• 한국정밀공학회지
• /
• 제28권2호
• /
• pp.219-225
• /
• 2011

Silicone resin is recently used as encapsulant for high-power LED module due to its excellent thermal and optical properties. In the present investigation, finite element analysis of cure process was attempted to examine residual stress evolution behavior during silicone resin cure process which is composed of chemical curing and post-cooling. To model chemical curing of silicone, a cure kinetics equation was evaluated based on the measurement by differential scanning calorimeter. The evolutions of elastic modulus and chemical shrinkage during cure process were assumed as a function of the degree of cure to examine their effect on residual stress evolution. Finite element predictions showed how residual stress in cured silicone resin can be affected by elastic modulus and chemical shrinkage behavior. Finite element analysis is supposed to be utilized to select appropriate silicone resin or to design optimum cure process which brings about a minimum residual stress in encapsulant silicone resin.

• The Journal of Advanced Prosthodontics
• /
• 제14권2호
• /
• pp.78-87
• /
• 2022

PURPOSE. This study aimed to compare the effect of different surface treatments and luting agent types on the shear bond strength of two ceramics to commercially pure titanium (Cp Ti). MATERIALS AND METHODS. A total of 160 Cp Ti specimens were divided into 4 subgroups (n = 40) according to surface treatments received (control, 50 ㎛ airborne-particle abrasion, 110 ㎛ airborne-particle abrasion, and tribochemical coating). The cementation surfaces of titanium and all-ceramic specimens were treated with a universal primer. Two cubic all-ceramic discs (lithium disilicate ceramic (LDC) and zirconia-reinforced lithium silicate ceramic (ZLC)) were cemented to titanium using two types of resin-based luting agents: self-cure and dual-cure (n = 10). After cementation, all specimens were subjected to 5000 cycles of thermal aging. A shear bond strength (SBS) test was conducted, and the failure mode was determined using a scanning electron microscope. Data were analyzed using three-way ANOVA, and the Tukey-HSD test was used for post hoc comparisons (P < .05). RESULTS. Significant differences were found among the groups based on surface treatment, resin-based luting agent, and ceramic type (P < .05). Among the surface treatments, 50 ㎛ air-abrasion showed the highest SBS, while the control group showed the lowest. SBS was higher for dual-cure resin-based luting agent than self-cure luting agent. ZLC showed better SBS values than LDC. CONCLUSION. The cementation of ZLC with dual-cure resin-based luting agent showed better bonding effectiveness to commercially pure titanium treated with 50 ㎛ airborne-particle abrasion.

• 한국환경과학회지
• /
• 제10권1호
• /
• pp.73-77
• /
• 2001

This study examined blends of styrene butadiene rubber(SBR) and chloroprene rubber(CR) prepared from an open 2-roll mill following the conventional polymer blend method for a wide range of the blend composition. Rubber vulcanizates were manufactured by hot press and then mechanical properties, heat and ozone resistance of the specimens were examined. Due to the post cure during the aging test, hardness of vulcanizates was increased. It was found that the undesirable characteristics of heat and ozone resistance of pure SBR was significantly improved through the blending of SBR with CR.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제3권3호
• /
• pp.122-131
• /
• 2003

In this study, some characteristics of conductive and non-conductive adhesive inter-connections are derived, based on data from literature and own projects. Assembly of flip chip on flex is taken as a carrier. Potential failure mechanisms of adhesive interconnections reported in literature are reviewed. Some methods that can be used to evaluate the quality of adhesive interconnections and to evaluate their aging behavior are given. Possible finite element simulation approaches are introduced and the required critical materials properties are summarized. Response to temperature and moisture, resistance to reflow soldering and resistance to rapid change in temperature and humidity are elaborated. The effect of post cure during accelerated testing is discussed. This study shows that only a combined approach using finite element simulations, and use of appropriate experimental evaluation methods can result in revealing, understanding and quantifying the complex degradation mechanisms of adhesive interconnections during aging.

• E2M - 전기 전자와 첨단 소재
• /
• 제10권6호
• /
• pp.519-527
• /
• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• 한국추진공학회지
• /
• 제24권6호
• /
• pp.101-107
• /
• 2020

본 논문에서는 HTPB/AP 계열의 추진제의 경화 온도를 변화시키는 Step 경화 방법으로 경화일 단축 연구를 진행하였다. 이 연구는 HTPB/AP 계열의 추진기관 제작 시 생산성 향상(제작기간 단축 및 치구회수율 증대)을 목적으로 한다. 정상 경화 대비 추진제의 기계적 물성을 비교하여 정상 경화 시 60℃ 5일 소요되는 경화일을 Step 경화로 4일(60℃ 1일 / 65℃ 3일)로 설정하였다. 경화일 단축을 적용 시 추진제 노화 특성을 알아보기 위해 Step 경화 후 후경화(Post-cure) 시험을 진행하였다. 이를 통해 기계적 물성 및 열팽창 계수를 측정하여 추진제의 후경화 특성을 분석하였다. 또한, Step 경화 후 가속 노화 시험을 진행하여 12주차 경과 후 인장시험을 수행하였다. 그 결과, Sm(bar)은 8 bar 이상, Em(%)은 40%이상으로 요구되는 우수한 기계적 물성을 가지는 것을 알 수 있었다.

• 한국복합재료학회:학술대회논문집
• /
• 한국복합재료학회 2004년도 추계학술발표대회 논문집
• /
• pp.83-87
• /
• 2004

In this work, the cure cycle of co-cured metal/composite structure was investigated to decrease fabricating thermal residual stresses between the metal and the composite material. DSC (Differential scanning calorimetry) experiment and static lap shear test of co-cured aluminum/composite double lap joint as well as the curvature experiment of co-cured steel/composite strip were performed to investigate the effect of curing cycle on the thermal residual stress of co-cured hybrid structures. From the experiments, it was found that post curing method after abrupt cooling of co-cured aluminum/composite hybrid structure at certain point of degree of cure during curing process could eliminate fabricating the thermal residual stresses.

• Macromolecular Research
• /
• 제11권5호
• /
• pp.297-302
• /
• 2003

The imidization and cure reaction of a thermosetting phenylethynyl-terminated amic acid (LaRC PETI-5) in film form have been monitored as a function of temperature by means of a steady-state fluorescence technique using a front-face illumination method. The variation of the fluorescence emission spectra of LaRC PETI-5 can be divided into four temperature regions; Region I: below 15$0^{\circ}C$, Region II: 150-25$0^{\circ}C$, Region III: 250-35$0^{\circ}C$, and Region IV: above 35$0^{\circ}C$. The fluorescence spectra in Region I are largely influenced by residual N-methyl-2pyrrolidinone in the polymer and also slightly by partial imidization of the polymer. There is a combined effect of imidization and solvent removal on the fluorescence behavior in Region II. The spectra in Regions III and IV are due significantly to the cure reaction of LaRC PETI-5 and to a post-cure effect of the polyimide, respectively. This spectroscopic evidence indicating the transformation of the amic acid imide oligomer into the corresponding polyimide via imidization and cure, agrees well with thermal analysis results obtained previously. The intermediate stage of cure in the range of 250-30$0^{\circ}C$ predominantly influences the change of the fluorescence intensity. The later stage above 30$0^{\circ}C$ significantly influences the position of the spectrum. This fluorescence study also supports the mechanism proposed in earlier work that the crosslinking reaction takes place at the reaction sites in the conjugated polyene and the phenylethynyl end group in the polyimide chain.

• 대한전기학회논문지
• /
• 제37권6호
• /
• pp.406-413
• /
• 1988

This paper is to investigate relationships between tree inception voltage, tree extension or treeing breakdown voltage and physical characteristics changing as parameter of the post-cured conditions of thermo-setting epoxy resin. According to the results in this paper, the optimal tree inception voltage and treeing breakdown voltage of the samples are obtained for the sample post cured for 15 hours at 100 'C. It can be noticed that these results are closely related with the state of interior molecule coupling and three-dimen sional cross-linked of thermo-setting epoxy resin. And tree inception, tree extension and treeing breakdown of the samples are affected significantly on the post-cured conditions and the cooling method after post-cured of thermo-setting epoxy resin. Moreover, the tree extension by ambient temperature are closely related with softening temperature of thermo-setting epoxy resin.

• 영어영문학
• /
• 제57권1호
• /
• pp.107-127
• /
• 2011

Don DeLillo has shown considerable interest in terror, frequently depicting extreme dread of something terrible to happen, in his literary texts. Since more than three thousand innocent people in New York were killed by the 9-11 terrorist attack in 2001, the anticipation about what kind of fiction he would write as a New Yorker was high. DeLillo's novel Falling Man (2007) in fragmentary detail represents the scene of the terrorism from the perspective of Keith Neudecker, a lawyer who escapes the collapsing world trader center. Neudecker's post-traumatic stress disorder in the first chapter is followed by the free-associative portrayal of various impacts of the 9-11 terror on Neudecker's wife Lienne in the second chapter. The random mixture of the first person narratives from such diverse view-point characters as Neudecker's son Justin, relatives and friends, with dialogues and recollections yields a very close picture of the consequences of terrorism. Reading DeLillo's Falling Man in juxtaposition with a Japanese Canadian novel Obasan by Joy Kogawa, reminiscences of the maltreatment of Japanese Canadians during and after the second world war, surfaces the authorial intention of the two novels. They as trauma literature emerge to aim at curing the readers and proposing post-traumatic ethics. Laurie Vickroy's theory of trauma narrative and cure, E. Ann Kaplan's theory of trauma witness narrative and responsibility, and Emmanuel Levinas's theory of trauma memory and ethics offer theoretical grounds for the convincing analysis of the two texts.