• The Journal of the Petrological Society of Korea
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• v.20 no.1
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• pp.23-37
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• 2011

The scaling properties on the length distribution of microcrack populations from Tertiary crystalline tuff are investigated. From the distribution charts showing length range with 15 directional angles and five groups(I~V), a systematic variation appears in the mean length with microcrack orientation. The distribution charts are distinguished by the bilaterally symmetrical pattern to nearly N-S direction. The whole domain of the length-cumulative frequency diagram for microcrack populations can be divided into three sections in terms of phases of the distribution of related curves. Especially, the linear middle section of each diagram of five groups represents a power-law distribution. The frequency ratio of linear middle sections of five groups ranges from 46.6% to 67.8%. Meanwhile, the slope of linear middle section of each group shows the order: group V($N60{\sim}90^{\circ}E$, -2.02) > group IV($N20{\sim}60^{\circ}E$, -1.55) > group I($N60{\sim}90^{\circ}W$, -1.48), group II($N10{\sim}60^{\circ}W$, -1.48) > group III($N10^{\circ}W{\sim}N20^{\circ}E$, -1.06). Five sub-populations(five groups) that closely follow the power-law length distribution show a wide range in exponents( -1.06 - -2.02). These differences in exponent among live groups emphasizes the importance of orientation effect. In addition, breaks in slope in the lower parts of the related curves represent the abrupt development of longer lengths, which is reflected in the decrease in the power-law exponent. Especially, such a distribution pattern can be seen from the diagram with $N10{\sim}20^{\circ}E,\;N10{\sim}20^{\circ}W$ and $N60{\sim}70^{\circ}W$ directional angles. These three directional angles correspond with main directions of faults developed around the study area. The distribution chart showing the individual characteristics of the length-cumulative frequency diagrams for 15 directional angles were made. By arraying above diagrams according to the categories of three groups(A, B and C), the differences in length-frequency distributions among these groups can be easily derived. The distribution chart illustrates the importance of analysing microcrack sets separately. From the related chart, the occurrence frequency of shorter microcracks shows the order: group A > group B > group C. These three types of distribution patterns could reveal important information on the processes occurred during microcrack growth.

• Explosives and Blasting
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• v.9 no.1
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• pp.3-13
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• 1991

The cautious blasting works had been used with emulsion explosion electric M/S delay caps. Drill depth was from 3m to 6m with Crawler Drill ${\phi}70mm$ on the calcalious sand stone (soft -modelate -semi hard Rock). The total numbers of test blast were 88. Scale distance were induced 15.52-60.32. It was applied to propagation Law in blasting vibration as follows. Propagtion Law in Blasting Vibration $V=K(\frac{D}{W^b})^n$ were V : Peak partical velocity(cm/sec) D : Distance between explosion and recording sites(m) W : Maximum charge per delay-period of eight milliseconds or more (kg) K : Ground transmission constant, empirically determind on the Rocks, Explosive and drilling pattern ets. b : Charge exponents n : Reduced exponents where the quantity $\frac{D}{W^b}$ is known as the scale distance. Above equation is worked by the U.S Bureau of Mines to determine peak particle velocity. The propagation Law can be catagorized in three groups. Cubic root Scaling charge per delay Square root Scaling of charge per delay Site-specific Scaling of charge Per delay Plots of peak particle velocity versus distoance were made on log-log coordinates. The data are grouped by test and P.P.V. The linear grouping of the data permits their representation by an equation of the form ; $V=K(\frac{D}{W^{\frac{1}{3}})^{-n}$ The value of K(41 or 124) and n(1.41 or 1.66) were determined for each set of data by the method of least squores. Statistical tests showed that a common slope, n, could be used for all data of a given components. Charge and reduction exponents carried out by multiple regressional analysis. It's divided into under loom over loom distance because the frequency is verified by the distance from blast site. Empirical equation of cautious blasting vibration is as follows. Over 30m ------- under l00m ${\cdots\cdots\cdots}{\;}41(D/sqrt[2]{W})^{-1.41}{\;}{\cdots\cdots\cdots\cdots\cdots}{\;}A$ Over 100m ${\cdots\cdots\cdots\cdots\cdots}{\;}121(D/sqrt[3]{W})^{-1.66}{\;}{\cdots\cdots\cdots\cdots\cdots}{\;}B$ where ; V is peak particle velocity In cm / sec D is distance in m and W, maximLlm charge weight per day in kg K value on the above equation has to be more specified for further understaring about the effect of explosives, Rock strength. And Drilling pattern on the vibration levels, it is necessary to carry out more tests.

• Journal of KIISE:Information Networking
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• v.37 no.3
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• pp.167-174
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• 2010

Recently the distributed topology control algorithm for constructing the Recrystallization Topology in the unstructured peer-to-peer network was proposed. In this paper, we prove that such a hierarchical topology is a scale-free power-law network. We present a model of a construction process of the distributed protocol, and analyze it based on a mean-field approximation and the continuum theory, so that we show that the constructed Recrystallization Topology is a scale-free network. In the proposed model, all nodes are born with some initial attractiveness and the system incorporates the rewiring of some links at every time step. Some old links are removed with the anti-preferential probability, and some new links are added with preferential probability. In other words, according to the distributed algorithm, each node makes connections to the more-preferential nodes having higher hit-ratio than other nodes, while it disconnects the anti-preferential nodes having lesser hit-ratio. This gives a realistic description of the local processes forming the recrystallization topology in unstructured peer-to-peer network. We calculate analytically the degree distribution. The analytic result indicates that the constructed network is a scale-free network, of which the scaling exponent is 3.

• Publications of The Korean Astronomical Society
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• v.13 no.1 s.14
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• pp.135-147
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• 1998

We have simulated the interaction of supernova remnants with constant ambient medium to explore the dynamics of Type Ia supernova remnant. We assumed the supernova ejecta density distribution of the central constant and the outer power-law density distribution$({\rho}{\propto}{\gamma}^{-n})$. We have calculated four different cases with different n. By scaling the length and time scales from the initial parameters-ejecta mass, ejecta energy, the ambient density, we could compare effects of the different density distribution of the ejecta on the dynamics of the SNRs. The radius of the outer forward shock converges the Sedov-Talyor solution at t' = 2.3 when the swept-up mass is 8 times of the ejecta mass. On the other hand, the motion of the reverse shock are largely affected by n. The ejecta with smaller n takes comparably long time to thermalize the whole ejecta at $t'{\simeq}5.3,\;M_{sw}{\simeq}18M_{ej}$. We have applied our calculated results to obtain the ejecta density distributions of Tycho and SN1006 with $n{\simeq}6$.

• Proceedings of the Korean Magnestics Society Conference
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• 2003.06a
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• pp.260-261
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• 2003

It is recognized that the magnetization reverses with a sequence of discrete and jerky jumps, known as the Barkhausen effect. Recently, interest in the Barkhausen effect has grown as it is a good example of dynamical critical behavior, evidenced by experimental observation of a power law distribution of the Barkhausen jump size. So far, most experimental studies have been carried out on bulk samples using a classical inductive technique, which is difficult to apply to thin film samples mainly due to the ]ow signal intensity. For this reason, very few experiments have been done on two-dimensional ferromagnetic thin films. In this talk, we report a direct domain observation of Barkhausen avalanche at criticality in Co and MnAs thin films investigated by means of a magnetooptical microscope magnetometer (MOMM), capable of time-resolved domain observation with an image grabbing rate of 30 frames/s in real time. In Fig. 1, we demonstrate a series of six representative domain-evolution patterns of 25-nm Co film observed successively by means of the MOMM, where one can directly witness Barkhausen avalanche.

• Korea-Australia Rheology Journal
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• v.20 no.3
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• pp.165-173
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• 2008

Multiple particle tracking microrheology is used to characterize the viscoelastic properties of biomaterial and synthetic polymer gels near the liquid-solid transition. Probe particles are dispersed in the gel precursors, and their dynamics are measured as a function of the extent of reaction during gel formation. We interpret the dynamics using the generalized Stokes-Einstein relationship (GSER), using a form of the GSER that emphasizes the relationship between the probe particle mean-squared displacement and the material creep compliance. We show that long-standing concepts in gel bulk rheology are applicable to microrheological data, including time-cure superposition to identify the gel point and critical scaling exponents, and the power-law behavior of incipient network's viscoelastic response. These experiments provide valuable insight into the rheology, structure, and kinetics of gelling materials, and are especially powerful for studying the weak incipient networks of dilute gelators, as well as scarce materials, due to the small sample size requirements and rapid data acquisition.

• Current Applied Physics
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• v.18 no.12
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• pp.1492-1495
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• 2018

This paper studies the influence of temperature on electrical resistivity in ${\alpha}-InAs$ thin films between 30 K-2K based on the analysis of Mott VRH model and ES VRH model. The effect of the interactions between electrons at lower temperature must be considered, therefore, ES VRH conduction will dominate mechanism, and the crossover from Mott to ES VRH conduction is observed about 7 K. Based on available experiment data and VRH conduction model, the parameters of VRH conduction are determined. And the calculated values of $T_C$ are consistent with the experimental results. In addition, $R_M/{\xi}$, ${\Delta}_M/kT$, $R_{ES}/{\xi}$ and ${\Delta}_{ES}/kT$ are satisfied with the validity of Mott and ES models. Furthermore, the temperature dependence of resistivity at low temperature obeys a universal scaling law, which well describes the overall temperature range of VRH conduction. However, the values of $T^{\prime}_M$ from the universal function are two order of magnitudes lower than $T_M$ deduced from fitting experiment.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.1-9
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• 2010

Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.

• Journal of Mechanical Science and Technology
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• v.16 no.6
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• pp.839-850
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• 2002

A performance simulation program for the turboprop engine (PT6A-62), which is the power plant of the first Korean indigenous basic trainer KT-1, was developed for performance prediction, development of an EHMS (Engine Health Monitoring System) and the flight simulator. Characteristics of components including compressors, turbines, power turbines and the constant speed propeller were required for the steady state and transient performance analysis with on and off design point analysis. In most cases, these were substituted for what scaled from similar engine components'characteristics with the scaling law. The developed program was evaluated with the performance data provided by the engine manufacturer and with analysis results of GASTURB program, which is well known for the performance simulation of gas turbines. Performance parameters such as mass flow rate, compressor pressure ratio, fuel flow rate, specific fuel consumption and turbine inlet temperature were discussed to evaluate validity of the developed program at various cases. The first case was the sea level static standard condition and other cases were considered with various altitudes, flight velocities and part loads with the range between idle and 105% rotational speed of the gas generator. In the transient analysis, the Continuity of Mass Flow Method was utilized under the condition that mass stored between components is ignored and the flow compatibility is satisfied, and the Modified Euler Method was used for integration of the surplus torque. The transient performance analysis for various fuel schedules was performed. When the fuel step increase was considered, the overshoot of the turbine inlet temperature occurred. However, in case of ramp increase of the fuel longer than step increase of the fuel, the overshoot of the turbine inlet temperature was effectively reduced.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.11-19
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• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.