• Title/Summary/Keyword: polymer-metal interfaces

검색결과 14건 처리시간 0.019초

Irregular Failures at Metal/polymer Interfaces

  • Lee, Ho-Young
    • 한국표면공학회지
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    • 제36권4호
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    • pp.347-355
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    • 2003
  • Roughening of metal surfaces frequently enhances the adhesion strength of metals to polymers by mechanical interlocking. When a failure occurs at a roughened metal/polymer interface, the failure prone to be cohesive. In a previous work, an adhesion study on a roughened metal (oxidized copper-based leadframe)/polymer (Epoxy Molding Compound, EMC) interface was carried out, and the correlation between adhesion strength and failure path was investigated. In the present work, an attempt to interpret the failure path was made under the assumption that microvoids are formed in the EMC as well as near the roots of the CuO needles during compression-molding process. A simple adhesion model developed from the theory of fiber reinforcement of composite materials was introduced to explain the adhesion behavior of the oxidized copper-based leadframe/EMC interface and failure path. It is believed that this adhesion model can be used to explain the adhesion behavior of other similarly roughened metal/polymer interfaces.

금속-고분자 계면에서의 전하의 거동 (Charge Carrier Behaviour of Metal-Polymer Interface)

  • 윤주호;최용성;안성수;문종대;이경섭
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.373-374
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    • 2008
  • Insulating polymers and their composites have been widely used in various electric apparatus or cables. Recently, the effects of interfaces (metal/insulator or insulator/insulator interfaces) on electrical insulation have attracted much attention. However, interfacial phenomena in actual insulation systems and their physical backgrounds are not well understood yet. In this paper, the behaviour of charge carriers near the metal/polymer interface and its effects on conduction and breakdown phenomena are discussed. The metal/polymer interface strongly affects carrier injection, space charge formation and breakdown phenomena. Based on their experimental results, the physical backgrounds of the interfacial phenomena are explained.

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Enhanced Behaviors of Ionic-Polymer Metal Composite (IPMC) Actuator Coupled with Polymeric Anion-doped Polypyrrole Thin Film

  • Hong, Chan;Nam, Jae-Do;Tak, Yong-Sug
    • 전기화학회지
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    • 제9권4호
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    • pp.137-140
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    • 2006
  • In order to overcome the weak actuation and relaxation problems during the deformation of IPMC actuator, polymeric anion (polystyrenesulfonate)-doped polypyrrole(Ppy(PSS)) was electrodeposited onto IPMC actuator. Electrochemical quartz crystal microbalance study showed that hydrated cations were instilled into Ppy(PSS) film and polymeric-anion dopants introduced during polymerization were not expelled. Ppy(PSS)-coated IPMC actuator formed two electrode/electrolyte interfaces, Pt/nafion and Ppy(PSS)/bulk solution, and additive volume expansion phenomena at interfaces induced the large deformation compensating the relaxation of actuation by back diffusion of water.

이온빔의 공정변수에 따른 Cu/Polyimide 박막의 접착력향상에 관한 연구 (A Study on the Improvement of Adhesion according to the Process Variables of Ion Beam in the Cu/Polyimide Thin Film)

  • 신윤학;김명한;최재하
    • 한국재료학회지
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    • 제15권7호
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    • pp.458-464
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    • 2005
  • In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer surfaces by ion beam irradiation and rf plasma is commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $N_2^+$ ion beam irradiation conditions for pretreatment. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the 90° peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $N_2^+$ ion beam irradiation energy at the fixed metal-layer thickness.

이온빔에 의한 Cu/Polyimide 표면개질에 따른 접착력향상에 관한 연구 (A Study on the Improvement of Adhesion according to the Surface Modification of Cu/Polyimide Films by ion Beam Irradiation)

  • 신윤학;추준식;이승우;정찬회;김명한
    • 한국재료학회지
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    • 제15권1호
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    • pp.42-46
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    • 2005
  • In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer sufaces by ion beam irradiation and rf plasma are commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $Ar^+$ ion beam irradiation pretreatment conditions. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the $90^{\circ}$ peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $Ar^+$ ion beam irradiation energy at the fixed metal-layer thickness.

혼합 하중하에서의 고분자/거친금속 계면의 파손경로 (Failure Paths of Polymer/Roughened Metal Interfaces under Mixed-Mode Loading)

  • 이호영;김성룡
    • 한국재료학회지
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    • 제14권5호
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    • pp.322-327
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    • 2004
  • Copper-based leadframe sheets were oxidized in two kinds of hot alkaline solutions to form brown-oxide or black-oxide layer on the surface. The oxide coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched Brazil-nut (SBN) specimens. The SBN specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under mixed-mode (mode I + mode II) loading conditions. Fracture surfaces were analyzed by various equipment to investigate failure path. The results revealed that the failure paths were strongly dependent on the oxide type. In case of brown oxide, hackle-type failure was observed and failure path lay near the EMC/CuO interface with a little inclining to CuO at all case. On the other hand, in case of black oxide, quite different failure path was observed with respect to the distance from the tip of pre-crack and phase angle. Different failures occurred with oxide type is presumed to be due to the difference in microstructure of the oxides.

인장하중하에서의 고분자/거친금속 계면의 파손에 대한 비교연구 I: 실험결과 (Comparative Study on the Failure of Polymer/Roughened Metal Interfaces under Mode-I Loading I: Experimental Result)

  • 이호영;김성룡
    • 한국재료학회지
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    • 제15권1호
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    • pp.1-5
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    • 2005
  • Copper-based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or black-oxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. Fracture surfaces were analyzed by various equipment to investigate failure path. The present paper deals with the failure path, and the cause of the failure path formation with an adhesion model will be treated in the succeeding paper.

인장하중하에서의 고분자/거친금속 계면의 파손에 대한 비교연구 II: 접착모델 (Comparative Study on the Failure of Polymer/Roughened Metal Interfaces under Mode-I Loading II: Adhesion Model)

  • 이호영;김성룡
    • 한국재료학회지
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    • 제15권1호
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    • pp.6-13
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    • 2005
  • Copper based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or blackoxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. After fracture toughness testing, the fracture surface were analyzed by various equipment to investigate failure path. An adhesion model was suggested to explain the failure path formation. The adhesion model is based on the strengthening mechanism of fiber-reinforced composite. The present paper deals with the introduction of the adhesion model. The explanation of the failure path with the proposed adhesion model was introduced in the companion paper.

Performance Assessment of a Lithium-Polymer Battery for HEV Utilizing Pack-Level Battery Hardware-in-the-Loop-Simulation System

  • Han, Sekyung;Lim, Jawhwan
    • Journal of Electrical Engineering and Technology
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    • 제8권6호
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    • pp.1431-1438
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    • 2013
  • A pack-level battery hardware-in-the-loop simulation (B-HILS) platform is implemented. It consists of dynamic vehicle models using PSAT and multiple control interfaces including real-time 3D driving and GPS mode. In real-time 3D driving mode, user can drive a virtual vehicle using actual drive equipment such as steering wheel and accelerator to generate the cycle profile of the battery. In GPS mode, actual road traffic and terrain effects can be simulated using GPS data while the trajectory is displayed on Google map. In the latter part of the paper, several performance tests of an actual lithium-polymer battery pack are carried out utilizing the developed system. All experiments are conducted as parts of actual development process of a commercial battery pack adopting 2nd generation Prius as a target vehicle model. Through the experiments, the low temperature performance and fuel efficiency of the battery are quantitatively investigated in comparison with the original nickel-metal hydride (NiMH) pack of the Prius.

PAD법으로 제작된 산화코발트-산화주석 복합체의 가스 감응 특성 (Cobalt Oxide-Tin Oxide Composite: Polymer-Assisted Deposition and Gas Sensing Properties)

  • 안세용;이위;장동미;정혁;김도진
    • 한국재료학회지
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    • 제20권11호
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    • pp.611-616
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    • 2010
  • A cobalt oxide - tin oxide nanocomposite based gas sensor on an $SiO_2$ substrate was fabricated. Granular thin film of tin oxide was formed by a rheotaxial growth and thermal oxidation method using dc magnetron sputtering of Sn. Nano particles of cobalt oxide were spin-coated on the tin oxide. The cobalt oxide nanoparticles were synthesized by polymer-assisted deposition method, which is a simple cost-effective versatile synthesis method for various metal oxides. The thickness of the film can be controlled over a wide range of thicknesses. The composite structures thus formed were characterized in terms of morphology and gas sensing properties for reduction gas of $H_2$. The composites showed a highest response of 240% at $250^{\circ}C$ upon exposure to 4% $H_2$. This response is higher than those observed in pure $SnO_2$ (90%) and $Co_3O_4$ (70%) thin films. The improved response with the composite structure may be related to the additional formation of electrically active defects at the interfaces. The composite sensor shows a very fast response and good reproducibility.