• 반도체디스플레이기술학회지
• /
• 제16권2호
• /
• pp.55-60
• /
• 2017

The supercritical $CO_2$ (sc-$CO_2$) mixture and the sc-$CO_2$-based Photoresist(PR) stripping(SCPS) process were applied to the removal of the post etch/ash PR residue on aluminum patterned wafers and the results were observed by scanning of electron microscope(SEM). In the case of MDII wafers, the carbonized PR was able to be effectively removed without pre-stripping by oxygen plasma ashing by using sc-$CO_2$ mixture containing the optimum formulated additives at the proper pressure and temperature, and the same result was also able to be obtained in the case of HDII wafer. It was found that the efficiency of SCPS of ion implanted wafer improved as the temperature of SCPS was high, so a very large amount of MEA in the sc-$CO_2$ mixture could be reduced if the temperature could be increased at condition that a process permits, and the ion implanted photoresist(IIP) on the wafer was able to be removed completely without pre-treatment of plasma ashing by using the only 1 step SCPS process. By using SCPS process, PR polymers formed on sidewalls of metal conductive layers such as aluminum films, titanium and titanium nitride films by dry etching and ashing processes were removed effectively with the minimization of the corrosion of the metal conductive layers.

• International Journal of Computer Science & Network Security
• /
• 제22권10호
• /
• pp.37-42
• /
• 2022

Communication as a process of interpreting signs has always existed in people's life. In post-information society, the communication between a person and a technological system through the specific sign-attaching process becomes widespread. Moreover, it somehow replaces usual communication between people. One of the means of communication in the digital space are video games. They not only play an important role in communication processes, but also are a special case of sign-creating and interpreting. The purpose of the article is to examine video games as a space of sign-based communication between a person and a game as a specific digital system. With the help of general scientific and hermeneutic methodology, the analysis of video games as a post-information society phenomenon which people communicate to has been conducted. The process of semiosis as attaching special meanings to signs has been traced in both manipulating in-game objects and characters and understanding rules of an in-game world.

• 대한기계학회논문집A
• /
• 제33권10호
• /
• pp.1023-1028
• /
• 2009

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the chemical mechanical cleaning(CMC) is performed various conditions as a cleaning process. The CMC process combined mechanical cleaning by friction between a wafer and a pad and chemical cleaning by CMC solution consists of tetramethyl ammonium hydroxide (TMAH) / benzotriazole (BTA). This paper studies the removal of abrasive on the Cu wafer and the cleaning efficiency of CMC process.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
• /
• pp.176-180
• /
• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 추계학술대회 논문집
• /
• pp.176-180
• /
• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• 한국콘텐츠학회논문지
• /
• 제22권1호
• /
• pp.535-544
• /
• 2022

본 연구에서는 외상을 경험한 성인의 의도적 반추와 외상 후 성장 간의 관계를 확인하고, 삶의 의미가 의도적 반추와 외상 후 성장을 매개하는 모형에서 외상 강도의 조절효과가 있는지 검증하였다. 참여자는 외상 경험이 있는 남녀 성인 318명이었다. 조절된 매개효과는 PROCESS Macro 3.5 모델 7로 분석하였다. 연구 결과, 외상 경험이 있는 성인의 의도적 반추는 외상 강도, 삶의 의미 및 외상 후 성장 모두와 정적 상관이 있었으며, 삶의 의미도 외상 후 성장과 정적 상관이 있었다. 외상 후 성장에 대한 조절된 매개효과 분석에서는 의도적 반추와 외상 강도의 상호작용효과가 유의했으며, 의도된 반추의 조건부 간접효과는 경험한 외상 강도 수준이 높은 집단에서만 유의하였다. 이런 결과는 의도적 반추를 하는 외상 경험이 있는 사람이 삶의 의미 느끼게 되어 성장하게 될 가능성이 크다는 것을 시사하며, 그런 영향은 외상 강도가 강한 경우 발생한다는 것으로 암시한다. 결론적으로 심한 외상을 경험한 사람들에게서 사건에 대한 의도적 반추가 외상 후 성장을 이끌고, 그 과정에서 삶의 의미를 깨닫는 것이 도움이 될 수 있다는 결과를 얻었다.

• The Korean Journal of Physiology and Pharmacology
• /
• 제14권5호
• /
• pp.291-297
• /
• 2010

The sleep homeostatic response significantly affects the state of anesthesia. In addition, sleep recovery may occur during anesthesia, either via a natural sleep-like process to occur or via a direct restorative effect. Little is known about the effects of isoflurane anesthesia on sleep homeostasis. We investigated whether 1) isoflurane anesthesia could provide a sleep-like process, and 2) the depth of anesthesia could differently affect the post-anesthesia sleep response. Nine rats were treated for 2 hours with $ad$ $libitum$ sleep (Control), sleep deprivation (SD), and isoflurane anesthesia with delta-wave- predominant state (ISO-1) or burst suppression pattern-predominant state (ISO-2) with at least a 1-week interval. Electroencephalogram and electromyogram were recorded and sleep-wake architecture was evaluated for 4 hours after each treatment. In the post-treatment period, the duration of transition to slow-wave-sleep decreased but slow wave sleep (SWS) increased in the SD group, but no sleep stages were significantly changed in ISO-1 and ISO-2 groups compared to Control. Different levels of anesthesia did not significantly affect the post-anesthesia sleep responses, but the deep level of anesthesia significantly delayed the latency to sleep compared to Control. The present results indicate that a natural sleep-like process likely occurs during isoflurane anesthesia and that the post-anesthesia sleep response occurs irrespective to the level of anesthesia.

• Journal of Ginseng Research
• /
• 제28권1호
• /
• pp.18-26
• /
• 2004

The effect of Panax ginseng administration in muscle inflammatory process induced after eccentric exercise, that causes myofibrillar disruption, was studied. Changes in lipid peroxidation, inflammation, glycogen levels in muscle and release of myocellular proteins to blood were measured. The analyses were performed immediately after eccentric exercise and over week since this period are necessary for the muscle damage-repair cycle. The ginseng extract (100 mg kg$^{-1}$ ) was orally administered to rats for three months, before the eccentric exercise performance. The results showed the protective role of ginseng against skeletal muscle damage. This effect could be associated with their membrane stabilising capacity since creatine kinase (CK) activity was significantly decreased 96 h post-exercise from 523$\pm$70 to 381$\pm$53 and 120 h post-exercise from 443$\pm$85 to 327$\pm$75 in treated animals. $\beta$-glucuronidase activity, as indicator of inflammation, showed a significant reduction of about 15-25% in soleus, vastus and triceps in these post-exercise times. The lipid peroxidation, measured by malondyaldehyde levels, was significantly decreased in the 24 h post-exercise period in soleus and vastus intermedius muscles and on the recovery period. Finally ginseng administration reduced significantly the decrease of the glycogen levels immediately after exercise and when the regenerative process took place (72-168 h post exercise). Collectively, the results have showed that ginseng did not inhibit the vital inflammatory response process associated with the muscle damage-repair cycle but presumably ameliorate the injury.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2001년도 춘계학술대회논문집C
• /
• pp.621-626
• /
• 2001

Microcellular foaming process was developed at MIT in 1980's to save a quantity of raw materials and improve mechanical properties. There are many process variables in appling microcellular foaming process to the conventional injection molding process. Of all process variables, part dimension control and shrinkage are the most influential on the post molded dimension. The post molding dimensional change of thermoplastic resins is important to tool designers for predicting the specific difference of molded part vs. actual mold cavity. Generally, articles injection molded are smaller in size than the cavity; hence, the term shrinkage factor is used to define the allowance a designer specifies. It is important to consider the factors that influence molded part dimension. According to ASTM Designation: D 955, shrinkage from mold dimensions of molded plastics was measured. In injection molding, the difference between the dimensions of the mold and of the molded article produced therein from a given material may vary according to the design and operation of the mold. In this paper, shrinkage data of molded plastic parts was obtained. It can be an important information for designing optimum mold system in a microcellular foaming injection molding process.

• 한국강구조학회 논문집
• /
• 제12권5호통권48호
• /
• pp.549-558
• /
• 2000

외부 후 긴장 공법은 설계에 수반되는 구조해석이 비교적 명확하여 강교량 구조물뿐만 아니라 건축구조물 등 그 적용 범위가 매우 넓은 보강방법이다. 본 연구에서는 후 긴장 공법에 있어서 긴장력 도입 과정의 강합성보의 거동을 연구하기 위하여 긴장력 증가에 따른 긴장재, 경간 중앙부 하부 플랜지, 정착단 주형 하부 플랜지의 도입 변형율과 긴장재 절곡 각도에 따른 도입 전단력 및 압축력을 실험 및 해석적으로 분석하였다. 또한 긴장력 도입 후 정적 휨 재하 실험을 수행하여 긴장력 도입 정도에 따른 휨 보강 정도를 분석하였으며, 절곡 각도의 변화에 따른 전단보강 및 휨 보강 양상을 연구하였다. 그 결과 외부 후 긴장력 도입에 따른 휨 보강 효과가 매우 높은 것으로 분석되었으며, 긴장재의 절곡 배치에 의해서는 추가적으로 전단보강 효과까지 나타났다.