원성 용제를 침투시킨 후, 반건조 과정을 거쳐 열압착 소결접합으로 진행하였다. 용제로 인한 구리 산화막의 환원 거동과 함께 추가 산화가 최대한 억제되면서 열압착 동안 다공성 구리층은 약 1.1 ㎛의 두께로 치밀해지며 결국 구리-구리 플립칩 접합이 완수되었다. 그 결과 10 MPa의 가압력 하에서 대기 중 300 ℃에서 5분간 접합 시 약 11.2 MPa의 접합부 전단강도를 확보할 수 있었는데, 이는 약 50% 이하의 필라들만이 접합된 결과로서, 공정 최적화를 통해 모든 필라들의 접합을 유도할 경우 20 MPa 이상의 강도값을 쉽게 얻을 수 있을 것으로 분석되었다.

• 대한소아치과학회지
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• 제28권3호
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• pp.512-521
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• 2001

최근 air-abrasion기술이 새로운 법랑질 표면처리법으로 소개되고 있는데, 이것이 산부식 처리한 것보다 치면열구전색 전처리에 있어 더 나은 결과를 보이는지 연구할 목적으로, 저자들은 표면처리법 및 재료에 따른 미세누출도의 차이를 비교해 보고자 하였다. 9개의 군으로 나눈 시편치아에 산부식(1, 4, 7군), air-abrasion(2, 5, 8군), air-abrasion 후 산부식 (3, 6, 9군) 처리한 후 3종의 치면열구전색재($1\sim3$군 Teethmate-F, $4\sim6$군 Ultraseal XT plus, $7\sim9$군 : DenSeal)로 전색, 중합하여 색소침투도를 관찰하였으며, 각 시편의 전색재를 분리, 주사전자현미경으로 관찰하여 다음과 같은 결과를 얻었다. 1. 표면처리법에 따른 미세누출도는 air-abrasion군, 산부식군, air-abrasion 후 산부식군 순으로 작아졌다(p<0.05). 단, 7군과 9군간의 유의차는 없었다. 2. 미세누출도는 산부식군에서 7군 4군 1군 air-abrasion군에서 8군 5군 2군, air-abrasion후 산부식군에서 9군, 3군, 6군 순으로 작아졌으나, 각각 4군과 7군, 2군과 5군, 3군과 6군간의 유의차는 없었다. 3. SEM상에서, 산부식군은 비교적 긴 레진돌기가 규칙적으로, air-abrasion군은 짧은 레진돌기가 불규칙적으로, air-abrasion 후 산부식군에서는 이들이 혼재되어 있는 모습으로 관찰되었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.223-223
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• 2012

Surface engineering plays a significant role in fabricating highly functionalized materials applicable to industrial and biomedical fields. Surface wrinkles and folds formed by ion beam or plasma treatment are buckling-induced patterns and controlled formation of those patterns has recently gained considerable attention as a way of creating well-defined surface topographies for a wide range of applications. Surface wrinkles and folds can be observed when a stiff thin layer attached to a compliant substrate undergoes compression and plasma treatment is one of the techniques that can form stiff thin layers on compliant polymeric substrates, such as poly (dimethylsiloxane) (PDMS). Here, we report two effective methods using plasma modification techniques for controlling the formation of surface wrinkles and folds on flat or patterned PDMS substrates. First, we show a method of creating wrinkled diamond-like carbon (DLC) film on grooved PDMS substrates. Grooved PDMS substrates fabricated by a molding method using a grooved master prepared by photolithography and a dry etching process were treated with argon plasma and subsequently coated with DLC film, which resulted in the formation of wrinkled DLC film aligning perpendicular to the steps of the pre-patterned ridges. The wavelength and the amplitude of the wrinkled DLC film exhibited variation in the submicron- to micron-scale range according to the duration of argon plasma pre-treatment. Second, we present a method for controlled formation of folds on flat PDMS substrates treated with oxygen plasma under large compressive strains. Flat PDMS substrates were strained uniaxially and then treated with oxygen plasma, resulting in the formation of surface wrinkles at smaller strain levels, which evolved into surface folds at larger strain levels. Our results demonstrate that we can control the formation and evolution of surface folds simply by controlling the pre-strain applied to the substrates and/or the duration of oxygen plasma treatment.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2002년도 학술대회논문집
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• pp.207-211
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• 2002

Anodizing film was prepared by anodic oxidation of pure aluminum(purity > 99.50) using DC power supply for constant current mode in an electrolytic solution of surface of sulfuric acid. Effects of pre-treatment process such as chemical polishing, acid cleaning, alkali etching before anodic oxidation, were studied to microstructures and surface morphologies. A roughness on surface of anodizing film had to be decreased for amorphous phase by anodic oxidation. A roughness on surface of anodizing film decrease as annealing temperature increased in chemical polishing.

• 한국광학회:학술대회논문집
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• 한국광학회 1991년도 제6회 파동 및 레이저 학술발표회 Prodeedings of 6th Conference on Waves and Lasers
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• pp.190-193
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• 1991

The monolithically integrated receiver OEIC using InGaAs/InP PIN PD, junction FET's and bias resistor has been fabricated on semi-insulating InP substrate. The fabrication process is highly compatible between PD and self-aligned JFET, and reduction in gate length is achieved using an anisotropic selective etching and a non-planar OMVPE process. The PIN photodetector with a 80 ${\mu}{\textrm}{m}$ diameter exhibits current of less than 5 nA and a capacitance of about 0.35 pF at -5 V bias voltage. An extrinsic transconductance and a gate-source capacitance of the JFET with 4 ${\mu}{\textrm}{m}$ gate length (gate width = 150 ${\mu}{\textrm}{m}$) are typically 45 mS/mm and 0.67 pF at 0 V, respectively. A voltage gain of the pre-amplifier is 5.5.

• Restorative Dentistry and Endodontics
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• 제37권4호
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• pp.240-244
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• 2012

Crown reattachment is the most conservative treatment which can be used to restore fractured tooth, presumably with sufficient strength, while maintaining original contour, incisal translucency, and reducing chair time and cost. However, in case of crown fracture with pin-point pulp exposure, we should cautiously minimize the irritation to the pulp and consider pre-treatment pulpal status, choice of pulp capping materials, choice of bonding system and treatment sequence during crown reattachment procedures. This case reports the considerations while crown reattachment with direct pulp capping using calcium hydroxide (Dycal, Dentsply Caulk).

• 한국산학기술학회논문지
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• 제6권1호
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• pp.24-28
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• 2005

3차원 실리콘 챔버를 갖는 $15.8{\times}15.8 mm^2$크기의 칩을 바이오 센서용으로 마이크로머시닝 기술을 이용하여 개발하였다. 비등방성 식각기술을 이용하여 (100)방향의 p형 실리콘 웨이퍼위에 마이크로 챔버를 형성하였다. 마이크로 챔버를 갖는 웨이퍼와 백금전극이 도포된 Pyrex 유리를 DGF-48S 접착제를 이용하여 접합하였다. 백금전극과 Ag/AgCl 기준전극에 의한 전기화학적 특성을 조사하였다.