• 마이크로전자및패키징학회지
• /
• 제17권2호
• /
• pp.11-20
• /
• 2010

The effects of heat treatment on matte pure tin-plated Cu leadframes at high temperature and humidity conditions were investigated. After 1800 hrs of storage at $55^{\circ}C/85%$ RH, approximately 14.5 ${\mu}m$ long striation-shaped whiskers were observed on the surface of the without postbake treatment (WOPB) samples, while no whiskers were found in with postbake treatment (WPB) samples. The preferred orientations of Sn grains in WOPB and WPB sample did not change after the postbake treatment at $125^{\circ}C$ for 1 hr. However, both changed from (112) to (321) and (101), respectively, after 1800 hrs of storage at $55^{\circ}C/85%$ RH. The tensile stress of 8 MPa generated in as-plated sample was changed to a compression stress of 17 MPa after 2 days in room temperature storage. Due to the grain growth during postbake treatment, the WPB samples have more regular grains than the WOPB samples. In the as-plated sample, 0.32 ${\mu}m$ thickness of planar intermetallic compound (IMC) was observed. The IMCs in the WOPB and WPB samples had two distinct layers with large grains of $Cu_6Sn_5$ and with small grains of ${\eta}-Cu_{6.26}Sn_5$.

• 한국광학회지
• /
• 제11권4호
• /
• pp.255-260
• /
• 2000

유기 금속화합물을 출발물질로 이용하는 졸-겔 방법으로 균열이 없는 유기-무기 복합 실리카 박막을 제작하였으며, 코팅방법, 조성비, prebake, postbake 온도 등의 제작조건에 따른 박막의 두께 및 굴절률의 변화를 체계적으로 조사하여 재현성 있는 제작조건을 확립하였다. 특히 광개시제를 첨가하였을 때 자외선 노광량에 따른 광학적 성질변화를 세 가지 광개시제에 대하여 측정, 비교하였다. 또한 졸-겔 박막으로 다중모드 간섭을 이용한 광 파워 분배기를 제작하여 광소자로의 응용 가능성을 살펴보았다.