• Korean Journal of Materials Research
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• v.8 no.9
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• pp.802-806
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• 1998

polyimide를 입힌 SiO2 wafer상에 증착된 알루미늄 박막의 두께 및 소둔 여부에 따른 hillock의 거동을 atomic force microscopy (AFM)을 이용하여 분석하였다. 증착된 상태의 박막에서 성장 hillock이 관찰되었으며 박막 두께가 증가할수록 hillock의 크기는 증가한 반면 밀도는 감소하였다. 소둔 후 hillock의 평균 크기는 증가하였으나 밀도는 감소하였다. 이러한 hillock 밀도의 감소는 견고한 wafer상에 직접 증착된 알루미늄 박막에서와 다르다. 이는 유연한 polymide 박막에 의한 응력 완화로 응력유기 입계확산이 이루어지지 않아 hillock 이 추가로 형성되지 않은 상태에서 큰 hillock이 성장하면서 작은 hillock을 흡수하기 때문으로 판단된다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.4
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• pp.341-344
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• 2001

We synthesized a photo-crosslinkable polymide (polymide (PI)-chalcone-biphenyl (BP)) based polymer and control of pretilt angle for a nematic liquid crystal (NLC) using two kinds of the photodimerization methods by polarized UV exposure the photopolymer surfaces was studied. Pretilt angle of the NLCs using a conventional photodimerization method could be varied between 0$^{\circ}$ and 3$^{\circ}$, by controlling the condition of UV exposure. Pretilt angle of the NLCs using the conventional photodimerization method was higher than a in-situ photodimerization method.

• Proceedings of the KAIS Fall Conference
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• 2000.04a
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• pp.84-84
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• 2000

• Transactions of the Korean Society of Automotive Engineers
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• v.7 no.9
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• pp.112-118
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• 1999

Shrinkage behavior was investigated to obtain more accurate dimensions of injected molding parts for free and restricted shrinkage conditions. various parameters for metal inserted injection process, such as thickness of resin, holding pressure and time, mo이 temperature and restriction condition of mold, were considered for the analysis of shrinkage phenomena. For numerical analysis, MOLDFLOW software was used to find the deterministic parameters of filling time, temperature, pressure and holding time. Also , experimental shrinkage effects were measured through actual injection molding process and the resin thickness was under controlled as 3 mm , 5 mm, and 7mm for the shapes of plastic gear made of Polymide(PA) and Polyxymethlene(POM). The main parameters of these injection processes were found to be holding pressure, holding time and mold temperature in the case of metal inserted molding.

• Electrical & Electronic Materials
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• v.9 no.8
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• pp.776-782
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• 1996

The electrical properties of vapor deposition polymerized polymide thin films for getting an in-line system with manufacturing process of semiconductor device, have been studied. Polyimide thin films fabricated by vapor deposition polymerization(VDP) method based on PMDA and 4,4'-DDE monomer were confirmed by FT-IR spectra. It is found that the major conduction carriers of thin films are ions, and the hopping length of ions is almost same with monomer length at the temperature over 120.deg. C through the analysis of electrical conduction mechanism. Also, The activation energy is about 0.69 eV at the temperature of >$30^{\circ}C$ - >$150^{\circ}C$ and it is shown that the resistivity at which thin films can be used as an insulating film between layers of semiconductor device, is 3.2*10$^{15}$ .ohm.cm.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2011.04a
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• pp.433-436
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• 2011

The effect of plasma on flow characteristics in subsonic flow in backward-facing step is studied. The velocty of main flows are 0.5 m/s. DBD plasma is using for flow control. Stainless foil and polymide films are used as an electrode and dielectric material. The change of flow characteristics are shown by different of plasma generation region in fluid flow.

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.125-125
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• 2001

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.25-26
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• 2007

• Journal of Advanced Marine Engineering and Technology
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• v.24 no.1
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• pp.67-74
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• 2000

Recently, PTFE-polymide composites are being used self-lubricating parts for industrial field. Thus, this study is mainly concerned with friction and wear properties for the piston ring of non-lubricating air compressor which made of PTFE-polymide composites. The friction and wear test was carried out for the different composition ratio under the atomsphere room temperature and constant load of 7.69N and their friction and wear properties were compared with each other at various sliding speed. notable results are summarized as follows. PTFE 100% showed that friction coefficient was almost same values at 0.94 and 1.88m/s but the value was decreased at 2.83m/s because the friction temperature is higher than low speed. PTFE 80%-PI 20% showed the lowest mean friction coefficient at 2.83m/s. PTFE 20-PI 80% showed the highest friction coefficient at 0.94m/s and the value was decreased at high speed but the value is higher than other materials except PTFE 100 %. PI 100% showed the highest friction coefficient at 0.94 and 1.88m/s becuase adhesive wear mainly occurred that speed. PTFE 100% showed highest specific wear rate on the whole. Specific wear rate of PTFE 80%-PI 20% was almost the same value with PTFE 20%-PI80%. PI 100%showed the lowest value at high sliding speed because the friction surface was thicken and carbonated by high friction temperature.

• Korean Journal of Materials Research
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• v.9 no.1
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• pp.65-72
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• 1999

In order to minimize flexible printed circuit(FPC), which is used in computer, communication, medical facility, aviation space industry, it is required to improve the interfacial adhesion of polymide/epoxy or polyimide/polyimide consists of FPC. In this study, it was considered to improve the adhesion strength of polyimide/epoxy joint by introducing functional group on polyimide film and improving mechanical property of epoxy. Functional group on polyimide film was introduced by changing polyimide film surface to polyamic acid in KOH aqueous solution. The optimum conditions for surface modification were the concentration of 1M KOH and treatment time of 5min. Also, the optimum adhesion strength of polyimide/epoxy joint was obtained using rubber modified epoxy and polyamic acid as a base resin and curing agent of epoxy adhesive, respectively. The degree of surface modification of polyimide film examined with contact angle measurement of FTIR, thus modification of polyimide to polyamic acid was identified. Fracture surface of plymide/epoxy joint was analyzed by scanning electron microscopy, and modified polyamic acid reimidezed to polymide as increasing curing temperature.