• 제목/요약/키워드: power cut

검색결과 673건 처리시간 0.022초

바이쿼드 RC 필터의 자가 발진을 이용한 필터 교정 (Filter Calibration using Self Oscillation of Biquad RC Filter)

  • 안덕기;황인철
    • 전기학회논문지
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    • 제59권5호
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    • pp.1005-1009
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    • 2010
  • This paper presents a digitally-controlled filter calibration technique for biquad RC filter using self oscillation. The biquad RC filter is converted to a fully-differential ring oscillator by changing its resistor connections, where the oscillation frequency reflects the cut-off frequency. The proposed calibration circuit measures the oscillation frequency by counting with a fixed higher-frequency clock and then tunes it to a desired frequency with a digital frequency-locked loop including a PI controller. Because the proposed circuit directly measures the cut-off frequency of the filter itself and calibrates it with the small area digital circuits, the area and the power consumption are much small compared with conventional works. When it is implemented in a 65nm CMOS process, the calibration circuit except the filter consumes the area of 80um X 50um and power consumption is 443uA at 1.2 V supply voltage.

Insulated, Passivated and Adhesively-Promoted Bonding Wire using Al2O3 Nano Coating

  • Soojae Park;Eunmin Cho;Myoungsik Baek;Eulgi Min;Kyujung Choi
    • 마이크로전자및패키징학회지
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    • 제31권2호
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    • pp.1-8
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    • 2024
  • Bonding wires are composed of conductive metals of Au, Ag & Cu with excellent electrical conductivities for transmitting power and signals to wafer chips. Wire metals do not provide electrical insulation, adhesion promoter and corrosion passivation. Adhesion between metal wires is extremely weak, which is responsible for wire cut failures during thermal cycling. Organic coating for electrical insulation does not satisfy bondability and manufacturability, and it is complex to apply very thin organic coating on metal wires. Automotive packages require enhanced reliability of packages under harsh conditions. LED and power packages are susceptible to wire cut failures. Contrary to conventional OCB behaviors, forming gas was not required for free air ball formation for both Ag and Pd-coated Cu wires with Al2O3 passivation.

Comparison of Diagnostic Accuracies of Serum HE-4 Levels and 3D Power Doppler Angiography Parameters between Benign Endometrial Pathologies and Endometrial Cancer

  • Erenel, Hakan;Bese, Tugan;Sal, Veysel;Demirkiran, Fuat;Arvas, Macit
    • Asian Pacific Journal of Cancer Prevention
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    • 제17권5호
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    • pp.2507-2511
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    • 2016
  • Purpose: To study the diagnostic accuracies of serum human epididymis protein 4 (HE-4) levels, virtual organ computer-aided analysis (VOCAL) parameters and endometrial volume in endometrial cancer cases. Materials and Methods: One hundred and seven patients (37 with endometrial cancer and 70 with benign endometrial pathology) were included in this study. VOCAL parameters and serum HE-4 levels were compared between the groups. Results: Area under the curve (AUC) values were 0.702, 0.658, 0.706 for vascularization index (VI), the flow index (FI) and the vascularization flow index (VFI), respectively. A cut off value of 0.568 for VI demonstrated 70% sensitivity, 72% specificity, 56% positive predictive value (PPV) and a81% negative predictive value (NPV). A cut off value of 25.8 for showed a senitivith of 70% and a specificity of 58% with aPPV of 46% and NPV of 78%, and with a cut off value of 0.12 for VFI 70%, 69%, 54% and 81%, respectively. The area under the curve for HE-4 was 0.814. A cut off value of 458 pmol/L was predictive of malignancy with 86% sensitivity and 63% specificity. Conclusions: VOCAL parameters and serum HE-4 levels were statistically significantly higher in the endometrial cancer patients. Serum HE-4 levels provided a greater sensitivity compared to power doppler angiography for predicting malignancy or benign endometrial pathology.

원형 수직구 굴착에 따른 발생 지반침하 분석 (Analysis of ground settlement due to circular shaft excavation)

  • 손무락;이강렬
    • 한국터널지하공간학회 논문집
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    • 제25권2호
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    • pp.87-99
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    • 2023
  • 지반굴착은 필연적으로 인접지반의 지반변위를 유발시키며, 지반변위에 노출된 구조물 및 시설물들은 다양한 피해를 입을 수 있다. 따라서 굴착유발 인접구조물 및 시설물의 손상 및 피해를 최소화하기 위해서는 우선적으로 굴착으로 인해 발생하는 인접지반에서의 지반변위(침하 및 수평변위)를 예측하여야 한다. 흙막이 굴착 유발 지반변위 정보는 상대적으로 많이 존재하지만 원형 형태의 수직구 굴착에 대한 지반변위 정보는 충분치 않다. 본 연구에서는 수직구 굴착에 대한 사례분석 및 흙막이 굴착과의 비교를 통해서 수직구 굴착유발 인접지반 침하예측에 대한 정보를 제공하고자 한다. 본 연구를 통해서 수직구 굴착 시 침하관리 기준으로서 흙막이 굴착의 침하기준을 사용하는 것은 안전성 측면에서 보수적인 접근방법으로 판단되나 경제성 측면을 고려할 때 벽체의 과다설계를 초래할 수 있어 수직구 굴착에 대해 보다 합리적인 침하기준이 필요한 것으로 나타났다.

대면적 태양전지의 분할 수에 따른 모듈 특성 모델링 (Module Characteristic Modeling in Terms of the Number of Divisions of Large-Area Solar Cells )

  • 김주휘;이재형
    • 한국전기전자재료학회논문지
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    • 제36권2호
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    • pp.136-142
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    • 2023
  • In the past, the efficiency of solar cells had been increased in order to increase the efficiency of solar modules. However, in recent years, in order to increase output in the solar industry and market, the competitiveness of solar cells based on large-area solar cells and multi-bus bar has been increasing. Multi-busbar solar module is a technology to reduce power loss by increasing the number and width of the front busbar of the solar cell and reducing the current value delivered by the busbar by half through half-cutting. In the case of the existing M2 (156.75×156.75 mm2) solar cell, even with a half-cut, power loss could be sufficiently reduced, but as the area of the solar cell is enlarged to more than M6 (166×166 mm2), the need for more divisions emerged. This affected not only solar cells but also inverters required for module array configuration. Therefore, in this study, the electrical characteristics of a large-area solar cell and after division were extracted using Griddler simulation. The output characteristics of the module were predicted by applying the solar cell parameters after division to PSPice, and a guideline for the large-area solar module design was presented according to the number of divisions of the large-area solar cell.

금형의 고정도ㆍ고능률 가공기술 (Advanced Machining Technology for Die Manufacturing)

  • 김정석;이득우;정융호;강명창;이기용;김경균;김석원
    • 한국정밀공학회지
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    • 제17권4호
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    • pp.48-68
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    • 2000
  • The high-speed machining technology of difficult-to-cut material is needed to achieve the high-efficiency of die manufacturing. The high-speed machining is applied in automobile, airplane and electricityㆍelectro industry etc, because it can improve machining efficiency and productivity with high speed, high power and high rotation. In this study, high speed machinability, tool wear characteristics and its monitoring, characteristics of damaged layer, machinability of difficult-to-cut material, characteristics of a free curved surface and method of CAD/CAM system were introduced to acquire the shortening of machining time, the improvement of machining efficiency and the high quality of machined surface. Therefore, we establish the stabilization condition of difficult-to-cut material machining and present the optimal cutting condition for high-efficiency cutting.

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Development of Laser Process and System for Stencil Manufacturing

  • Lee, Jae-Hoon;Jeong Suh;Shin, Dong-Sig;Kim, Jeon-O;Lee, Young-Moon
    • International Journal of Precision Engineering and Manufacturing
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    • 제4권1호
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    • pp.23-29
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    • 2003
  • Stencil is used normally as a mask for solder pasting on pad of a printed circuit board (PCB). The objective of this study is to develop a stencil cutting system and determine the optimal conditions to make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse duration on the cut edge quality were investigated. In order to analyze the cut surface characteristics (roughness, kerfwidth, dross) optical microscopy, SEM microscopy and roughness measurements were used. As a result, the optimal conditions of cutting process parameters were determined, and the practical feasibility of the proposed system was also examined by using a commercial Gerber file for PCB stencil manufacturing.

스텐실 제작용 레이저 공정기술 개발 (Development of laser process for stencil manufacturing)

  • 신동식;이영문;이제훈
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1997년도 추계학술대회 논문집
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    • pp.989-992
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    • 1997
  • The objective of this study is to develop stencil cutting process and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width on the cut edge quality were investigated. In order to analyze the cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. A a results, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial gerber file for PCB stencil manufacturing.

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Nd:YAG레이저를 이용한 스텐실 절단공정II -레이저의 공정변수가 스텐실 절단특성에 미치는 영향- (Stencil cutting process by Nd:YAG laser II -Influence of process parameters on cutting characteristics of stencil-)

  • 이제훈;서정;김정오;신동식;이영문
    • 한국레이저가공학회지
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    • 제4권2호
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    • pp.47-57
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    • 2001
  • This study deals with the laser cutting of stencil for the PCB. The most important aim of this study is to determine optimal conditions which make good-qualify stencil in Nd:YAG laser cutting. We made an experiment according to various variables (power. type of mask. gas pressure, cutting speed, and pulse width) and analyzed the cutting characteristics (surface roughness, kerf width. dross) . Each variable has optimal value for good-qualify cut edge under fixed condition. And neural network after learning experimental data with a million time iteration could predict surface roughness of cut edge under arbitrary condition approximately.

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